News & Updates

Importing file-based libraries from your local computer or network drive to your Altium 365 workspace can be done using the Library Importer. Altium’s Library Migrator was renamed Library Importer—the feature’s name was changed to conform more closely to the tool’s purpose. Not only is its name new, but our team has also made several user experience improvements. We have updated the documentation to reflect this change.

The PCB materials industry has spent significant amounts of time developing materials that provide lowest possible signal loss for products with RF applications. For high speed and high frequency designs, losses will limit signal propagation distance and distort signals, and it will create an impedance deviation that can be seen in TDR measurements. In this article, we'll look at the balance between copper foil losses and other types of losses in a PCB, as well as some strategies that are commonly used to overcome roughness.

We are happy to announce that the Altium Designer 22.8 update is now available. Altium Designer 22.8 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

In this article, we’ll look at beamforming implementation in an advanced method combining analog and digital techniques, known as hybrid beamforming. This method blends both digital and analog techniques to create multiple beams and thus reach multiple users with varying intensities. In the case of an RF imaging system or a radar system, hybrid beamforming in a MIMO technique also allows tracking of multiple targets with adjustable resolution.

Differential data transmission lines usage can be challenging for even experienced designers. First you need to be familiar with the concepts of differential data transmission, find out why it is used, and what the potential advantage for your signal. This webinar will help you determine what part of your designs need differential pairs implementations and how to create such pairs with a given wave impedance in Altium Designer.

The problem with every via impedance calculator that I have seen is simple: they are incomplete or totally wrong. The “incomplete” part refers to a lack of context; these calculators can roughly reproduce a well-known estimate from a legend like Howard Johnson in his Digital Design textbooks. However, these calculators never provide insight into what they are actually calculating, or where the calculated via impedance is accurate. Keep reading to see why these calculators get it so wrong, as well as the context surrounding via impedance.

When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer.

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Discover how short-sighted ordering practices fuel volatility in the semiconductor market and why smarter, data-driven approaches are key to building resilience and sustainability.

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

Optimizing multiboard PCB systems demands visibility across logical, physical, and manufacturing domains. This article outlines how Altium’s environment lets engineers establish system‑level schematics, 3D spatial validation, harness documentation, and synchronized outputs to streamline design and production.

If you’ve ever been frustrated by clunky PCB-to-mechanical workflows, you’re not alone. Learn why collaboration between mechanical and electrical engineers is harder than it should be and what’s behind the struggle.

Eliminate costly mismatches and assembly delays. This whitepaper shows you how to apply a unified digital thread across PCB, multi-board, and harness workflows - bridging ECAD/MCAD silos, ensuring connector accuracy, mechanical fit, and real-time collaboration for flawless system design.

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.

Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.

Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.

Dive into the power of Renesas’ RA8D1 MCU using the EK‑RA8D1 evaluation kit. Learn how to train, test, and deploy image‑based detection models seamlessly with Edge Impulse, and kickstart your embedded vision AI projects in minutes.

Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.

Discover why top electronics companies are replacing spreadsheets with purpose-built BOM management solutions. This whitepaper outlines the risks of outdated methods, offers a readiness checklist, and explores how BOM Portal helps teams cut costs, reduce risk, and speed up development with smarter, data-driven workflows.