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Embedded thumbnail for Quickstart Guide: Single Layer PCB Design with Altium Designer 25
New in Altium Designer 25
Quickstart Guide: Single Layer PCB Design with Altium Designer 25

Transform your designs with the new Single Layer PCB Design feature in Altium Designer 25! Whether you're working on Rigid-Flex projects or creating simple, space-saving boards, this tool makes the process faster, smarter, and more efficient. Watch our guide now and unlock your next big innovation.

NEW
Blog
AI Vision with the Kria KV260 Vision AI Starter Kit

Discover AI-driven vision capabilities with the Kria KV260 Vision AI Starter Kit, presented by Ari Mahpour. Ideal for prototyping vision solutions, this kit offers an accessible entry point into advanced AI applications.

NEW
Embedded thumbnail for How to Design Bending Regions in Flex PCBs
How-To's
How to Design Bending Regions in Flex PCBs

Watch our latest video on bending regions in flex PCBs! This step-by-step guide will show you how to configure stack-ups, distinguish between flex and rigid regions, and troubleshoot common issues in 3D views.

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Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection

The final part of the LDO Regulator Essentials series focuses on voltage ripple rejection in Low Dropout Regulators (LDOs). Our host Rafał Stępień explains how LDOs clean up DC supply waves, ensuring stable performance in power systems. This episode provides practical insights for optimizing sensitive designs.

Embedded thumbnail for Explore Routing Improvements in Altium Designer 25
New in Altium Designer 25
Explore Routing Improvements in Altium Designer 25

Discover Routing Improvements in Altium Designer 25. Learn about Dynamic Phase Matching, True Donut Pad Shape, and more in our latest video showcasing the powerful enhancements in our newest release.

Embedded thumbnail for Wire Bonding Shorts: Die Footprints
New in Altium Designer 25
Wire Bonding Shorts: Die Footprints

Check our new short video where Samer Aldhaher demonstrates the Wire Bonding feature in Altium Designer 25, including die-to-die and die-to-copper connections, multiple wire bonds, and pad rotation techniques.

Blog
Wire Bonding in Altium Designer

The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.

Embedded thumbnail for Altium Designer 25: Collaboration at its Finest
New in Altium Designer 25
Altium Designer 25: Collaboration at its Finest

Altium Designer 25 focuses on enhancing collaboration for engineering teams with new tools like the SI Analyzer by Keysight, updated PCB CoDesign, MCAD and Ansys CoDesigners, and improved Simulation modules. This release also introduces Wire Bonding, Single Layer PCB, and performance upgrades for optimized PCB design workflows. Check our overview video about all the improvements in this release.

Embedded thumbnail for The Fastest Ways to Run a PCB BOM Review
How-To's
The Fastest Ways to Run a PCB BOM Review

Conducting a BOM review is crucial to prevent costly delays, obsolete components, and unforeseen sourcing challenges in your PCB project. Discover powerful tools like DigiKey, Octopart, and Altium 365’s BOM portal to simplify your review process and ensure you're selecting the best parts at optimal prices.

Embedded thumbnail for Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones
Altium Stories
Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones

Quantum Systems creates advanced drones for critical aerial intelligence across industries. With Altium Designer and Altium 365, they streamline electronics engineering and enhance team collaboration. Watch how Altium software helps them innovate faster and build reliable drones for mission-critical moments.

Embedded thumbnail for Wire Bonding Shorts: 3D Stacked Die with Cavity
New in Altium Designer 25
Wire Bonding Shorts: 3D Stacked Die with Cavity

Check our short video by Samer Aldhaher on using Altium Designer’s wire bonding tool for creating 3D stacked die in cavity. Highlights advanced techniques for compact, high-performance PCB designs with 3D integrated circuits.

Embedded thumbnail for Constraint Manager Improvements in Altium Designer 25
New in Altium Designer 25
Constraint Manager Improvements in Altium Designer 25

Discover the latest in Altium Designer 25’s Constraint Manager, with updates like flexible net selection, streamlined rule management, and differential pair handling. Simplify your PCB design workflow with powerful new tools and enhancements.

Embedded thumbnail for Signal Integrity Made Simple - Recording Preview
How-To's
Signal Integrity Made Simple - Recording Preview

Catch up on our “Signal Integrity Made Simple” webinar to explore essential techniques for ensuring high-speed design integrity. Watch the recording to gain practical insights, and don’t miss our upcoming November webinar showcasing the latest Altium Designer release, featuring the powerful Signal Analyzer by Keysight and additional tools to optimize your projects.

Embedded thumbnail for Kickstart Your Rigid-Flex Journey: Part III - PCB Layout
Kickstart Your Rigid-Flex Journey
Kickstart Your Rigid-Flex Journey: Part III - PCB Layout

In this third installment of our series, Piet Callemeyn demonstrates PCB layout creation from scratch for a rigid-flex project, covering key techniques like bend lines and split lines. A must-see for any PCB designer!

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Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

Man working in Altium Designer
Blog
Best Practices in Hardware Version Control Systems

Any project can get very complex, and the PCB design team needs to track revisions throughout a project. Why worry about tracking revisions? In the event you ever receive changes to product functional requirements, major changes are made to your product’s architecture, or you’re ready to finalize the design and prepare for fabrication, it’s best to clone a project at its current state and begin working on a new version. Keeping track of all these design changes in a PCB design project takes the type of hardware version control tools you’ll find in Altium 365™.

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Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

Embedded thumbnail for Working with Design Variants
How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

Embedded thumbnail for Creating Connectivity
How to Work with Multichannel Schematic
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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Iterate Faster in Complex Engineering Projects Webinar Cover
On-Demand Webinar
Iterate Faster in Complex Engineering Projects

Learn how Valispace is transforming the world of requirements and systems engineering, enabling teams to do super fast design iterations and develop quality products while ensuring they comply with standards and regulations.

Data Security and Access Controls for Electronics Development Teams
On-Demand Webinar
Data Security and Access Controls for Electronics Development Teams Using Altium 365 GovCloud on AWS GovCloud Infrastructure

Watch the webinar that brings together the expertise of Altium 365 and AWS to introduce the specialized Altium 365 GovCloud within the robust AWS GovCloud infrastructure. This session is designed for IT and security professionals seeking advanced data protection and access control solutions for their electronics development teams.