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Blog •
Ebook: Routing High-Density Interconnects with Reliable Microvias

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

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Embedded thumbnail for Creating a BGA Footprint with the Footprint Wizard
How-To's •
Creating a BGA Footprint with the Footprint Wizard

Altium Designer makes it easy to create a BGA footprint using our IPC compliant footprint wizard. We'll show you how easily you can create and modify a BGA footprint using the footprint wizard.

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Blog •
IPC-2221 Calculator for PCB Trace Current and Heating

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

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How-To's •
How to work with Pad Classes on PCB?

Sometimes it is required to set different design rules for a different set of pads on the board. The easiest way is to use pad classes and in this video we'll show you how easy it is to create and apply them.

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How-To's •
How to work with multivariate calculations?

Additional modes for obtaining temperature, parametric dependencies and probabilistic distribution by the Monte Carlo method are performed together with basic calculations and allow expanding the possibilities for analyzing design results.

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How-To's •
How to calculate Transient Analysis?

Transient Analysis simulates the reaction of a circuit over a period of time. It can be supplemented by Fourier Analysis and the use of Initial Conditions.

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How-To's •
BOM Comments

Convenient interaction and coordination of the Active BOM with the help of comments is possible both from the web version of the project and from the Altium Designer between participants of the same and different roles.

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Blog •
Stripline Impedance Calculator

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

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How-To's •
Query Language: What is It For?

A PCB project contains many different objects. How to manage them? How to find the right ones quickly and efficiently? This video starts the series about query language. Learn the language commands and how to use them and expand your possibilities!

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Blog •
Which Types of Opto-Isolators Are Right For Your Signal?

An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?

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Blog •
Properties panel document options in SCH editors

The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.

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Embedded thumbnail for PCB design with BGA: Via-in-Pad
How-To's •
PCB design with BGA: Via-in-Pad

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance.

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How-To's •
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

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Embedded thumbnail for How to work with components on a rigid-flex board in MCAD
How-To's •
How to work with components on a rigid-flex board in MCAD

With MCAD Codesigner you can quickly add and move components from your MCAD tool and update the design automatically in Altium Designer. We’ll show you how to. Add a new component, move components, and change a component’s region in MCAD, and update it to your design in Altium Designer.

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How-To's •
LSM: Impedance profile

Creating Impedance profiles for transmission lines and how to apply them to the board

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High-Speed PCB Stackup Design
Blog •
The High-Speed PCB Stackup Design Challenge

Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.

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Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's •
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

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Embedded thumbnail for How to efficiently use Blankets?
How-To's •
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

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stitching vias
Blog •
Everything You Need to Know About Stitching Vias

Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.

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Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's •
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

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Blog •
Wire Bonding in Altium Designer

The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.

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Blog •
Optimize PCB Design with Integrated BOM and CAD Systems

Discover how integrating BOM management and CAD systems can streamline your PCB design process in this insightful article. Learn how combining these tools enables smoother collaboration, reduces errors, and improves design efficiency, helping you optimize your workflows from concept to manufacturing.

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Blog •
The Essential Guide to Through-Hole Resistors

Resistors are fundamental components in electronic circuits, essential for controlling current and voltage. This article explores their basic principles, types, and key applications, helping you understand their crucial role in electronics.

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Blog •
Avoiding Costly Delays: Essential Tips for PCB Designers

Efficient PCB design is crucial for avoiding costly delays in product development. This article offers practical tips and best practices for PCB designers to streamline their workflows, minimize errors, and ensure timely project completion.

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Blog •
Mastering EMI Control in PCB Design: Component Placement for EMC

In the second article of the "Mastering EMI Control in PCB Design" series Dario Fresu explores how effective component placement can reduce electromagnetic interference (EMI) in printed circuit boards. He highlights strategies such as board segregation and careful management of high-speed signals and their harmonics to ensure signal integrity and minimize emissions.

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Blog •
Signal Integrity Principles based on Altium Designer 24

Check out this article where Rafał Stępień dives into the essentials of maintaining signal integrity in high-speed digital systems. Discover key techniques like controlling signal reflections, reducing crosstalk, and designing differential pairs in Altium Designer 24 to ensure reliable and efficient PCB performance.

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RSP Launch Cover
Blog •
Launch of Requirements & Systems Portal in Altium 365

The Requirements & Systems Portal is now live in Altium 365! Engineers can write, manage, and verify requirements within the Altium 365 workspace. You can link your requirements directly to schematics and PCB designs to ensure all engineers are working with the latest data. Request access today!

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Blog •
Favorite Tools for BOM Review

Check out our article, where Lawrence Romine shares his top tools for conducting efficient Bill of Materials (BOM) reviews in PCB design. It highlights key features in Altium 365, Octopart, and ActiveBOM that help engineers avoid unsourceable components and streamline procurement.

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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA •
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

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Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA •
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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How to Design a BGA •
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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How to Design a BGA •
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA •
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Via Stitching •
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects •
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects •
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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How to Work with Draftsman •
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects •
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects •
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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How to Work with Draftsman •
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects •
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

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How to Work with Multichannel Schematic •
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

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How To Work with High-Speed Projects •
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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Embedded thumbnail for Schematic Design Reuse Using Snippets
How to work with Snippets •
Schematic Design Reuse Using Snippets

Snippets allow you to easily reuse circuitry across multiple parts of your designs. We’ll show you how create a new snippets the Schematic and how to connect and annotate it so you can easily bring your circuitry directly into your board.

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