News & Updates
Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.
Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.
Crosstalk control is essential for better EMI performance. Learn effective design techniques to reduce interference in the final installment of this series by Dario Fresu.
Part 2 of this series covers essential project management techniques for electronics design teams. Rafał Stępień discusses effective data organization, revision control, and collaboration strategies to improve efficiency and minimize errors.
Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.
Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.
Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.
Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.
Discover how wire harnesses are evolving to meet the demands of electric vehicles and modern electronics. Our latest article explores key trends like higher voltages, lightweight designs, and smart harnesses, along with challenges such as cost and supply chain issues.
Dario Fresu explores effective decoupling strategies for power distribution networks (PDNs) to minimize EMI in PCB designs. The article covers techniques like decoupling capacitors and power planes to ensure stable power delivery for integrated circuits.
Finding the right component shouldn't mean searching through dozens of websites and datasheets. This article shows how integrated component search helps engineers select parts faster while reducing sourcing risks and design delays.
The best sourcing decisions happen when procurement is involved early. This webinar demonstrates how BOM Portal gives both engineering and procurement access to live lifecycle, pricing, compliance, and availability data to drive smarter decisions from prototype through production.
This article walks through the complete PCB design workflow, from schematic capture and component selection to layout, design reviews, and manufacturing documentation. It highlights the key decisions at each stage that help engineering teams produce reliable, manufacturable products.
The biggest threat to your power integrity might be outdated design advice. This article challenges five common AC power integrity myths and shows what really matters when designing today's high-speed PCBs.
Your design data may be more exposed than you think. This webinar shows how to identify common security gaps and secure engineering workflows with centralized access control and governance.
Your flex PCB may look perfect in CAD but coverlay doesn't stay perfectly still during manufacturing. This article reveals why designing for lamination behavior is one of the most important steps in building reliable flex circuits.
As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.
Signal integrity and power integrity are closely connected, with problems in one often affecting the other as designs become faster and more complex. This webinar explains how integrated analysis workflows help engineers evaluate PDN performance, identify potential issues early, and improve overall design quality.
Every manual handoff adds time and risk to the product development process. This article shows how modern design workflows automate routine tasks, improve data visibility, and help engineering teams focus on innovation instead of administration.
Your signal may be perfect on the PCB and fail the moment it crosses a connector. This article explores the hidden SI challenges in multi-board systems and how engineers can eliminate them before they become costly debugging sessions.
Still building BOMs the hard way? Discover how modern workflows can help you create a prototype-ready BOM faster while improving visibility into pricing, availability, and risk.
This article examines the challenges of maintaining power integrity and controlling EMI in complex multiboard systems. It provides practical strategies for managing return paths, connector transitions, and power distribution across interconnected assemblies.
Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.