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What is Hybrid Beamforming?
Blog
What is Hybrid Beamforming?

In this article, we’ll look at beamforming implementation in an advanced method combining analog and digital techniques, known as hybrid beamforming. This method blends both digital and analog techniques to create multiple beams and thus reach multiple users with varying intensities. In the case of an RF imaging system or a radar system, hybrid beamforming in a MIMO technique also allows tracking of multiple targets with adjustable resolution.

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On-Demand Webinar
PCB Design in Altium Designer with Differential Data Transfer

Differential data transmission lines usage can be challenging for even experienced designers. First you need to be familiar with the concepts of differential data transmission, find out why it is used, and what the potential advantage for your signal. This webinar will help you determine what part of your designs need differential pairs implementations and how to create such pairs with a given wave impedance in Altium Designer.

Is your via impedance calculator accurate?
Blog
Why Most Via Impedance Calculators Are Inaccurate

The problem with every via impedance calculator that I have seen is simple: they are incomplete or totally wrong. The “incomplete” part refers to a lack of context; these calculators can roughly reproduce a well-known estimate from a legend like Howard Johnson in his Digital Design textbooks. However, these calculators never provide insight into what they are actually calculating, or where the calculated via impedance is accurate. Keep reading to see why these calculators get it so wrong, as well as the context surrounding via impedance.

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How-To's
How to Create an Interactive PDF of a Schematic Diagram

This video shows how to create an interactive PDF using the Smart PDF Wizard.

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How to Work with Draftsman
What is the Draftsman Document?

Once your PCB layout is finished it’s time for review. This is where the Draftsman Document and Altium Designer’s Draftsman Editor comes in.

Blog
Buck Converter Simulation in Altium Designer

When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer. 

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How to work with Multiboard
Adding Project Modules to a Multi-board Schematic

If you’re using multiple PCBs in your Multi-board design, Altium Designer allows you to add existing projects directly to your schematic with modules. We’ll show you how to quickly and efficiently add these projects to your Multi-board design.

PCIe 6.0 Overview
Blog
Overview of the PCIe 6.0 Standard

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

Embedded thumbnail for Checking for Creepage in High Voltage Designs
How-To's
Checking for Creepage in High Voltage Designs

High voltage devices have leakage currents that propage over the surface of the board. In such devices, it's important to consider not only the standard gap between the two topological elements, but also the shortest possible path between them, taking into account cut-outs and holes. With Altium Designer 20, you can check for creepage using the new creepage distance rule.

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How to create a PCB Footprint
Creating BGA Footprints with the Footprint Wizard

Altium Designer makes it easy to create a BGA footprint using our IPC compliant footprint wizard. We'll show you how easily you can create and modify a BGA footprint using the footprint wizard.

SPI vs. I2C For Memory Access
Blog
SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

On-Demand Webinar
Tips & Tricks: Board Shape Creation

Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.

Blog
Is There an SPI Trace Impedance Requirement?

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

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How-To's
How to Remove Unused Pad Shapes

Unused pad shapes can cause distortion among other problems so it is best to exclude them from your designs. This video shows how to remove unused pad shapes.

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How to work with Layer Stack Manager
Stackup Presets and Templates

In this video, we will learn how to apply predefined layer stacks to the board, as well as how to save the layer stack file as a template.

The Skin Effect and EM Fields
Blog
The Skin Effect, Current Density, and the Electromagnetic Field

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

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How to create a PCB Footprint
Creating a PCB Footprint Assembly Drawing

If you need to create an assembly drawing of your PCB Footprint for your outjob files we can show you how in Altium Designer. We’ll walk through all the different options for your assembly drawing in your Draftsman document, how to create your assembly drawing and assign it designators.

Packaging for your PCBAs
Blog
What You Need for PCB Packaging and Shipping

When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.

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How-To's
Using the ActiveBOM

Using the ActiveBOM: The Bill of Materials (BOM) contains a list of all the components with their designators, part numbers, values, and other parameters. An ActiveBOM manages the mapping from the design component (part) to the part that is purchased. This video describes how to use the ActiveBOM document to create an up-to-date list of components needed for your project.

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How to work with Layer Stack Manager
Using Back Drills in your Stackup

In this video, we will learn about Back Drilling technology, how to set up back drilling using the layer stack manager, and how to set up the Stub Length sizes for back drilling by specifying applicable nets using the Design Rules Editor.

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Blog
Mastering Blind and Buried Vias

Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.

Blog
Make Sure to Clean Your No-Clean Flux

No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.

Blog
How to Design a Thermal Prototype PCB

Thermal problems in PCBs often go unnoticed until prototyping, which can be costly. Design teams can't afford endless iterations, but they can conduct lower-cost thermal prototypes. Learn more about this approach in our new article.

Blog
DC-Aware Return Current in Mixed Signal PCBs

In this article, we will examine specific cases involving these types of components, where a very low-frequency signal or a DC signal needs to be measured, and the return path must be tracked to ensure the current loop is tight.

Blog
PCB Layout Replication: The Perfect Tool for Test Jigs

Replicate your circuits across multiple blocks with just a few clicks using a flawless preview pane, ensuring consistent, perfect results without the need for trial and error. Check out our new article on the PCB Layout Replication feature.

Altium 365 GovCloud Why We Chose AWS GovCloud (US) Cover
Blog
4 Reasons Why We Chose AWS GovCloud (US) for Altium 365 GovCloud

In this blog, we explain the reasons behind our decision to operate Altium 365 GovCloud within AWS GovCloud (US). This partnership is guided by a clear vision: to provide our users with a secure, compliant, and reliable platform for sensitive electronics design data.

Blog
3D MID Design Whitepaper

Dive into a dynamic design experience where you can visualize and edit your circuits in true 3D, offering unparalleled precision. Altium Designer's 3D-MID (Mechatronic Integrated Device) Design tool revolutionizes the design process, providing a fresh perspective. Explore the capabilities and benefits of this feature in our comprehensive guide.

Blog
Types of Wiring Harnesses for Electronics

In today's world, many products utilize multiple PCBs interconnected with each other, often leading to a complex network of cables within an enclosure. The most effective way to manage these wires and cables is by constructing a wiring harness. This article explores the various types of harnesses used in electronics.

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Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Autodesk Inventor

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaboration between Altium Designer and Autodesk Inventor. 

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How to work with Variants
Variants in Output Documents

Variants can be used with output files to keep track of all the variations within your design. We’ll show you how to export these files including a Smart PDF, and an outjob file with variants.

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DFM and Fabrication Cost/Time Constraints
Copper to Edge Clearance

It is necessary to maintain edge clearance from your copper in your design. We’ll show you how to maintain it, what exceptions there are to the rule, and how you can ensure its manufacturability.

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RF PCB Design
Design RF PCB: PCB edge plating

Board edge plating provides additional noise suppression and improves EMC. This video provides some practical tips for creating metalized PCB edges in Altium Designer.

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How to work with Variants
Using Parameters in Variants

You can use parameters to change your variants in many ways, such as text and titles. We’ll show you how to alter parameters in the PCB, Schematic, and Draftsman so you can create variants with different parameters.

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Blankets
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs. 

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Query Language
Query Language: How to Easily Create Expressions

In this video the main tools which allow to simplify the process of building a query in Altium Designer will be considered. There are several such tools and each of them has its own limitations and peculiarities of use. 

Embedded thumbnail for What to Consider when Designing Edge Connectors
DFM and Fabrication Cost/Time Constraints
What to Consider when Designing Edge Connectors

If your design requires edge connectors there are a few important things to consider. We’ll walk you through how to make sure your design with edge connectors is easy and manufacturable.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
RF PCB Design
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for Variants in Schematic Editor
How to work with Variants
Variants in Schematic Editor

You can quickly create and edit variants with the schematic Editor in Altium Designer. We’ll show you how to create and edit the variants in the schematic editor by utilizing the parameter variation tool, the edit component variation tool, part actions, toggling fitted or non fitted, and the variant manager.

Relative Length Tuning
What's New in 22.3
Relative Length Tuning

Designing high-speed PCB just got easier. The Length Tuning tools is now even more functionality. Complex tasks can now be solved even faster.

Relative Length Tuning
What's New in 22.3
相对长度调节

高速PCB设计变得更加轻松。Length Tuning工具现在具有更多功能。现在可以更加快速地解决复杂任务。

Enhanced UI for Via Stack Editing
What's New in 22.3
Enhanced UI for Via Stack Editing

The via editing mode is now even more convenient. Information about the via, editing its parameters and connections to polygons are now all in a new and simple, but familiar form.

Enhanced UI for Via Stack Editing
What's New in 22.3
可用于过孔堆栈编辑的增强型UI

过孔编辑模式现在更加便于使用。有关过孔、其参数编辑以及与多边形铺铜连接的信息,现在均将以一种全新、简单但熟悉的形式出现。

Generic Components
What's New in 22.3
Generic Components

The way from idea to real devices has become shorter. The new feature will reduce the time it takes to design a schematic.

Generic Components
What's New in 22.3
通用元件

从产生创意到变为实物所需的路程将越来越短。新功能将有助于缩短进行原理图设计所需的时间。

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