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Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

NEW
Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Blog
Agile Teams: From Design Tool to Product Development Platform

Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

Embedded thumbnail for Add Unit-Aware Temperature Coefficient Parameters
New in Altium's Software
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Blog
Complex Engineering Projects Leverage Multiple ECAD/MCAD Formats

This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.

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Blog
How to Design for Test in Embedded Systems

Whether you're designing a high-speed PCB, or a complex embedded system, it will need some level of testing. In this article, we will show you some simple tricks that can make testing and debugging a prototype much easier. 

Blog
Crosstalk Basics in PCB Design

Crosstalk is one of the most common issues related to electronics. Learn the basics of this phenomenon in PCB design, and gain knowledge on how to avoid it in your projects.

Blog
Access to your Training Certificates on My Altium

Introduce an update on the My Altium user page that highlights your certificates and tracks your training progress, with one-click access to the Training Dashboard and Training Catalog pages. Easily view and share your certificates, keep an eye on your learning journey, and explore a variety of training resources.

Blog
Rigid-Flex PCBs: Advantages and Challenges

In this article, we will begin with a basic explanation of how rigid-flex technology differs from rigid board technology. We will then provide an overview of the advantages and conclude with a discussion of the challenges to be aware of.

Intrusive Soldering
Blog
When Should You Use Intrusive Soldering?

Through-hole components are frequently employed in power electronics, particularly when dealing with AC power from a wall outlet. In this article, you can delve into the intrusive soldering process and discover when it can be applied in PCB design.

Blog
What Makes a PCB Enclosure Rugged?

Whether you purchase products off-the-shelf or online, they all come housed within an enclosure. In some cases, these enclosures are intentionally ruggedized to withstand harsh environments or mechanical shocks. You can learn more about enclosures in this new and interesting article.

Blog
Concept Phase – Lid Assembly Design Part 2

We are continuing our journey through the lid assembly design phase of our Open Source Laptop project. In this section, we will discuss the layout of the test adapter and provide a demonstration of the first test for the display panel, along with the initial steps involved in assembling the boards.

Blog
Concept Phase – Lid Assembly Design Part 1

In the exciting next phase of the open-source laptop project we're (finally) diving into design, and getting hands-on with the display panel. Discover how we're selecting the right panel, integrating it seamlessly, and creating a custom DisplayPort adapter to illuminate the screen. Plus, learn how our choices impact features like microphones, webcams, and touch sensors, and how Altium can help bring it all to life. It’s not too late to join as we continue on this innovative journey!

Blog
Unleashing the Power of Concurrent PCB Design

Concurrent PCB Design is essential to unlocking the full potential of engineering teams and delivering innovative products that meet the demands of the modern world. Learn more about the main capabilities and the numerous benefits of this upcoming feature in Altium Designer.

Blog
Crosstalk Reduction and Elimination Techniques in Altium Designer

Whether you're designing a digital board with a ton of traces, or an RF board operating at very high frequencies, any electronic device with propagating signals will experience crosstalk. Learn more about some sure-fire ways you can reduce crosstalk in your high-speed designs.

Blog
Baxandall Volume Control for Audio

The Baxandall volume control is an especially useful, flexible, and simple-to-implement circuit for numerous audio designs. In this article, we will demonstrate how to design this type of equipment.

Blog
RF Power Amplifier Module PCB Design

RF power amplifiers can be found in many wireless products, often integrated into chipsets or modems. However, in certain specialized systems, you might require higher power output at a specific frequency. This necessitates a discrete amplifier circuit to deliver that power. In this article, we present an example project for a power amplifier that you can incorporate into your RF project.

Tag
Embedded thumbnail for PCB design with BGA: Via-in-Pad
How-To's
PCB design with BGA: Via-in-Pad

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
How-To's
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for How to work with components on a rigid-flex board in MCAD
How-To's
How to work with components on a rigid-flex board in MCAD

With MCAD Codesigner you can quickly add and move components from your MCAD tool and update the design automatically in Altium Designer. We’ll show you how to. Add a new component, move components, and change a component’s region in MCAD, and update it to your design in Altium Designer.

Embedded thumbnail for LSM: Impedance profile
How-To's
LSM: Impedance profile

Creating Impedance profiles for transmission lines and how to apply them to the board

Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

Embedded thumbnail for How to efficiently use Blankets?
How-To's
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

Embedded thumbnail for Design RF PCB: routing (any angle, arc)
How-To's
Design RF PCB: routing (any angle, arc)

It is worth taking a responsible approach to the shape and size of the RF signal conductors. In this video we will cover some practical aspects of working with routing such nets in Altium Designer.

Embedded thumbnail for Draftsman Document: Snapping
How-To's
Draftsman Document: Snapping

Snapping using the grids and snapping tools in Altium Designer’s Draftsman Editor gives you a lot of control over how you create and annotate primitives and components. We’ll show you how easy it is to use snapping in the Drafstman Editor.

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
Schematic Capture Improvement

Adding cross-references to the project allows you to easily follow the connective flow of nets between the schematic sheets in a project. 

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
原理图输入改进

您可以通过向项目添加交叉引用,轻松跟踪项目中原理图图纸之间的网络连接流。

Embedded thumbnail for High Speed: XSignals
How-To's
High Speed: XSignals

You can create, configure, and utilize xSignals in Altium Designer to make your design process more efficient and effective. We’ll show you how to do it manually, using the more comprehensive Create xSignals command, and using the xSignal wizard.

Embedded thumbnail for DFM and fab cost/time constraints: What is annular ring and how to configure it
How-To's
DFM and fab cost/time constraints: What is annular ring and how to configure it

The minimum dimension from the wall of the aperture to the edge of the pad is called an annular ring, and we can configure it with Altium Designer. We’ll show you how to get started and manage the annular ring in your design rules.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
How-To's
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files.

Embedded thumbnail for Polygon Pours
Working with Polygons
Polygon Pours

Polygon pours are used to create copper geometries on your board. You can prioritize polygon pour order, hide them to make it easier to work on your board, and repour them to resolve design rule conflicts.

Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

Tag
Integrating Requirements June 2025 Webinar
On-Demand Webinar May 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar Apr 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar Jan 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.