News & Updates
Blog
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
Blog
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
Blog
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Blog
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
Blog
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
Blog
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Creating Continuous Integration Pipelines for FPGAs
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
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Soft Locks [Conflict Prevention] in Altium 365
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
On-Demand Webinar
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Increase Productivity With Easy Component Creation
Component creation is a necessary evil when it comes to design, and it’s something we all need to do. But instead of spending hours creating your components and having them turn into a complete roadblock, let it be just a simple bump on the road. Altium Designer has several tools available to you in order to create the different aspects of a component, including the symbol, footprint, 3D model parametric data, supply chain information, and more
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How to Overcome Power Distribution and Connector Misalignment Challenges in Multi-Board PCB Systems
Connector misalignment can compromise the reliability of power delivery in multi-board systems. This article explores the causes, effects, and prevention strategies for connector misalignment in power distribution, helping you design more robust multi-board PCB systems.
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Mastering Component Templates in Altium Designer 25
Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.
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Wire Harness Design Guide for Development and Manufacturing
Designing a wire harness goes far beyond just connecting components—it’s about ensuring manufacturability, reliability, and compliance. This article walks you through the entire process, from initial design to production, helping you streamline development and avoid common pitfalls.
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Preparing for Medical Device Cybersecurity Assessments
Explore the key considerations and best practices for conducting cybersecurity assessments in medical device development. This article outlines how to identify potential threats, evaluate risks, and ensure compliance with evolving industry standards.
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Harness Complexity, Design with Simplicity
Harness Design in Altium Designer simplifies managing PCB interconnections, ensuring reliable performance and streamlined manufacturing. With logical connectivity tools, harness layout drawing, and manufacturing-ready documentation, it keeps your designs efficient and organized—all within a unified design environment. Perfect for automotive, aerospace, and industrial applications.
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Getting Started with NVMe and the Raspberry Pi 5
Our new article guides you through enhancing your Raspberry Pi 5's performance by setting up NVMe SSD storage using an expansion HAT. It covers the benefits over traditional MicroSD cards, including improved speed and reliability, and provides step-by-step instructions for installation and configuration.
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Why Human Error Is Electronics Design Cybersecurity's Biggest Weakness
Human error is a leading cause of cybersecurity breaches—even in electrical engineering. Our article explores how everyday design and collaboration habits can create vulnerabilities, and what engineers can do to build safer, more secure workflows.
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From Concept to Production: A Modern Approach to Wire Harness Engineering
Discover how modern wire harness engineering is evolving to meet the growing complexity of electrified systems. This whitepaper explores best practices, intelligent automation, and ECAD-MCAD collaboration to improve efficiency and reduce errors. Download now to stay ahead in an increasingly connected world.
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Transforming RF Design with Ultra HDI
Ultra-HDI technology is transforming RF design by enabling finer line widths, improved signal integrity, and more compact, high-performance boards. Our brand-new article explores its advantages over traditional methods and the benefits of integrating flexible circuits.
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Boost Your PCB Testing Efficiency with Testpoint Manager
Testpoints are essential for efficient PCBA testing and debugging. Our latest whitepaper dives into testpoint optimization, fault detection, and automated testing strategies, along with a full tutorial on using Testpoint Manager in Altium Designer. Discover how to streamline your testpoint assignments and improve measurement accuracy!
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Top 5 Hidden Challenges of Cable Harness Design in Electronic Products
Krishna Sundaram explores the hidden challenges of cable harness design, from routing complexity to mechanical constraints and manufacturability. Learn how to design a robust and efficient harness.
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Ultra HDI: It’s Not Just Buzzword
Ultra-HDI technology is transforming PCB design, enabling unprecedented miniaturization and performance. In this article, explore what sets Ultra-HDI apart from traditional HDI and how it’s shaping the future of electronics.
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Cloud PCB Design: 5 Cloud Security Myths Debunked
This article addresses common misconceptions about cloud security in PCB design. It explains how modern cloud platforms, such as Altium 365, often provide superior security compared to traditional on-premises solutions. Key features like advanced infrastructure, granular access controls, and compliance with stringent regulations ensure the protection of valuable design data.
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Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium
Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.
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DFM/DFA Requirements in Systems Engineering
Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.
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Mastering EMI Control in PCB Design: Crosstalk Prevention for better EMI
Crosstalk control is essential for better EMI performance. Learn effective design techniques to reduce interference in the final installment of this series by Dario Fresu.
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