News & Updates

Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?

The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.

Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.

Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.

There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.

We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.

In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.

Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.

Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully

Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.

Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.

Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.

Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.

Balancing cost, quality, and availability is key when selecting electronic components. This article explores how to make informed choices that meet design goals while managing supply chain and sourcing challenges.

Wire harness failures can lead to significant financial losses, production delays, and safety hazards. This article delves into real-world examples of such failures across industries and illustrates how modern CAD tools can help prevent these costly issues.

Learn how to ensure electronic components meet the demands of harsh environments. This article explores key standards, testing protocols, and design considerations for building resilient systems that perform reliably under extreme conditions.

This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications.

Many electronics teams still rely on documents and spreadsheets for requirements management—leading to gaps, errors, and delays. Alexsander Tamari explores better tools to improve traceability, collaboration, and project outcomes.

Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.

This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.

Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.

Connector misalignment can compromise the reliability of power delivery in multi-board systems. This article explores the causes, effects, and prevention strategies for connector misalignment in power distribution, helping you design more robust multi-board PCB systems.

Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.

Designing a wire harness goes far beyond just connecting components—it’s about ensuring manufacturability, reliability, and compliance. This article walks you through the entire process, from initial design to production, helping you streamline development and avoid common pitfalls.

Explore the key considerations and best practices for conducting cybersecurity assessments in medical device development. This article outlines how to identify potential threats, evaluate risks, and ensure compliance with evolving industry standards.