News & Updates

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

Support has been improved so that jumper wires connecting two cavities within the same connector are now properly shown in Layout Drawings, making the connector wiring easier to understand during documentation and review.

Watch our brand-new video where we tackle the persistent issue of outdated PCB design guidelines still found in datasheets and application notes from major semiconductor manufacturers. Drawing on viewer comments, real-world datasheet examples, and insights from industry experts, we examine why recommendations such as splitting analog and digital ground planes (an approach rooted in the 1980s) continue to circulate despite their potential to cause EMC failures, signal integrity problems, and costly redesigns.

The "Update From Libraries" feature has been enhanced to provide broader support for harness-related objects across both Wiring Diagrams and Layout Drawings. With this expansion, a wider range of harness components such as connectors, wires, splices, and associated attributes can now be synchronized directly with their corresponding library definitions.

Discover how to set up flex and rigid-flex PCB materials in Altium with the Layer Stack Manager. In this tutorial, you’ll follow the key steps for defining polyimide cores, adhesive layers, coverlay, and stiffeners helping you build accurate, production-ready rigid-flex PCB designs.

Discover our latest customer success story and see how Benchmark streamlined hardware development using the Altium Platform. By leveraging a unified environment with real-time data, synchronized ECAD-MCAD workflows, and built-in collaboration tools, their engineering teams eliminated manual handoffs, improved cross-domain visibility, and accelerated project delivery while staying perfectly aligned.

Explore our detailed design review of a custom ESP32-S3 PCB. This four-layer board is built around the ESP32-S3 microcontroller chip (not the standard module) and includes an integrated LiPo charging circuit, USB-C with data line protection, NCP voltage regulators, and a ceramic chip antenna with a properly tuned impedance matching network.

See how Benchmark Electronics uses Altium’s collaborative hardware development platform to unify its electrical, mechanical, and software engineering teams. By replacing manual processes, disconnected tools, and siloed workflows with a shared workspace, Benchmark unlocked a new way of working.