News & Updates
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Ebook: Routing High-Density Interconnects with Reliable Microvias
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
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IPC-2221 Calculator for PCB Trace Current and Heating
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
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Stripline Impedance Calculator
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
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Which Types of Opto-Isolators Are Right For Your Signal?
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
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Properties panel document options in SCH editors
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
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The High-Speed PCB Stackup Design Challenge
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
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Everything You Need to Know About Stitching Vias
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
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Your Design Data Has Zero Defense
Your design data may be more exposed than you think. This webinar shows how to identify common security gaps and secure engineering workflows with centralized access control and governance.
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Flex Circuit Coverlay: Design with Lamination Processes In Mind
Your flex PCB may look perfect in CAD but coverlay doesn't stay perfectly still during manufacturing. This article reveals why designing for lamination behavior is one of the most important steps in building reliable flex circuits.
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Integrated PCB Design vs. Legacy Point Tools: What’s the Real Cost?
As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.
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Make Better Design Decisions with Signal and Power Integrity Insight
Signal integrity and power integrity are closely connected, with problems in one often affecting the other as designs become faster and more complex. This webinar explains how integrated analysis workflows help engineers evaluate PDN performance, identify potential issues early, and improve overall design quality.
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Optimizing Your Electronics Product Design Workflow and Eliminating Bottlenecks
Every manual handoff adds time and risk to the product development process. This article shows how modern design workflows automate routine tasks, improve data visibility, and help engineering teams focus on innovation instead of administration.
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Avoid Cross-Board Signal Integrity Issues in High-Performance Multiboard PCB Designs
Your signal may be perfect on the PCB and fail the moment it crosses a connector. This article explores the hidden SI challenges in multi-board systems and how engineers can eliminate them before they become costly debugging sessions.
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Proto-BOM in Minutes: How BOM Portal Accelerates Component Selection
Still building BOMs the hard way? Discover how modern workflows can help you create a prototype-ready BOM faster while improving visibility into pricing, availability, and risk.
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How to Manage Power Integrity and EMI in Complex Multiboard Systems
This article examines the challenges of maintaining power integrity and controlling EMI in complex multiboard systems. It provides practical strategies for managing return paths, connector transitions, and power distribution across interconnected assemblies.
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Agile Teams: From Design Tool to Product Development Platform
Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.
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Benefits of Using an Integrated Design Environment for PCB Development
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
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Enterprise vs. Midsize PCB Design Software: What Actually Changes at Scale
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
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BOM Portal vs BOM Tool: What Changes When You Upgrade
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.
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Altium vs KiCAD: Built to Scale From First Board to Full Product
Starting with a simple board today doesn't mean your next project will stay simple. Learn how Altium Designer and KiCAD compare when designs become more complex, teams get larger, and products move toward manufacturing.
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Eliminate the Design-to-Production Gap with Agile Teams + Duro
Learn how Agile Teams and Duro connect design and production workflows through a unified system of record. This webinar shows how structured change management and automated data synchronization help teams reduce errors and accelerate product releases.
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Agile Hardware Development: How to Scale Speed Without Losing Control
Agile hardware development isn’t just about working faster, it’s about working together in real time. This article explores how shared environments for ECAD, MCAD, sourcing, and requirements management eliminate handoff delays and improve decision-making across teams.
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How Reusable Parameters in Requirements Reduce Errors and Speed Up Iterations
Verification becomes much easier when requirements and system performance data stay connected automatically. This article explains how reusable parameters and V&V rules help teams detect violations earlier and validate designs with greater confidence.
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