News & Updates
Blog
•
A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
Blog
•
Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
Blog
•
6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
On-Demand Webinar
•
Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
Blog
•
Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Blog
•
How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
Blog
•
Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
Blog
•
Creating Continuous Integration Pipelines for FPGAs
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
Blog
•
Soft Locks [Conflict Prevention] in Altium 365
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
On-Demand Webinar
•
Increase Productivity With Easy Component Creation
Component creation is a necessary evil when it comes to design, and it’s something we all need to do. But instead of spending hours creating your components and having them turn into a complete roadblock, let it be just a simple bump on the road. Altium Designer has several tools available to you in order to create the different aspects of a component, including the symbol, footprint, 3D model parametric data, supply chain information, and more
Blog
•
The Basics of Monte Carlo in SPICE: Theory and Demo
Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?
Blog
•
When Should You Use Intrusive Soldering?
Through-hole components are frequently employed in power electronics, particularly when dealing with AC power from a wall outlet. In this article, you can delve into the intrusive soldering process and discover when it can be applied in PCB design.
Blog
•
Unveiling the Crucial Role of PCB Harness Design Capabilities in Multi-Board Designs
Multi-board designs are the key to meeting evolving demands, requiring robust PCB Harness Design for seamless interconnection and success. Join us as we explore the importance of PCB Harness Design capabilities and how they are crucial for the success of multi-board designs.
Blog
•
What Makes a PCB Enclosure Rugged?
Whether you purchase products off-the-shelf or online, they all come housed within an enclosure. In some cases, these enclosures are intentionally ruggedized to withstand harsh environments or mechanical shocks. You can learn more about enclosures in this new and interesting article.
Blog
•
Concept Phase – Lid Assembly Design Part 2
We are continuing our journey through the lid assembly design phase of our Open Source Laptop project. In this section, we will discuss the layout of the test adapter and provide a demonstration of the first test for the display panel, along with the initial steps involved in assembling the boards.
Blog
•
Concept Phase – Lid Assembly Design Part 1
In the exciting next phase of the open-source laptop project we're (finally) diving into design, and getting hands-on with the display panel. Discover how we're selecting the right panel, integrating it seamlessly, and creating a custom DisplayPort adapter to illuminate the screen. Plus, learn how our choices impact features like microphones, webcams, and touch sensors, and how Altium can help bring it all to life. It’s not too late to join as we continue on this innovative journey!
Blog
•
Unleashing the Power of Concurrent PCB Design
Concurrent PCB Design is essential to unlocking the full potential of engineering teams and delivering innovative products that meet the demands of the modern world. Learn more about the main capabilities and the numerous benefits of this upcoming feature in Altium Designer.
Blog
•
Crosstalk Reduction and Elimination Techniques in Altium Designer
Whether you're designing a digital board with a ton of traces, or an RF board operating at very high frequencies, any electronic device with propagating signals will experience crosstalk. Learn more about some sure-fire ways you can reduce crosstalk in your high-speed designs.
Blog
•
Baxandall Volume Control for Audio
The Baxandall volume control is an especially useful, flexible, and simple-to-implement circuit for numerous audio designs. In this article, we will demonstrate how to design this type of equipment.
Blog
•
Common Flex Design Mistakes and How to Fix Them
Designing flexible circuits involves managing numerous factors. Discover how to prevent mistakes in this process and how to rectify them post-implementation.
Blog
•
How Much PCB Mask Expansion is Too Much?
In this article you will learn about finding the right balance between PCB mask expansion and potential problems.
Blog
•
RF Power Amplifier Module PCB Design
RF power amplifiers can be found in many wireless products, often integrated into chipsets or modems. However, in certain specialized systems, you might require higher power output at a specific frequency. This necessitates a discrete amplifier circuit to deliver that power. In this article, we present an example project for a power amplifier that you can incorporate into your RF project.
Blog
•
Avoid GIGO in Your PCB Simulation Tools
Simulation tools are extremely useful for understanding electromagnetic behavior in a design. Learn more about how to avoid obtaining inaccurate results during your PCB simulation process.
Blog
•
Choosing a Converter or Regulator For Your Power Supply Design
When designing the power supply for your device, there are lots of different options. In this article, we will take a brief tour of the main choices in DC power supply design.
Blog
•
The Benefits of Ultra HDI
Learn more about the combination of using both flexible materials and ultra-HDI feature sizes in this article.
Blog
•
Understanding Power Supply Current Handling Issues: Causes and Solutions
Troubleshooting power supply current handling issues is crucial to achieving optimal performance of your electronic devices. In this article, we will explore the common reasons why a power supply fails to handle the defined output current and provide practical solutions to solving these issues.
Blog
•
Concept Phase – Cooling and Airflow Part 1
Next step in our open-source laptop project is to explain how to design cooling and airflow. In this article, we can show you the first part of this process, such as airflow concept, fan measurement and clearance.
Your search returns no results.
