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Embedded thumbnail for What is the Draftsman Document?
How to Work with Draftsman
What is the Draftsman Document?

Once your PCB layout is finished it’s time for review. This is where the Draftsman Document and Altium Designer’s Draftsman Editor comes in.

Blog
Buck Converter Simulation in Altium Designer

When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer. 

Embedded thumbnail for Adding Project Modules to a Multi-board Schematic
How to work with Multiboard
Adding Project Modules to a Multi-board Schematic

If you’re using multiple PCBs in your Multi-board design, Altium Designer allows you to add existing projects directly to your schematic with modules. We’ll show you how to quickly and efficiently add these projects to your Multi-board design.

PCIe 6.0 Overview
Blog
Overview of the PCIe 6.0 Standard

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

Embedded thumbnail for Checking for Creepage in High Voltage Designs
How-To's
Checking for Creepage in High Voltage Designs

High voltage devices have leakage currents that propage over the surface of the board. In such devices, it's important to consider not only the standard gap between the two topological elements, but also the shortest possible path between them, taking into account cut-outs and holes. With Altium Designer 20, you can check for creepage using the new creepage distance rule.

Embedded thumbnail for Creating BGA Footprints with the Footprint Wizard
How to create a PCB Footprint
Creating BGA Footprints with the Footprint Wizard

Altium Designer makes it easy to create a BGA footprint using our IPC compliant footprint wizard. We'll show you how easily you can create and modify a BGA footprint using the footprint wizard.

SPI vs. I2C For Memory Access
Blog
SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

On-Demand Webinar
Tips & Tricks: Board Shape Creation

Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.

Blog
Is There an SPI Trace Impedance Requirement?

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

Embedded thumbnail for How to Remove Unused Pad Shapes
How-To's
How to Remove Unused Pad Shapes

Unused pad shapes can cause distortion among other problems so it is best to exclude them from your designs. This video shows how to remove unused pad shapes.

Embedded thumbnail for Stackup Presets and Templates
How to work with Layer Stack Manager
Stackup Presets and Templates

In this video, we will learn how to apply predefined layer stacks to the board, as well as how to save the layer stack file as a template.

The Skin Effect and EM Fields
Blog
The Skin Effect, Current Density, and the Electromagnetic Field

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

Embedded thumbnail for Creating a PCB Footprint Assembly Drawing
How to create a PCB Footprint
Creating a PCB Footprint Assembly Drawing

If you need to create an assembly drawing of your PCB Footprint for your outjob files we can show you how in Altium Designer. We’ll walk through all the different options for your assembly drawing in your Draftsman document, how to create your assembly drawing and assign it designators.

Packaging for your PCBAs
Blog
What You Need for PCB Packaging and Shipping

When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.

Embedded thumbnail for Using the ActiveBOM
How-To's
Using the ActiveBOM

Using the ActiveBOM: The Bill of Materials (BOM) contains a list of all the components with their designators, part numbers, values, and other parameters. An ActiveBOM manages the mapping from the design component (part) to the part that is purchased. This video describes how to use the ActiveBOM document to create an up-to-date list of components needed for your project.

Embedded thumbnail for Using Back Drills in your Stackup
How to work with Layer Stack Manager
Using Back Drills in your Stackup

In this video, we will learn about Back Drilling technology, how to set up back drilling using the layer stack manager, and how to set up the Stub Length sizes for back drilling by specifying applicable nets using the Design Rules Editor.

PCB Output files
Blog
How to Make PCB Gerber Files in Altium Designer Step-by-Step

Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.

Component composition
On-Demand Webinar
Help Ensure The Best Designs With Component Management

There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. Altium Designer® has several tools to help you manage the components in your libraries and designs.

Teardrops on Differential Pairs?
Blog
Should You Place Teardrops on Differential Pairs?

One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.

Embedded thumbnail for How to Customize The Properties Panel
How-To's
How to Customize The Properties Panel

How to Customize The Properties Panel: This video will go over how to customize the look and feel of the properties panel in Altium Designer. By being able to personalize your workspace you can greatly improve your efficiency

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Broken PCB
Blog
The High-Reliability PCBA Design and Test Challenge

High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.

Where to place AC Caps on PCIe Lanes
Blog
AC Coupling Capacitors in PCIe Routing

Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.

Tuning dialog
Blog
Altium Designer 22.7 Update

We are happy to announce that the Altium Designer 22.7 update is now available. Altium Designer 22.7 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

The Positive Impact of Supply Chain Visibility on Design to Cost
Blog
The Positive Impact of Supply Chain Visibility on Design to Cost

Design to cost is a lofty idea that is only perfectly executed when supply and demand for components are in perfect harmony. Unfortunately, the current landscape for component sourcing makes design to cost more of a balancing act rather than an exercise in price reduction. To help designers in their efforts to balance cost, capabilities, and procurement, we created this ebook to help users understand how modern supply chain tools can help in these complex design problems.

Evaluating Stubs on PCIe Lanes
Blog
A Brief Study of Stubs on a PCIe Connector

Stubs are an important topic in high-speed PCB design, and there is a longstanding guideline that stubs should always be removed from all vias on high-speed digital interconnects. While stubs are bad for high-speed lines, they do not always need to be removed. What is more important is to predict the loss profile and frequencies, and to floorplan appropriately to try and prevent such losses.

Surface Layer DFM and Cleanup
Blog
PCB Layout Cleanup Before Manufacturing

Once you finish your placement and routing in your PCB layout, it can be tempting to wrap up the layout and send everything in directly to manufacturing. The reality is that the board may still need some work before it is considered finished. The cleanup you perform at the final stage of PCB layout will help you catch any outstanding errors that can't be programmed into your DRC engine, and it gives you a chance to add any outstanding details to the surface layers.

Low Cost and Professionally Built LED Panel
Blog
Insulated Metal Substrates: Building an LED Panel

In this project we’ll be building a moderate sized LED panel on insulated metal substrate (IMS). This light panel has three different white balance High CRI LED types on it, warm, neutral and cool. By changing the brightness of the different white balances, the light from the panel can be adjusted to match other lighting, making it perfect for film use - but also creating perfect lighting for electronics work. As with all my projects, this LED panel is open source, you can find the Altium project files over on my GitHub released under the permissive MIT License.

DFM For Your Materials
Blog
DFM in PCB Material Selection

Every design should begin with selecting the materials that will appear in the PCB stackup, as well as arranging layers in the stackup to support layout and routing. This section of our PCB manufacturing andc DFM crash course focuses on selecting the right materials for your PCB design. Materials should be selected given the particular design requirements outlined in your specifications.

PCB Layout for an BGA
Blog
How to Start an FPGA PCB Layout For Your Embedded System

FPGAs come in quad or BGA packages that can be difficult to floorplan, especially with the high number of I/Os often implemented in these components. FPGAs offer a lot of advantages in terms of their reconfigurability, but they can require a lot of effort to layout and route without headaches. If you’ve never worked with an FPGA in your PCB layout, we have some guidelines that can help you get started.

2-port VNA on a 3-port Network
Blog
How to Get 3-port S-parameters From a 2-port VNA Measurement

S-parameters are fundamental quantities in signal integrity, and an ability to understand them from measurement or analysis is very important. If you have a 3-port network, like a power divider or circulator, it may appear that you must use a 3-port VNA to measure these S-parameters. It is always acceptable to measure between two ports, but you need to know what exactly it is you are measuring. In this article, we’ll look at the relationship between the true 3-port S-parameters with a 2-port measurement.

Fab and Assembly Crash Course
Blog
A Day in the Life of the PCB Manufacturing Process

Before implementing design for manufacturing, it is important to understand the underlying process behind producing a physical PCB. Regardless of the various technologies present in each facility, a large majority of industry-leading manufacturers follow a specific set of steps to turn your design from a drawing in a CAD application into a physical board. In this article, we'll cover the basics that designers need to know as part of our crash course series on PCB manufacturing.

What Are the Main Skew Sources in a PCB?
Blog
Addressing Skew Sources in High Speed PCBs

If you compile a list of skew sources, you'll see that fiber weave-induced skew is only one entry on a long list of skew sources. We'll look at this list of possible skew sources below, and we'll see how they affect the operation of your PCB. From the list below, we'll see that some of these issues with skew are not simply solved by paying attention to the fiber weave construction in a PCB substrate.

Ground Below SMPS Inductors
Blog
Should Ground Be Placed Below Inductors in Switching Regulators?

We love answering questions from our readers and YouTube viewers, and one of the recent questions we received relates to EMI from switching elements in a switching regulator is "Should a cutout be placed below the inductor in a switching regulator circuit?". Despite the variations in inductors and their magnetic behavior, there are some general principles that can be used to judge the effects of placing ground near inductors in switching regulator circuits. We’ll look at some of these principles in this article

Alternative Pins
Blog
Altium Designer 22.6 Update

We are happy to announce that the Altium Designer 22.6 update is now available. Altium Designer 22.6 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Top 5 Questions Regarding Stack Up
Blog
SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up

This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.

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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

Embedded thumbnail for Working with Design Variants
How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

Embedded thumbnail for Creating Connectivity
How to Work with Multichannel Schematic
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

Embedded thumbnail for Schematic Design Reuse Using Snippets
How to work with Snippets
Schematic Design Reuse Using Snippets

Snippets allow you to easily reuse circuitry across multiple parts of your designs. We’ll show you how create a new snippets the Schematic and how to connect and annotate it so you can easily bring your circuitry directly into your board.

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