News & Updates
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.
The problems you can experience with components and libraries are endless. These problems are the most significant source of design issues and the biggest reason behind respins, costing companies untold amounts of lost profit annually.
If you want to have a better understanding of how to use Altium 365 to maintain a strong and centralized library that is free of problems and headaches, you may want to consider attending this lecture.
As much as we would like to build every high speed PCB perfectly, with ideal SI/PI/EMI characteristics, it isn’t always possible due to many practical constraints. Sometimes a stackup can be “good enough,” even for a high-speed PCB. This always comes from the need to balance engineering constraints, functional requirements, and the need to ensure signal and power integrity in a high-speed design, and finally to ensure compliance with EMC requirements.
When it's time to release your project to your manufacturer, it's essential to ensure that all the necessary design aspects like assembly, BOM, and documentation are accurately and completely conveyed. Consistency is key to ensuring a successful release. Without clear release documentation, the designer faces increased risks of costly manufacturing response, time-consuming rework, or unintentional defects that can make it into the final product.
Involving the whole team that will bring a product to completion early on in the development cycle is vital to efficient development. Design reviews with all the relevant parties are critical at each step of the design process, starting with high-level component selection, then through the schematic capture and PCB layout stages.
Ergonomics and convenience are important issues when designing a printed circuit board and the device as a whole. A lot of Altium Designer tools are aimed at solving them. These include Countersink and Counterbore holes, which allow the use of various types of screws in the mounting holes of the board.
The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. When filling a project with data, a user creates new files, modifies outdated files that have become irrelevant. Managing project data is a separate task, especially for large developments where several participants with different specializations are involved in the process.
Designing microvias with sintered paste in rigid-flex PCBs offers enhanced electrical conductivity and mechanical strength, crucial for high-density applications. Our new article explores the benefits of sintered paste and provides essential design tips to optimize microvia performance and reliability.
Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.
Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.
High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.
Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.
Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.
We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.
Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.
Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.
High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.
Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.
Curious about the intersection of mechanical and electrical design? Both are crucial in the PCB design process, especially for multi-board systems. Read our latest article to learn how ECAD and MCAD can address significant challenges during PCB preparation.
Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
Automated measurements are no longer tough. With our Mixed Simulation mode, everything is easier. Learn more about this feature based on DC-DC buck converter design in this brand new article.
In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.
Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.