News & Updates

Pi Filters are a type of passive filter that gets its name from the arrangement of the three constituent components in the shape of the Greek letter Pi (π). Pi filters can be designed as either low pass or high pass filters, depending on the components used. The low-pass filter used for power supply filtering is formed from an inductor in series between the input and output with two capacitors, one across the input and the other across the output. Keep reading to learn more about their application in the PCB Design.

The first question that should come up when selecting materials and planning a stackup is: what materials are needed and how many layers should be used? Assuming you’ve determined you need a low-loss laminate and you’ve determined your required layer count, it’s time to consider whether you should use a hybrid stackup. There are a few broad situations where you could consider using a hybrid stackup with low-loss laminates in your PCB

Batteries offer a great power source for electrical devices that need to be mobile or located somewhere where connection to a mains electricity supply or other power source is impossible. The biggest problem with battery power is the expectation of users that the device will operate for significant periods with the need for recharging or replacing the batteries. This demand is placing the onus on the designer to improve efficiency and reduce power demand to meet this need.

A number of us on this blog and in other publications often bring up the concept of target impedance when discussing power integrity in high-speed designs. Some designs will be simple enough that you can take a “set it and forget it” approach to design a functional prototype. For more advanced designs, or if you’re fine-tuning a new board that has existing power integrity problems, target impedance is a real consideration that should be considered in your design.

Dual power supplies are circuits that generate two different output voltages from a single input source. The simplest method of generating dual output voltages is to use a transformer with two taps on the output winding. Bespoke transformers can have any voltage ratio depending on the number of windings in each part of the output side of the transformer.

With digital boards that are nominally running at DC, splitting up a power plane or using multiple power planes is a necessity for routing large currents at standard core/logic levels to digital components. Once you start mixing analog and digital sections into your power layers with multiple nets, it can be difficult to implement clean power in a design if you’re not careful with your layout.

Working between the Electronic and Mechanical design domains brings unique challenges. ECAD and MCAD tools have different design objectives and have evolved down different paths, and so have the way they store and manage their design and project data. To successfully design these products, the designers must fluidly pass design changes back and forth between the ECAD and MCAD domains beyond outdated file exchanges.

High-speed digital PCBs are challenging enough to design, but what about mixed-signal boards? Many modern systems contain elements that operate with both digital and analog signaling, and these systems must be designed to ensure signal integrity in both domains. Altium Designer has the layout and signal integrity tools you need to ensure your mixed-signal PCB design does not experience interference and obeys important design standards.

Just as WiFi 6 and 6E are starting to hit the market and new chipsets become available, WiFi 7 is in the works under the 802.11be standard. While this technology still has not hit the market, I would expect more inquiries for experimental systems, evaluation modules, and surface-mountable modules to come up once the first chipsets become available. Now is the time to start thinking about these systems, especially if you’re developing evaluation products to support WiFi 7.

Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.

There are many quality checks used to ensure a design will be manufacturable at scale and with high quality, but a lot of this can happen in the background without the designer realizing. No matter what level of testing and inspection you need to perform, it’s important to determine the basic test requirements your design must satisfy and communicate these to your manufacturer. If it’s your first time transitioning from prototyping to high-volume production, read our list of PCB testing requirements so that you’ll know what to expect.

Discover how modern wire harness engineering is evolving to meet the growing complexity of electrified systems. This whitepaper explores best practices, intelligent automation, and ECAD-MCAD collaboration to improve efficiency and reduce errors. Download now to stay ahead in an increasingly connected world.

Ultra-HDI technology is transforming RF design by enabling finer line widths, improved signal integrity, and more compact, high-performance boards. Our brand-new article explores its advantages over traditional methods and the benefits of integrating flexible circuits.

Testpoints are essential for efficient PCBA testing and debugging. Our latest whitepaper dives into testpoint optimization, fault detection, and automated testing strategies, along with a full tutorial on using Testpoint Manager in Altium Designer. Discover how to streamline your testpoint assignments and improve measurement accuracy!

Krishna Sundaram explores the hidden challenges of cable harness design, from routing complexity to mechanical constraints and manufacturability. Learn how to design a robust and efficient harness.

Ultra-HDI technology is transforming PCB design, enabling unprecedented miniaturization and performance. In this article, explore what sets Ultra-HDI apart from traditional HDI and how it’s shaping the future of electronics.

This article addresses common misconceptions about cloud security in PCB design. It explains how modern cloud platforms, such as Altium 365, often provide superior security compared to traditional on-premises solutions. Key features like advanced infrastructure, granular access controls, and compliance with stringent regulations ensure the protection of valuable design data.

Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.

Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.

Crosstalk control is essential for better EMI performance. Learn effective design techniques to reduce interference in the final installment of this series by Dario Fresu.

Part 2 of this series covers essential project management techniques for electronics design teams. Rafał Stępień discusses effective data organization, revision control, and collaboration strategies to improve efficiency and minimize errors.

Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.

Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.

Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.

Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.

Discover how wire harnesses are evolving to meet the demands of electric vehicles and modern electronics. Our latest article explores key trends like higher voltages, lightweight designs, and smart harnesses, along with challenges such as cost and supply chain issues.

Dario Fresu explores effective decoupling strategies for power distribution networks (PDNs) to minimize EMI in PCB designs. The article covers techniques like decoupling capacitors and power planes to ensure stable power delivery for integrated circuits.