News & Updates
Once your board passes through the standard PCB fabrication process, the bare copper in your PCB will be ready for the application of a surface finish. PCB plating is applied to protect any copper in your PCB that would be exposed through the solder mask, whether it’s a pad, via, or other conductive element. In this article, I’ll run over the different PCB plating material options and their advantages in your PCB.
The PCB supply chain encompasses multiple components, raw materials, and the PCB itself. PCBs and PCB assemblies are often the most technically complex components that are purchased for electronic assemblies and products. The complexity of modern PCBs leads to several challenges for a supply chain management team that may be significantly different when compared with other commodities the team manages. In this brief guide, we'll look in-depth at the PCB supply chain, and specifically what falls within the purview of a procurement and supply chain management team.
On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.
There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.
If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.
In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.
The primary goal of your traces is to carry signals throughout your board without losses. To do this properly, you must familiarize yourself with the requirements for signals on the printed circuit board and how to optimize the topology of the board in terms of signal integrity. We will analyze the most popular routing cases applicable for using the Gloss and Retrace tools in Altium Designer to optimize your signal integrity.
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.
Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.
As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.
Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.
High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.
As robotics systems become increasingly miniaturized and intricate, ensuring perfect fit, form, and function across electrical and mechanical domains is critical to avoid design setbacks. Real-time ECAD-MCAD integration with two-way sync empowers teams to streamline workflows, reduce PCB rework, and deliver more reliable designs faster.
We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.
Discover how short-sighted ordering practices fuel volatility in the semiconductor market and why smarter, data-driven approaches are key to building resilience and sustainability.