News & Updates

Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.

Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.

Crosstalk control is essential for better EMI performance. Learn effective design techniques to reduce interference in the final installment of this series by Dario Fresu.

Part 2 of this series covers essential project management techniques for electronics design teams. Rafał Stępień discusses effective data organization, revision control, and collaboration strategies to improve efficiency and minimize errors.

Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.

Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.

Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.

Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.

Discover how wire harnesses are evolving to meet the demands of electric vehicles and modern electronics. Our latest article explores key trends like higher voltages, lightweight designs, and smart harnesses, along with challenges such as cost and supply chain issues.

Dario Fresu explores effective decoupling strategies for power distribution networks (PDNs) to minimize EMI in PCB designs. The article covers techniques like decoupling capacitors and power planes to ensure stable power delivery for integrated circuits.

Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.

In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.

When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.

Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.

Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.

Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.

Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.

As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.

Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.

High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.

As robotics systems become increasingly miniaturized and intricate, ensuring perfect fit, form, and function across electrical and mechanical domains is critical to avoid design setbacks. Real-time ECAD-MCAD integration with two-way sync empowers teams to streamline workflows, reduce PCB rework, and deliver more reliable designs faster.

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Discover how short-sighted ordering practices fuel volatility in the semiconductor market and why smarter, data-driven approaches are key to building resilience and sustainability.

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

Optimizing multiboard PCB systems demands visibility across logical, physical, and manufacturing domains. This article outlines how Altium’s environment lets engineers establish system‑level schematics, 3D spatial validation, harness documentation, and synchronized outputs to streamline design and production.

If you’ve ever been frustrated by clunky PCB-to-mechanical workflows, you’re not alone. Learn why collaboration between mechanical and electrical engineers is harder than it should be and what’s behind the struggle.