News & Updates
In this blog, we explain the reasons behind our decision to operate Altium 365 GovCloud within AWS GovCloud (US). This partnership is guided by a clear vision: to provide our users with a secure, compliant, and reliable platform for sensitive electronics design data.
Magnetic components driven by an AC signal can exhibit an irritating property due to magnetostriction - an effect causing vibrations in magnetic materials, resulting in audible sound. Explore this phenomenon further and discover methods to minimize its impact.
Dive into a dynamic design experience where you can visualize and edit your circuits in true 3D, offering unparalleled precision. Altium Designer's 3D-MID (Mechatronic Integrated Device) Design tool revolutionizes the design process, providing a fresh perspective. Explore the capabilities and benefits of this feature in our comprehensive guide.
In today's world, many products utilize multiple PCBs interconnected with each other, often leading to a complex network of cables within an enclosure. The most effective way to manage these wires and cables is by constructing a wiring harness. This article explores the various types of harnesses used in electronics.
Z2Data Integration in Altium 365 offers a practical way forward for engineering and procurement. Here are the top five advantages that can streamline your workflows.
Are you curious about how Altium Designer's PLM integration is revolutionizing electronics design? Bid farewell to inefficiencies and expensive revisions, and embark on discovering the cutting-edge approach to managing design data. Dive into our latest article to learn how to leverage this new standard in design data management.
Level up your design skills with Altium Designer 24 training! Whether you're looking to brush up on the basics or delve into advanced techniques, our instructor-led or on-demand videos will help you master the latest features.
Discover how Altium 365 can be your ally in making agile hardware development a practical reality.
Experience seamless acceleration in your design workflow with Altium Designer® 24's PCB Layout Replication feature. Effortlessly duplicate layouts for recurring circuit blocks and component groups, amplifying efficiency and reducing expenses.
Watch the webinar to learn how the SiliconExpert Integration in Altium 365 can optimize your workflows and elevate your design process. Start making data-driven design decisions today!
Here's how Altium 365 GovCloud protects your sensitive electronics design data. Learn more about our encryption technologies, access restrictions, and network security standards.
Make decisions that balance cost-efficiency with uncompromised security. Find ways to ensure your data security measures are both strong and economically viable.
Explore our manual on the Custom Pad Stack enhanced feature. From thermal connections to pad shapes, every detail matters. Pads are no longer merely points; they demand unique, tailored solutions. With Altium Designer 24, you can customize pad shapes, fine-tune thermal relief, and master rounded/chamfered rectangle pads to meet manufacturing standards, conquer tight spaces, and elevate your design game significantly.
Is juggling multiple ECAD file formats slowing down your team? If so, watch this webinar and learn how to remove ECAD data silos to enhance design collaboration, efficiently manage all your BOMs, and reduce supply chain risks with Altium 365 Multi-CAD File Support.
Stubs are an important topic in high-speed PCB design, and there is a longstanding guideline that stubs should always be removed from all vias on high-speed digital interconnects. While stubs are bad for high-speed lines, they do not always need to be removed. What is more important is to predict the loss profile and frequencies, and to floorplan appropriately to try and prevent such losses.
Once you finish your placement and routing in your PCB layout, it can be tempting to wrap up the layout and send everything in directly to manufacturing. The reality is that the board may still need some work before it is considered finished. The cleanup you perform at the final stage of PCB layout will help you catch any outstanding errors that can't be programmed into your DRC engine, and it gives you a chance to add any outstanding details to the surface layers.
In this project we’ll be building a moderate sized LED panel on insulated metal substrate (IMS). This light panel has three different white balance High CRI LED types on it, warm, neutral and cool. By changing the brightness of the different white balances, the light from the panel can be adjusted to match other lighting, making it perfect for film use - but also creating perfect lighting for electronics work. As with all my projects, this LED panel is open source, you can find the Altium project files over on my GitHub released under the permissive MIT License.
Every design should begin with selecting the materials that will appear in the PCB stackup, as well as arranging layers in the stackup to support layout and routing. This section of our PCB manufacturing andc DFM crash course focuses on selecting the right materials for your PCB design. Materials should be selected given the particular design requirements outlined in your specifications.
FPGAs come in quad or BGA packages that can be difficult to floorplan, especially with the high number of I/Os often implemented in these components. FPGAs offer a lot of advantages in terms of their reconfigurability, but they can require a lot of effort to layout and route without headaches. If you’ve never worked with an FPGA in your PCB layout, we have some guidelines that can help you get started.
S-parameters are fundamental quantities in signal integrity, and an ability to understand them from measurement or analysis is very important. If you have a 3-port network, like a power divider or circulator, it may appear that you must use a 3-port VNA to measure these S-parameters. It is always acceptable to measure between two ports, but you need to know what exactly it is you are measuring. In this article, we’ll look at the relationship between the true 3-port S-parameters with a 2-port measurement.
Before implementing design for manufacturing, it is important to understand the underlying process behind producing a physical PCB. Regardless of the various technologies present in each facility, a large majority of industry-leading manufacturers follow a specific set of steps to turn your design from a drawing in a CAD application into a physical board. In this article, we'll cover the basics that designers need to know as part of our crash course series on PCB manufacturing.
If you compile a list of skew sources, you'll see that fiber weave-induced skew is only one entry on a long list of skew sources. We'll look at this list of possible skew sources below, and we'll see how they affect the operation of your PCB. From the list below, we'll see that some of these issues with skew are not simply solved by paying attention to the fiber weave construction in a PCB substrate.
We love answering questions from our readers and YouTube viewers, and one of the recent questions we received relates to EMI from switching elements in a switching regulator is "Should a cutout be placed below the inductor in a switching regulator circuit?". Despite the variations in inductors and their magnetic behavior, there are some general principles that can be used to judge the effects of placing ground near inductors in switching regulator circuits. We’ll look at some of these principles in this article
We are happy to announce that the Altium Designer 22.6 update is now available. Altium Designer 22.6 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Find 9 mistakes in a PCB design and get added into the lucky draw to win a prize from Altium!
This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.