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Embedded thumbnail for Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium
Altium Stories •
Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium

Watch the video where you can find how Proper Voltage centralized communication, synchronized ECAD–MCAD development, and gained early insight into supply chain risks using Altium’s connected design platform.

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Blog •
Types of Simulation Tools For PCBs

PCB simulation isn’t one-size-fits-all and that’s where it gets interesting! Discover the wide range of tools available, from quick circuit checks to advanced multiphysics simulations, and how they help you design with confidence.

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New in Altium's Software •
Detect Z-Axis Clearance Issues Earlier

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

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Blog •
Wiring the Future: The Shift to Unified Electromechanical Design

This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.

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How-To's •
Fix Inconsistent Part Parameters in Your PCB Schematic

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

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Blog •
Best Tools For PCB DFM Checks

Want to catch manufacturability issues before they turn into expensive delays? Discover the essential DFM tools from real-time checks to post-layout analysis that help you get your PCB right the first time.

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Embedded thumbnail for Create IPC-Aligned Footprints with Less Effort
New in Altium's Software •
Create IPC-Aligned Footprints with Less Effort

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

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Blog •
Eliminate Your Design Friction with Agile Teams

Design friction from scattered data and disconnected tools slows down PCB development and leads to rework. This webinar shows how Agile Teams streamlines collaboration, aligns domains, and helps teams deliver faster with fewer errors.

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Embedded thumbnail for Via Dispersion: Why Propagation Delay Changes with Frequency
How-To's •
Via Dispersion: Why Propagation Delay Changes with Frequency

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

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Embedded thumbnail for Make Via Rule Configuration More Intuitive
New in Altium's Software •
Make Via Rule Configuration More Intuitive

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

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Blog •
What is the Best Cloud PCB Design Software?

Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.

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Blog •
From Rework to Revenue: Digital PCB DFMA

This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.

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Embedded thumbnail for Coplanar Ground Done Right: PCB Design Best Practices
How-To's •
Coplanar Ground Done Right: PCB Design Best Practices

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

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Embedded thumbnail for Import and Export with Modern Mechanical Models
New in Altium's Software •
Import and Export with Modern Mechanical Models

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

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Embedded thumbnail for How to Input Via Delay in Altium for DDR Routing
How-To's •
How to Input Via Delay in Altium for DDR Routing

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

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Blog •
How to Choose the Right Components for Your BOM

A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.

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Blog •
How to Test Suspect Electronic Components

Electronic components power nearly everything in our modern lives. However, as long as there are buyers for parts, counterfeiters will persist in their endeavors. Financial losses resulting from fake components are challenging to ascertain due to enforcement limitations and the difficulty in collecting data on the issue. In this article, we demonstrate how to test and verify components in batch orders.

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Blog •
Design Phase – Lid Assembly Electronics Part 2

We are going deeper into lid assembly electronics in our Open Source Laptop project. In this chapter we will tackle the PCB design of the webcam board and show you how to deal with some expected challenges, such as overall small form factor of the board or breaking out the microscopic webcam image sensor.

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Agile Hardware Development
Blog •
5 Ways Hardware Development Is Just… Different

Explore the challenges and strategies of implementing Agile methodology in electronics hardware development. Understand key differences between hardware and software development within the Agile framework.

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Blog •
Flexible Circuit Assembly: Thinking Through Component Placement

The flexible circuits are ideal for applications where a thin, small, and lightweight PCB is needed. However, in such cases, challenges in assembly and fabrication often arise. This article delves into these challenges, focusing on component selection and placement and how they can significantly impact the performance of the flexible circuit in its intended application.

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Blog •
Coding Your Own Networked Test Equipment

Have you ever performed manual tests? If your answer is yes, you're likely aware of how laborious and time-consuming the entire process can be. Allow us to introduce you to the realm of test equipment automation. Our new step-by-step guide empowers you to write code that seamlessly configures your networked test equipment, all from the convenience of your computer.

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Blog •
Pi.MX8 Project – Schematic structure and component placement

We are advancing with our brand new Pi.MX8 Project. In this chapter, we delve deeper into two crucial aspects: the overall schematic and component placement on the PCB board. Don't hesitate to check it out. Additionally, you can follow this project through our workspace; the link is provided within the article.

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Blog •
Redefine PCB Boundaries with HDI Design

Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.

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Blog •
Pi.MX8 Project – Introduction and Overview

Do you have extensive knowledge about the Pi.MX8 module? We're excited to introduce a new series of articles focusing on an innovative approach to utilizing this module. In this inaugural chapter, we provide insights into the preparation for this project and detail the elements that will be used.

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Blog •
Simple Documentation for Hand PCB Assembly

Creating documentation for hand PCB assembly does not prevent the same documentation from being utilized to assist in automated PCB assembly. Learn more about the optimal format for this data to enhance both your hand PCB assembly and overall assembly processes.

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Working with Polygons •
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

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Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs •
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's •
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

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Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA •
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA •
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

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Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA •
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA •
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA •
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA •
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Embedded thumbnail for Via Shielding and Stitching
Via Stitching •
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects •
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects •
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman •
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects •
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects •
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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Embedded thumbnail for Working with Design Variants
How to Work with Draftsman •
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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