News & Updates
Blog
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Overview of the PCIe 6.0 Standard
Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.
Blog
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SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips
One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).
On-Demand Webinar
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Tips & Tricks: Board Shape Creation
Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.
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Is There an SPI Trace Impedance Requirement?
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
Blog
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The Skin Effect, Current Density, and the Electromagnetic Field
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
Blog
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What You Need for PCB Packaging and Shipping
When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.
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How to Make PCB Gerber Files in Altium Designer Step-by-Step
Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. Altium Designer® has several tools to help you manage the components in your libraries and designs.
Blog
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Should You Place Teardrops on Differential Pairs?
One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.
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The High-Reliability PCBA Design and Test Challenge
High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.
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Model-Based Systems Engineering in the Era of Digital Twins: A Paradigm Shift in PCB and Electronics Design
Explore how Model-Based Systems Engineering (MBSE) integrates with digital twins to enhance design accuracy, collaboration, and lifecycle management in modern engineering projects. This approach bridges the gap between physical systems and digital models, enabling real-time simulation and optimization.
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Wire Bonding in Altium Designer
The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.
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Altium Designer 25: Pioneering Collaboration, Product Development, and Advanced Simulation
Altium Designer 25 introduces groundbreaking features for seamless collaboration and precision in PCB design, from PCB CoDesign to advanced simulation and MCAD tools. Discover how AD25 is transforming electronic product development.
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Wire Bonding: Modern Applications, Technology Trends and Cost Considerations
Explore the future of wire bonding, from new applications to cost-saving trends, in this article by Samer Aldhaher. Stay updated on key innovations in this essential connection technology.
Blog
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Maximizing Efficiency: A Deep Dive into Altium 365 Jira Integration Features
Discover how Altium 365’s Jira integration can streamline collaboration and keep projects running smoothly with real-time design updates and task tracking. Perfect for teams seeking efficiency!
Blog
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Optimize PCB Design with Integrated BOM and CAD Systems
Discover how integrating BOM management and CAD systems can streamline your PCB design process in this insightful article. Learn how combining these tools enables smoother collaboration, reduces errors, and improves design efficiency, helping you optimize your workflows from concept to manufacturing.
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The Essential Guide to Through-Hole Resistors
Resistors are fundamental components in electronic circuits, essential for controlling current and voltage. This article explores their basic principles, types, and key applications, helping you understand their crucial role in electronics.
Blog
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Avoiding Costly Delays: Essential Tips for PCB Designers
Efficient PCB design is crucial for avoiding costly delays in product development. This article offers practical tips and best practices for PCB designers to streamline their workflows, minimize errors, and ensure timely project completion.
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Understanding Signal Reflections for High-Speed Design
Signal integrity is the backbone of high-speed digital systems. In this new article by Rafał Stępień, we break down signal reflections and how to optimize your designs with effective impedance matching techniques.
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Mastering EMI Control in PCB Design: Component Placement for EMC
In the second article of the "Mastering EMI Control in PCB Design" series Dario Fresu explores how effective component placement can reduce electromagnetic interference (EMI) in printed circuit boards. He highlights strategies such as board segregation and careful management of high-speed signals and their harmonics to ensure signal integrity and minimize emissions.
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Signal Integrity Principles based on Altium Designer 24
Check out this article where Rafał Stępień dives into the essentials of maintaining signal integrity in high-speed digital systems. Discover key techniques like controlling signal reflections, reducing crosstalk, and designing differential pairs in Altium Designer 24 to ensure reliable and efficient PCB performance.
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Launch of Requirements & Systems Portal in Altium 365
The Requirements & Systems Portal is now live in Altium 365! Engineers can write, manage, and verify requirements within the Altium 365 workspace. You can link your requirements directly to schematics and PCB designs to ensure all engineers are working with the latest data. Request access today!
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Enhancing Signal Integrity in PCB Design: Key Considerations and Strategies
Looking to enhance signal integrity in your PCB designs? Check out our latest article by David Marrakchi, where he shares key strategies and best practices for achieving reliable high-speed designs.
Blog
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Favorite Tools for BOM Review
Check out our article, where Lawrence Romine shares his top tools for conducting efficient Bill of Materials (BOM) reviews in PCB design. It highlights key features in Altium 365, Octopart, and ActiveBOM that help engineers avoid unsourceable components and streamline procurement.
Blog
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Mastering EMI Control in PCB Design: How Signals Propagate in a PCB
As the first article in the "Mastering EMI Control in PCB Design" series from our new asset Dario Fresu, this piece explores signal propagation in PCBs, highlighting the crucial roles of impedance, dielectric materials, and trace geometry in maintaining signal integrity.
Blog
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High-Speed PCB Design: Ensuring Signal Integrity, EMI Mitigation, and Thermal Management
Discover essential strategies for high-speed PCB design, focusing on signal integrity, EMI mitigation, and thermal management. Our latest article provides insights on managing crosstalk, optimizing grounding, and addressing thermal challenges to ensure reliable PCB performance.
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