News & Updates
High-speed PCBs often require tuning groups of tracks, both single and differential. Altium Designer includes powerful tools that allow you to solve such tasks quickly and with high quality. Study this document and achieve the desired result even faster.
One of the most difficult and frustrating things to arise when traveling to a foreign country is the language barrier. Communicating a simple greeting can sometimes seem like a big hassle. The same thing is true for different CAD tools. When your tools aren’t speaking the same language, you’re going to run into problems. Bridge this gap by building out your component libraries with everything it takes to truly define a component, including 3D models that seamlessly propagate into the PCB editor and beyond.
There is one confusion related to impedance matching that comes up again and again, and it appears to be a fundamental confusion between reflection and power delivery. This leads to an apparent contradiction that arises when we try to generalize power delivery to wave reflection, despite the fact that the two were not meant to be related.
Routing is one of the most time-consuming stages of PCB design. Altium Designer has a large set of tools that allow you to do it as accurately and quickly as possible. This document will help you to learn how to manage your routing effectively and use it to its fullest extent.
RF systems operate with specific impedance values across entire interconnects, including on PCBs. Not all RF components are packaged in integrated circuits with defined impedances, so impedance matching circuits and line sections are needed to ensure signal transmission between different sections of an interconnect. One of these impedance matching techniques is the quarter-wave impedance transformer, which can be implemented as a printed trace with specific impedance.
We are happy to announce that the Altium Designer 22.10 update is now available. Altium Designer 22.10 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
A staff member at a PCB manufacturer once explained to me that they thought we were having an issue with a package warping. Unfortunately, component warping can occur both in a PCB and in components. In this article, we'll give an overview of warpage in a PCB, specifically in the circuit board and in the components.
Working with local libraries seems like a simple solution, but we often don’t take into account the added time spent maintaining libraries and sharing them between team members. There is no good way to avoid duplicate efforts with component creation and no standardization to ensure consistent naming. Worst of all, there is no way to identify the latest component revision, and library files can be easily corrupted or misplaced. This webinar showcases the advantages of component storage in Аltium 365 to resolve the issues of local libraries and component management.
If you're designing a wireless IoT device, and you know how to calculate the link budget, you can reasonably estimate whether your signal will reach its destination and be read by the receiver. To calculate the link budget, the designer needs to know something about all other sources of gain and loss in the system. Once link budget is determined, the designer can judge whether some modification is needed in their RF signal chain.
SMD components require precisely sized pads for soldering during assembly. The designer is responsible for ensuring pad sizes are correct, either by calculating them and comparing with footprint data, looking through datasheets, or by memorizing SMD pad size standards. If you have a component and you don't have access to the footprint, and you decide to biuld the footprint yourself, what resources are available to ensure you have the correct pad size?
Before we get too deep into this article, I’ll give you the simple answer. You probably can’t fix warping in your PCB after it’s already been fabricated. You can prevent an unwarped board from becoming warped during assembly, but only as long as materials were selected properly and the board is put into reflow correctly. We’ll run over some of these points in this article, and I’ll examine some points that might help you recover a warped board.
The eye diagram is a useful measurement or simulation as part of channel compliance. The measurement shows many different factors that can affect signal behavior simultaneously, ultimately allowing for qualification of errors and losses in a channel. In this article, I’ll run over some of the fundamental measurements that you could manually extract from an eye diagram and how they reveal some strategies for improving channel designs.
There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.
Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.
Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.
Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.
As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.
Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.
The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.
Quite often, a standard assembly drawing is not enough to ensure the quality of a PCB assembly, especially when designing high-density boards. It would also be helpful to include additional detailing for simpler devices. The use of a Draftsman document brings an elegant, yet powerful solution to make these tasks easier.
An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.
In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.
You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs
One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.
One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.
A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.
Any project can get very complex, and the PCB design team needs to track revisions throughout a project. Why worry about tracking revisions? In the event you ever receive changes to product functional requirements, major changes are made to your product’s architecture, or you’re ready to finalize the design and prepare for fabrication, it’s best to clone a project at its current state and begin working on a new version. Keeping track of all these design changes in a PCB design project takes the type of hardware version control tools you’ll find in Altium 365™.
To pour or not to pour, to stitch or not to stitch… Over many years, some common “rules of thumb” have become very popular and, ultimately, taken a bit out of context. Rules of thumb are not always wrong, but taking PCB design recommendations out of context helps justify bad design practices, and it can even affect the producibility of your board. Like many aspects of a physical PCB layout, via stitching and copper pour can be like acid: quite useful if implemented properly, but also dangerous if used indiscriminately.