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Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software •
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

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NEW
Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software •
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

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Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software •
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

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Blog •
Agile Teams: From Design Tool to Product Development Platform

Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.

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Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software •
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

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Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's •
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

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Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software •
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

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Embedded thumbnail for Add Unit-Aware Temperature Coefficient Parameters
New in Altium's Software •
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

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Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's •
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

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Blog •
Complex Engineering Projects Leverage Multiple ECAD/MCAD Formats

This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.

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Blog •
Pi.MX8 Project - Board Layout Part 4

We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.

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Blog •
How Thermoformed Flex PCB’s are Designed and Fabricated

Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.

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Blog •
Boost Connection Integrity and Design Efficiency with Wire Bonding

Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.

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Blog •
How High Frequency SMD Passives Work in a PCB Layout

High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.

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Blog •
Essential DFM Tips for Aerospace Projects

Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.

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Altium 365 New Website
Blog •
Altium 365 now has its own website!

Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
 

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Blog •
Altium Designer: Leading the Charge in PCB Design Innovation

In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.

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Blog •
What Is Solder Mask Expansion and Which Value Should You Use?

Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.

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Blog •
Pi.MX8 Project - Board Layout Part 3

We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.

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Blog •
Mastering Blind and Buried Vias

Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.

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Blog •
Make Sure to Clean Your No-Clean Flux

No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.

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Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA •
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA •
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA •
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Embedded thumbnail for Via Shielding and Stitching
Via Stitching •
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects •
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects •
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman •
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects •
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects •
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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Embedded thumbnail for Working with Design Variants
How to Work with Draftsman •
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects •
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

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Embedded thumbnail for Creating Connectivity
How to Work with Multichannel Schematic •
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

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Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects •
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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Embedded thumbnail for Schematic Design Reuse Using Snippets
How to work with Snippets •
Schematic Design Reuse Using Snippets

Snippets allow you to easily reuse circuitry across multiple parts of your designs. We’ll show you how create a new snippets the Schematic and how to connect and annotate it so you can easily bring your circuitry directly into your board.

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Embedded thumbnail for PCB Design Reuse Using Snippets
How to work with Snippets •
PCB Design Reuse Using Snippets

Snippets give you easy access to reuse circuitry on your PCB. Let’s take a look at how you can create and configure snippets for the PCB, connect a component link with the schematic and update the PCB to include your snippet.

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Embedded thumbnail for Creating Schematic Channels
How to Work with Multichannel Schematic •
Creating Schematic Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design. 

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Integrating Requirements June 2025 Webinar
On-Demand Webinar • May 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar • Apr 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar • Jan 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.