News & Updates
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Top 5 Hidden Challenges of Cable Harness Design in Electronic Products
Krishna Sundaram explores the hidden challenges of cable harness design, from routing complexity to mechanical constraints and manufacturability. Learn how to design a robust and efficient harness.
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Ultra HDI: It’s Not Just Buzzword
Ultra-HDI technology is transforming PCB design, enabling unprecedented miniaturization and performance. In this article, explore what sets Ultra-HDI apart from traditional HDI and how it’s shaping the future of electronics.
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Cloud PCB Design: 5 Cloud Security Myths Debunked
This article addresses common misconceptions about cloud security in PCB design. It explains how modern cloud platforms, such as Altium 365, often provide superior security compared to traditional on-premises solutions. Key features like advanced infrastructure, granular access controls, and compliance with stringent regulations ensure the protection of valuable design data.
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Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium
Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.
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DFM/DFA Requirements in Systems Engineering
Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.
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Mastering EMI Control in PCB Design: Crosstalk Prevention for better EMI
Crosstalk control is essential for better EMI performance. Learn effective design techniques to reduce interference in the final installment of this series by Dario Fresu.
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Best Practices for Electronics Project Management - Part 2
Part 2 of this series covers essential project management techniques for electronics design teams. Rafał Stępień discusses effective data organization, revision control, and collaboration strategies to improve efficiency and minimize errors.
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Rigid-Flex PCBs: Understanding the Pros, Cons, and Fabrication Considerations
Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.
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The Role of Automation & Robotics in Wire Harness Assembly
Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.
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Best Practices for Electronics Project Management - Part 1
Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.
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How to Manage ECAD Libraries for Consistent PCB Layout Design
Strong hardware starts with strong libraries. Discover how disciplined ECAD-library management dramatically improves design consistency and accelerates every stage of your PCB workflow.
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High Speed PCB Design Review: Signal Integrity Questions You Should Always Ask
As data rates increase, the risks hidden in your layout grow with them. This quick guide highlights the critical SI checkpoints that can save you from late-stage surprises and redesigns. If you design high-speed boards, you’ll want to read this before your next review.
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Supplier Negotiation: Turn Market Data Into Your Best Negotiation Tool
Don’t walk into supplier talks blind. Use market data to benchmark quotes, check lead times and uncover alternate parts. This article shows how visibility can shift the balance and de-risk your BOM.
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Via-in-Pad in Rigid-Flex Designs: When Space Is Tight, Details Matter
Designing rigid-flex boards is like solving a 3D puzzle of materials, bends and tight spaces, and via-in-pad might just be the piece you need. Dive into how and when to use via-in-pad in rigid-flex designs, and what to watch out for from fabrication to field reliability.
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Wearable Electronics: Innovations, Challenges & Future Trends
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
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Streamlining Component Selection for Long Product Lifecycles
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
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Using ECAD Software to Track Part Availability During PCB Design
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
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PCB Design Data Management Tips for Multi-Board Projects
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
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6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
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What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
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Requirements Portal Introductory Tutorials
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
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Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
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Bridging Mechanical and Electrical Teams for Smarter Automotive Design
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
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Via Structures: Designing for Reliability, Not Just Density
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
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How Structural Electronics Enables 3D, Flexible, and Wearable Integration
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
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Beyond Traces: Why Soldermask May Be the Critical Factor in Ultra HDI
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
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