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Embedded thumbnail for Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium
Altium Stories
Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium

Watch the video where you can find how Proper Voltage centralized communication, synchronized ECAD–MCAD development, and gained early insight into supply chain risks using Altium’s connected design platform.

Blog
Types of Simulation Tools For PCBs

PCB simulation isn’t one-size-fits-all and that’s where it gets interesting! Discover the wide range of tools available, from quick circuit checks to advanced multiphysics simulations, and how they help you design with confidence.

Embedded thumbnail for  Detect Z-Axis Clearance Issues Earlier
New in Altium's Software
Detect Z-Axis Clearance Issues Earlier

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

Blog
Wiring the Future: The Shift to Unified Electromechanical Design

This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.

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How-To's
Fix Inconsistent Part Parameters in Your PCB Schematic

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

Blog
Best Tools For PCB DFM Checks

Want to catch manufacturability issues before they turn into expensive delays? Discover the essential DFM tools from real-time checks to post-layout analysis that help you get your PCB right the first time.

Embedded thumbnail for Create IPC-Aligned Footprints with Less Effort
New in Altium's Software
Create IPC-Aligned Footprints with Less Effort

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

Blog
Eliminate Your Design Friction with Agile Teams

Design friction from scattered data and disconnected tools slows down PCB development and leads to rework. This webinar shows how Agile Teams streamlines collaboration, aligns domains, and helps teams deliver faster with fewer errors.

Embedded thumbnail for Via Dispersion: Why Propagation Delay Changes with Frequency
How-To's
Via Dispersion: Why Propagation Delay Changes with Frequency

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

Embedded thumbnail for Make Via Rule Configuration More Intuitive
New in Altium's Software
Make Via Rule Configuration More Intuitive

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

Blog
What is the Best Cloud PCB Design Software?

Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.

Blog
From Rework to Revenue: Digital PCB DFMA

This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.

Embedded thumbnail for Coplanar Ground Done Right: PCB Design Best Practices
How-To's
Coplanar Ground Done Right: PCB Design Best Practices

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

Embedded thumbnail for Import and Export with Modern Mechanical Models
New in Altium's Software
Import and Export with Modern Mechanical Models

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

Embedded thumbnail for How to Input Via Delay in Altium for DDR Routing
How-To's
How to Input Via Delay in Altium for DDR Routing

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

Blog
How to Choose the Right Components for Your BOM

A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.

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Introduction to Open Source Laptop Project
Blog
Introduction to Open Source Laptop Project

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

Blog
Ebook: Routing High-Density Interconnects with Reliable Microvias

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

Blog
IPC-2221 Calculator for PCB Trace Current and Heating

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

Blog
Stripline Impedance Calculator

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

Blog
Which Types of Opto-Isolators Are Right For Your Signal?

An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?

Blog
Properties panel document options in SCH editors

The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.

High-Speed PCB Stackup Design
Blog
The High-Speed PCB Stackup Design Challenge

Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.

stitching vias
Blog
Everything You Need to Know About Stitching Vias

Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.

PCB Stackup Basics
Blog
PCB Stackup Basics

In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.

chip with neon illumination
Blog
How Does the Package PDN Impact Power Integrity?

Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.

electrical circuit with microcontroller
Blog
Designing Custom Hardware with Microcontrollers

In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.

high-speed printed circuit board
Blog
Guide to Low-Dk PCB Materials

If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.

Tag
Embedded thumbnail for How to Work with The Polygon Manager
Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

Embedded thumbnail for Working with Design Variants
How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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