News & Updates

High-speed PCBs often require tuning groups of tracks, both single and differential. Altium Designer includes powerful tools that allow you to solve such tasks quickly and with high quality. Study this document and achieve the desired result even faster.

There is one confusion related to impedance matching that comes up again and again, and it appears to be a fundamental confusion between reflection and power delivery. This leads to an apparent contradiction that arises when we try to generalize power delivery to wave reflection, despite the fact that the two were not meant to be related.

Routing is one of the most time-consuming stages of PCB design. Altium Designer has a large set of tools that allow you to do it as accurately and quickly as possible. This document will help you to learn how to manage your routing effectively and use it to its fullest extent.

RF systems operate with specific impedance values across entire interconnects, including on PCBs. Not all RF components are packaged in integrated circuits with defined impedances, so impedance matching circuits and line sections are needed to ensure signal transmission between different sections of an interconnect. One of these impedance matching techniques is the quarter-wave impedance transformer, which can be implemented as a printed trace with specific impedance.

We are happy to announce that the Altium Designer 22.10 update is now available. Altium Designer 22.10 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

A staff member at a PCB manufacturer once explained to me that they thought we were having an issue with a package warping. Unfortunately, component warping can occur both in a PCB and in components. In this article, we'll give an overview of warpage in a PCB, specifically in the circuit board and in the components.

If you're designing a wireless IoT device, and you know how to calculate the link budget, you can reasonably estimate whether your signal will reach its destination and be read by the receiver. To calculate the link budget, the designer needs to know something about all other sources of gain and loss in the system. Once link budget is determined, the designer can judge whether some modification is needed in their RF signal chain. 

SMD components require precisely sized pads for soldering during assembly. The designer is responsible for ensuring pad sizes are correct, either by calculating them and comparing with footprint data, looking through datasheets, or by memorizing SMD pad size standards. If you have a component and you don't have access to the footprint, and you decide to biuld the footprint yourself, what resources are available to ensure you have the correct pad size?

Before we get too deep into this article, I’ll give you the simple answer. You probably can’t fix warping in your PCB after it’s already been fabricated. You can prevent an unwarped board from becoming warped during assembly, but only as long as materials were selected properly and the board is put into reflow correctly. We’ll run over some of these points in this article, and I’ll examine some points that might help you recover a warped board.

The eye diagram is a useful measurement or simulation as part of channel compliance. The measurement shows many different factors that can affect signal behavior simultaneously, ultimately allowing for qualification of errors and losses in a channel. In this article, I’ll run over some of the fundamental measurements that you could manually extract from an eye diagram and how they reveal some strategies for improving channel designs.