Welcome, Guest

Sign in to learn, create, and do more with the product you love.

News & Updates

Filters:
Tag
IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

Embedded thumbnail for How to Work with The Polygon Manager
Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

Article preview
On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Tag
Article preview
Blog
The Great PCB Layout "Rules of Thumb" Debate Rages On

To this day, I still see many PCB layout “rules of thumb” that first became common nearly 20 years ago. Do these rules still universally apply? The answer is a firm “maybe.” The discussion around PCB layout rules of thumb is not that these rules are correct or incorrect. The problem is that the discussion around these rules often lacks context, leading to the always/never type of discussion seen in some popular forums. My goal in this article is to communicate the context behind the common PCB design rules.

Article preview
Blog
How to Design Your PCB Test Coupon and What You Can Test

As the operating speed of components has increased, controlled impedance is becoming more common in digital, analog, and mixed-signal systems. If the controlled impedance value for an interconnect is incorrect, it can be very difficult to identify this problem during an in-circuit test. However, testing is normally performed on a PCB test coupon, which is manufactured on the same panel as the PCB. If you want to get through board spins quickly and aid future designs, you might consider designing a test coupon and keeping it handy for future designs.

Article preview
Blog
Altium DbLibs and Electronic Components in the Cloud with Altium Designer 20.1

Altium’s DbLib support is one of the oldest and most loved features of Altium Designer for managing electronic components and their data. They’ve been present in the software world since before I could fathom the existence of Ohm’s law. Altium 20.1’s new Component Sync feature allows you to synchronize virtually any database or database Library with Altium 365, taking advantage of both approaches strengths.

Article preview
Blog
What is a Schematic Netlist for Your PCB?

If you’ve created your next great schematic, there is a lot going on behind the scenes in your design software. A schematic netlist is one of the central pieces of information that will be used in multiple features in your design software to create a real PCB. Your schematic netlist provides both electrical connectivity information, and reflects the functional structure of your design data in a single set of data.

Article preview
Blog
How to Select an Inductor for a Buck Converter

An SMPS is one of those quiet (yet electrically noisy) devices that makes your favorite electronics run smoothly. Among the numerous DC-DC converter topologies, a buck converter finds plenty of uses for stepping down the input voltage to a lower level while providing high efficiency power conversion. A common question around component selection for these power converters is how to select an inductor for a buck converter. The goal in working with an inductor and other components in a buck converter is to limit power loss to heat and while minimizing current ripple.

Article preview
Blog
US Department of Transportation Seeking Alternatives to GPS

GPS-capable devices range from your phone to your smartwatch; simply type in your destination and follow the directions. Simple, right? According to the Washington Post, we should all stop using GPS as it’s ruining the navigation centers of our brains. Despite the neurological effects on perception and judgment, the U.S. Department of Transportation (DOT) aims to find alternatives to GPS to provide redundancy.

Article preview
Blog
Bluetooth 5.1 SoC vs. Module: Which is Best for Your Design?

The list of features available in Bluetooth just got a little longer since the release of Bluetooth 5.1. If you want to incorporate a Bluetooth 5.1 SoC into your new product, you have two primary options for bringing this component into your board. The first is as an SoC that mounts to your board just like any other component. The other option is to bring a module into your new board—directly onto the surface layer. Here’s what you need to know about a Bluetooth 5.1 SoC or module in your next IoT product.

Article preview
Blog
USB Power Delivery for Your Next Project

Since its introduction in the late 90s, the USB standard has never ceased to grow in popularity. There has been a growing trend toward USB being a power delivery interface with data, rather than a data interface that can supply power, as the 1.0 specification originally intended. To supply the increasing thirst for power over USB, the USB 3.0 Spec with Type-C began implementing the Power Delivery standard, which you should consider using for your next electronics project.

Article preview
Blog
Circuit Board Design for In-Circuit Testing

There are many types of circuit board tests available in electronics manufacturing today, each having unique goals and characteristics. This article presents guidelines at the design level (schematic and layout) to enable the use of in-circuit testing (ICT) fixtures to verify proper component assembly. These simple test fixtures allow your board to be tested as its assembled, which helps identify and remove failed boards from your production run.

Article preview
Blog
Planning for the Future with Cirris Systems and Altium

Technological advancements have been a hallmark of the past few decades, from the widespread adoption of internet technology to the smartphones and wireless devices we rely on every day to stay connected. Orlan Thatcher, Board Layout Specialist at Cirris Systems, could never have predicted the demand their services would generate. The company struggled with six different software platforms before switching to Altium Designer.

Article preview
Blog
An Introduction to NFC

I used to work in a research lab that worked primarily with RFID (Radio Frequency IDentification) and NFC (Near Field Communication) technology, particularly for the agriculture industry and cattle identification. These were very specialized fields; however, the lab also worked on projects which involved retail and various other applications for NFC. It’s an amazing technology that you might be using every day without thinking about it - building access to your mobile phone payments, for instance. 

Article preview
Blog
Editing Your PCB Geometry with MCAD Tools

You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically. This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.

Blog
The PCB Fabrication Process — what Every Design Engineer Needs To Know, Part 2

In Part 1 of this article, I described the first steps that occur during the PCB fabrication process. They detailed the inner layer processing effort as well as the efforts that take place during the transition from inner layer processing to lamination. This part of the article will provide a detailed description of the lamination, drilling and plating processes.

Blog
The PCB Fabrication Process—What Every Design Engineer Needs To Know, Part 1

There are still a number of designers - perhaps most of them - who have never toured a PCB fabrication facility. They are also unaware of the various steps that occur during the fabrication process. The purpose of this article is to describe those steps and what transpires in each of them. Part 1 of this article focuses on inner layer processing and the steps that are done prior the lamination process.

Article preview
Blog
Webinar "8 Reasons to Store Your Components in Altium 365"

Working with local libraries seems like a simple solution, but we often don’t take into account the added time spent maintaining libraries and sharing them between team members. This webinar showcases the advantages of component storage in Аltium 365 to resolve the issues of local libraries and component management.

Tag
Embedded thumbnail for MCAD CoDesigner Quick Start: PTC Creo
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: PTC Creo

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and PTC Creo

Embedded thumbnail for Variants in Multi-Channel Designs
How to work with Variants
Variants in Multi-Channel Designs

Multi-channel designs can utilize variations in the channels to reduce design time and sheet count. We’ll show you how to take advantage of this by configuring several types of components.

Embedded thumbnail for Stackup Considerations
DFM and Fabrication Cost/Time Constraints
Stackup Considerations

There is a lot to consider about the Layer Stackup when it comes to designing a manufacturable board. We’ll walk you through enabling symmetry, finding correct balance of your layers, materials, creating and loading templates, and adding a layer stack table for better communication between you and your manufacturer.

Embedded thumbnail for What Are Design Variants For?
How to work with Variants
What Are Design Variants For?

Variants in Altium Designer allow you to create several variations of the same design all from one source project. Variants can be managed in the project and through Altium Designer you can control variants in the PCB, Schematic, Draftsman, and Outjob files to make your designs easily editable without redundancy.

Embedded thumbnail for MCAD CoDesigner Quick Start: Solidworks
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Solidworks

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and SolidWorks. 

Embedded thumbnail for Panelization
DFM and Fabrication Cost/Time Constraints
Panelization

When you go to manufacture your design you can get a board manufactured by itself or with multiple in a panel. We’ll show you the how and the why to create panelization with the Embedded Board Array/Panelize tool, as well as how to create break away points for your individual boards.

Embedded thumbnail for Display Variants in Draftsman Document
How to work with Variants
Display Variants in Draftsman Document

You can use the draftsman document to display your board variants. We’ll show you how to create a draftsman document and add variants to it properly displayed and editable through the properties panel.

Embedded thumbnail for How to print PCB?
How-To's
How to print PCB?

Do you want to know how to use the updated document output feature? This video tells about the changes to the document output and shows how to quickly form a PDF or print a PCB in Altium Designer 21.

Embedded thumbnail for Avoid Solder Wicking
DFM and Fabrication Cost/Time Constraints
Avoid Solder Wicking

If solder gets sucked into via holes in can cause an unreliable connection in your otherwise manufacturable design. We’ll show you a few easy ways to avoid this solder wicking using rules.

Display of Alternate Component Parameters
What's New in 22.4
Display of Alternate Component Parameters

Many schematic solutions are created as multivariant. With the new release, the schematic of multivariant project have become even more detailed and informative.

Display of Alternate Component Parameters
What's New in 22.4
备用元件参数显示

很多原理图解决方案均以多变量形式创建。随着新版本的发布,将提供更加详细和翔实的多变量项目原理图。

Components from Altium 365
What's New in 22.4
Components from Altium 365

Working with multiboards has become easier and more convenient. Now you have more component sources at your disposal.

Components from Altium 365
What's New in 22.4
Altium 365 元件

进行多板处理将变得更加轻松、方便。现在可供您使用的元件源将更多。

New Design Reuse Functionality
What's New in 22.4
New Design Reuse Functionality

A reuse bloks help reduce development time and avoid errors. The new Design Reuse Panel and new functionality expands the possibilities for reuse blocks and snippets.

New Design Reuse Functionality
What's New in 22.4
新的设计复用功能

复用块将有助于缩短开发时间并避免错误。新Design Reuse Panel和新功能,扩大了复用块和片段的使用范围。

Embedded thumbnail for MCAD CoDesigner Quick Start: Autodesk Inventor
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Autodesk Inventor

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaboration between Altium Designer and Autodesk Inventor. 

Tag
Your search returns no results.