News & Updates

If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.

Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

Join our insightful webinar on Altium 365 Version Control System (VCS) designed for solo users, where Ari Mahpour will guide you through creating and managing projects on the cloud-based platform.

Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

Learn how proactive component selection helps you avoid supply chain risks, reduce costs, and design more reliably. Our new article outlines key strategies and shows how tools like Altium 365 support smarter part decisions.

Power problems can be hard to spot until it’s too late. See how easy it is to analyze your power nets, check voltage drops, and improve reliability with Power Analyzer by Keysight - all without leaving your design environment.

Signal issues can sneak in early and cost you later. Read our whitepaper to see how Signal Analyzer by Keysight (inside Altium Designer) helps you catch problems fast and design with confidence.

Learn how to enhance part selection by using real-time supply chain data. This article shows how integrating insights like availability and lifecycle status helps you make smarter, risk-aware design choices.

See how the Signal Analyzer by Keysight in Altium Designer lets you run signal integrity checks directly within your design environment. Read our article to learn how to effectively manage impedance, return paths, stackups, and more.

Ensure power and signal integrity with the Keysight Bundle in Altium Designer. Catch issues early, reduce rework, and optimize your PCBs - all within one integrated environment featuring Signal & Power Analyzer.

Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.

Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.

Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.

Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.

Balancing cost, quality, and availability is key when selecting electronic components. This article explores how to make informed choices that meet design goals while managing supply chain and sourcing challenges.

Wire harness failures can lead to significant financial losses, production delays, and safety hazards. This article delves into real-world examples of such failures across industries and illustrates how modern CAD tools can help prevent these costly issues.

Learn how to ensure electronic components meet the demands of harsh environments. This article explores key standards, testing protocols, and design considerations for building resilient systems that perform reliably under extreme conditions.

This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications.

Many electronics teams still rely on documents and spreadsheets for requirements management—leading to gaps, errors, and delays. Alexsander Tamari explores better tools to improve traceability, collaboration, and project outcomes.

Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.