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Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

NEW
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New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Blog
Agile Teams: From Design Tool to Product Development Platform

Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

Embedded thumbnail for Add Unit-Aware Temperature Coefficient Parameters
New in Altium's Software
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Blog
Complex Engineering Projects Leverage Multiple ECAD/MCAD Formats

This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.

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Blog
What is the Best Cloud PCB Design Software?

Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.

Blog
From Rework to Revenue: Digital PCB DFMA

This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.

Blog
How to Choose the Right Components for Your BOM

A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.

Blog
From Scattered Requirements to Confident Product Development

See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.

Blog
What is the Best PCB Design Tool For Students?

Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.

Blog
What Is Collaborative Engineering?

Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.

Blog
Bend Reliability: How Trace Geometry and Materials Impact Flex Lifespan

Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.

Blog
PCB Design Process: The EDA Design Approach

Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.

Blog
Getting Started for Mechanical Engineers

Explore our collection of MCAD Collaboration walkthroughs, where you’ll discover how to synchronize mechanical constraints and keepouts, maintain traceability with advanced history and revision control, and streamline electromechanical connectivity through harness synchronization. These topics and many more are covered in this article.

Blog
Are Your ECAD Tools Holding Back Engineers’ Productivity?

The article highlights that productivity issues often stem from tool limitations rather than engineer effort, especially as project complexity grows. ECAD tools that offer clear version control, cross-discipline integration, and workflow awareness are key to sustaining efficiency.

Blog
7 Ways to Catch Rules & Constraints Early – Checklist

Discover seven actionable ways to spot and fix rules and constraint issues before they derail your PCB project. Using Altium Designer Agile, these tips help you build more manufacturable and reliable boards with fewer iterations.

Blog
Do You Need an IPC-D-356 Netlist?

If your output package is Gerber-based, adding an IPC-D-356 netlist can dramatically improve how your design is reviewed and validated for production. Here’s when it matters, what it contains, and how to generate it quickly in Altium.

Tag
Embedded thumbnail for PCB design with BGA: Via-in-Pad
How-To's
PCB design with BGA: Via-in-Pad

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
How-To's
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for How to work with components on a rigid-flex board in MCAD
How-To's
How to work with components on a rigid-flex board in MCAD

With MCAD Codesigner you can quickly add and move components from your MCAD tool and update the design automatically in Altium Designer. We’ll show you how to. Add a new component, move components, and change a component’s region in MCAD, and update it to your design in Altium Designer.

Embedded thumbnail for LSM: Impedance profile
How-To's
LSM: Impedance profile

Creating Impedance profiles for transmission lines and how to apply them to the board

Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

Embedded thumbnail for How to efficiently use Blankets?
How-To's
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

Embedded thumbnail for Design RF PCB: routing (any angle, arc)
How-To's
Design RF PCB: routing (any angle, arc)

It is worth taking a responsible approach to the shape and size of the RF signal conductors. In this video we will cover some practical aspects of working with routing such nets in Altium Designer.

Embedded thumbnail for Draftsman Document: Snapping
How-To's
Draftsman Document: Snapping

Snapping using the grids and snapping tools in Altium Designer’s Draftsman Editor gives you a lot of control over how you create and annotate primitives and components. We’ll show you how easy it is to use snapping in the Drafstman Editor.

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
Schematic Capture Improvement

Adding cross-references to the project allows you to easily follow the connective flow of nets between the schematic sheets in a project. 

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
原理图输入改进

您可以通过向项目添加交叉引用,轻松跟踪项目中原理图图纸之间的网络连接流。

Embedded thumbnail for High Speed: XSignals
How-To's
High Speed: XSignals

You can create, configure, and utilize xSignals in Altium Designer to make your design process more efficient and effective. We’ll show you how to do it manually, using the more comprehensive Create xSignals command, and using the xSignal wizard.

Embedded thumbnail for DFM and fab cost/time constraints: What is annular ring and how to configure it
How-To's
DFM and fab cost/time constraints: What is annular ring and how to configure it

The minimum dimension from the wall of the aperture to the edge of the pad is called an annular ring, and we can configure it with Altium Designer. We’ll show you how to get started and manage the annular ring in your design rules.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
How-To's
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files.

Embedded thumbnail for Polygon Pours
Working with Polygons
Polygon Pours

Polygon pours are used to create copper geometries on your board. You can prioritize polygon pour order, hide them to make it easier to work on your board, and repour them to resolve design rule conflicts.

Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

Tag
Integrating Requirements June 2025 Webinar
On-Demand Webinar May 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar Apr 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar Jan 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.