News & Updates
Discover AI-driven vision capabilities with the Kria KV260 Vision AI Starter Kit, presented by Ari Mahpour. Ideal for prototyping vision solutions, this kit offers an accessible entry point into advanced AI applications.
Explore how Model-Based Systems Engineering (MBSE) integrates with digital twins to enhance design accuracy, collaboration, and lifecycle management in modern engineering projects. This approach bridges the gap between physical systems and digital models, enabling real-time simulation and optimization.
The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.
Altium Designer 25 introduces groundbreaking features for seamless collaboration and precision in PCB design, from PCB CoDesign to advanced simulation and MCAD tools. Discover how AD25 is transforming electronic product development.
Watch this webinar tailored for PCB designers, engineers, and manufacturers! Dive deep into how our latest application, Altimade, integrates with MacroFab to transform your prototyping and production processes, ensuring faster turnaround and enhanced product quality.
Explore the future of wire bonding, from new applications to cost-saving trends, in this article by Samer Aldhaher. Stay updated on key innovations in this essential connection technology.
Discover how Altium 365’s Jira integration can streamline collaboration and keep projects running smoothly with real-time design updates and task tracking. Perfect for teams seeking efficiency!
Watch this webinar and learn how online BOM management systems, like Altium 365 BOM Portal, can transform your approach to transparency, collaboration, and regulatory compliance in the electronics sector.
The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.
There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.
Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.
Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.
Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.
As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.
Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.
The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.
Quite often, a standard assembly drawing is not enough to ensure the quality of a PCB assembly, especially when designing high-density boards. It would also be helpful to include additional detailing for simpler devices. The use of a Draftsman document brings an elegant, yet powerful solution to make these tasks easier.
An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.
In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.
You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs
One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.
One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.
A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.
Any project can get very complex, and the PCB design team needs to track revisions throughout a project. Why worry about tracking revisions? In the event you ever receive changes to product functional requirements, major changes are made to your product’s architecture, or you’re ready to finalize the design and prepare for fabrication, it’s best to clone a project at its current state and begin working on a new version. Keeping track of all these design changes in a PCB design project takes the type of hardware version control tools you’ll find in Altium 365™.
Watch this webinar tailored for PCB designers, engineers, and manufacturers! Dive deep into how our latest application, Altimade, integrates with MacroFab to transform your prototyping and production processes, ensuring faster turnaround and enhanced product quality.
Watch this webinar and learn how online BOM management systems, like Altium 365 BOM Portal, can transform your approach to transparency, collaboration, and regulatory compliance in the electronics sector.
Watch this webinar to learn how the SiliconExpert Integration in Altium 365 can optimize your workflows and elevate your design process.
Want to keep your entire team on the same page? Watch this webinar to discover how Altium 365’s suite of applications revolutionizes electronics design from conception to production.
Tired of juggling multiple tools for project management? Learn how the Jira Integration for Altium 365 can optimize your workflows.
Watch our webinar to learn more about the new application joining the Altium 365 suite. The new Requirements & Systems Portal will help align engineering teams to get to market quicker.
Watch our webinar to learn how our centralized electronics design data platform can quickly integrate with your IT access, tracking, and compliance tools, while also making it easier to work in teams.
Learn how to make informed decisions and mitigate supply chain risks with Altium 365 BOM Portal. Improve your time to market and proactively manage supply chain risks.
Struggling with manual data errors in your electronics projects? Watch the webinar to learn how Altium 365 cloud PLM integration with Duro® minimizes errors and rework, saving you time and money.
Learn how Valispace is transforming the world of requirements and systems engineering, enabling teams to do super fast design iterations and develop quality products while ensuring they comply with standards and regulations.
Watch the webinar to learn how the SiliconExpert Integration in Altium 365 can optimize your workflows and elevate your design process. Start making data-driven design decisions today!
Is juggling multiple ECAD file formats slowing down your team? If so, watch this webinar and learn how to remove ECAD data silos to enhance design collaboration, efficiently manage all your BOMs, and reduce supply chain risks with Altium 365 Multi-CAD File Support.
Watch the webinar to discover how Altium 365 Cloud PLM Integration with Arena® can optimize your electronics product development processes. Benefit from automated data flow, eliminating manual input and minimizing errors that lead to costly rework.
Watch the webinar that brings together the expertise of Altium 365 and AWS to introduce the specialized Altium 365 GovCloud within the robust AWS GovCloud infrastructure. This session is designed for IT and security professionals seeking advanced data protection and access control solutions for their electronics development teams.
Watch the webinar to explore the benefits of agile methodologies and how they can be translated into the physical world of hardware development! Learn how Altium 365 can support the adoption of this approach.
Watch our webinar and discover how Altium 365 GovCloud can assist you in PCB design while ensuring compliance with US government regulations.