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Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Blog
Agile Teams: From Design Tool to Product Development Platform

Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

Embedded thumbnail for Add Unit-Aware Temperature Coefficient Parameters
New in Altium's Software
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Blog
Complex Engineering Projects Leverage Multiple ECAD/MCAD Formats

This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.

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Blog
Streamlining Component Selection for Long Product Lifecycles

Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.

Blog
Using ECAD Software to Track Part Availability During PCB Design

As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.

Blog
PCB Design Data Management Tips for Multi-Board Projects

In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.

Blog
What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches

From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.

Blog
Requirements Portal Introductory Tutorials

This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.

Blog
Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector

Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.

Blog
How Structural Electronics Enables 3D, Flexible, and Wearable Integration

Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.

Blog
Most Common Causes of PCB Assembly Rework and Scrap

Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.

Blog
Behind the Scenes with AI Embedded Development

Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.

Blog
We're heading to PCB West 2025!

Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.

Blog
Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools

Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.

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Embedded thumbnail for MCAD CoDesigner Quick Start: Autodesk Inventor
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Autodesk Inventor

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaboration between Altium Designer and Autodesk Inventor. 

Embedded thumbnail for Variants in Output Documents
How to work with Variants
Variants in Output Documents

Variants can be used with output files to keep track of all the variations within your design. We’ll show you how to export these files including a Smart PDF, and an outjob file with variants.

Embedded thumbnail for Copper to Edge Clearance
DFM and Fabrication Cost/Time Constraints
Copper to Edge Clearance

It is necessary to maintain edge clearance from your copper in your design. We’ll show you how to maintain it, what exceptions there are to the rule, and how you can ensure its manufacturability.

Embedded thumbnail for Design RF PCB: PCB edge plating
RF PCB Design
Design RF PCB: PCB edge plating

Board edge plating provides additional noise suppression and improves EMC. This video provides some practical tips for creating metalized PCB edges in Altium Designer.

Embedded thumbnail for Using Parameters in Variants
How to work with Variants
Using Parameters in Variants

You can use parameters to change your variants in many ways, such as text and titles. We’ll show you how to alter parameters in the PCB, Schematic, and Draftsman so you can create variants with different parameters.

Embedded thumbnail for How to efficiently use Blankets?
Blankets
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs. 

Embedded thumbnail for Query Language: How to Easily Create Expressions
Query Language
Query Language: How to Easily Create Expressions

In this video the main tools which allow to simplify the process of building a query in Altium Designer will be considered. There are several such tools and each of them has its own limitations and peculiarities of use. 

Embedded thumbnail for What to Consider when Designing Edge Connectors
DFM and Fabrication Cost/Time Constraints
What to Consider when Designing Edge Connectors

If your design requires edge connectors there are a few important things to consider. We’ll walk you through how to make sure your design with edge connectors is easy and manufacturable.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
RF PCB Design
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for Variants in Schematic Editor
How to work with Variants
Variants in Schematic Editor

You can quickly create and edit variants with the schematic Editor in Altium Designer. We’ll show you how to create and edit the variants in the schematic editor by utilizing the parameter variation tool, the edit component variation tool, part actions, toggling fitted or non fitted, and the variant manager.

Relative Length Tuning
What's New in 22.3
Relative Length Tuning

Designing high-speed PCB just got easier. The Length Tuning tools is now even more functionality. Complex tasks can now be solved even faster.

Relative Length Tuning
What's New in 22.3
相对长度调节

高速PCB设计变得更加轻松。Length Tuning工具现在具有更多功能。现在可以更加快速地解决复杂任务。

Enhanced UI for Via Stack Editing
What's New in 22.3
Enhanced UI for Via Stack Editing

The via editing mode is now even more convenient. Information about the via, editing its parameters and connections to polygons are now all in a new and simple, but familiar form.

Enhanced UI for Via Stack Editing
What's New in 22.3
可用于过孔堆栈编辑的增强型UI

过孔编辑模式现在更加便于使用。有关过孔、其参数编辑以及与多边形铺铜连接的信息,现在均将以一种全新、简单但熟悉的形式出现。

Generic Components
What's New in 22.3
Generic Components

The way from idea to real devices has become shorter. The new feature will reduce the time it takes to design a schematic.

Generic Components
What's New in 22.3
通用元件

从产生创意到变为实物所需的路程将越来越短。新功能将有助于缩短进行原理图设计所需的时间。

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