News & Updates

Just as WiFi 6 and 6E are starting to hit the market and new chipsets become available, WiFi 7 is in the works under the 802.11be standard.  While this technology still has not hit the market, I would expect more inquiries for experimental systems, evaluation modules, and surface-mountable modules to come up once the first chipsets become available. Now is the time to start thinking about these systems, especially if you’re developing evaluation products to support WiFi 7.

Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.

There are many quality checks used to ensure a design will be manufacturable at scale and with high quality, but a lot of this can happen in the background without the designer realizing. No matter what level of testing and inspection you need to perform, it’s important to determine the basic test requirements your design must satisfy and communicate these to your manufacturer. If it’s your first time transitioning from prototyping to high-volume production, read our list of PCB testing requirements so that you’ll know what to expect.

Embedded computers, vision devices, DAQ modules, and much more will all need some memory, whether it’s a Flash chip or a RAM module. Normally, something like a Flash memory chip or a small eMMC module would not be used for temporary storage as the device requires constant rewrites. Instead, if you happen to need a volatile memory solution, you would go for static (SRAM) or dynamic RAM (DRAM). If you need to decide which type of memory to use in your board, keep reading to see some of the basic design guidelines for SDRAM vs. DDR memory modules.

Using a PCB ground plane in a stackup is the first step towards ensuring power and signal integrity, as well as keeping EMI low. However, there are some bad myths about ground planes that seem to persist, and I’ve seen highly experienced designers make some simple mistakes when defining grounds in their PCB layouts. If you’re interested in preventing excess emissions and ensuring signal integrity in your layout, follow these simple guidelines for implementing a PCB ground plane in your next board.

As much as we’d like, the power we supply to electronics isn’t always stable. Real power sources contain noise, they might exhibit power instability, or they dropout unexpectedly. Thankfully, we have power regulators to help prevent some of these problems. For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs. 

Post-layout simulators for your PCB are very valuable tools. If you’re working through a complex design, it’s a good idea to put it through some level of simulation and analysis to evaluate the design before manufacturing. This is all easy with the cloud collaboration tools in Altium 365 and Ansys field solvers thanks to the EDB Exporter utility in Altium Designer. These existing tools in Altium Designer and any of the Ansys field solver utilities give you a simplified way to share design data, EDB files, and simulation results with anyone on your design team. 

Experienced fabricators will tell you: any design could have some hidden DFM problem that will interfere with manufacturability, quality, or yield. Making use of your design rules is just the start of preventing DFM problems, you’ll want to collaborate with your manufacturer throughout the design process if you want to spot and correct DFM problems. Within Altium Designer, there are multiple reports you can generate for your projects that will help you summarize important information on your board for a client or a manufacturer.

With modern systems running at higher frequencies, incorporating multiple wireless protocols, and interfacing with many analog sensors, advanced designs require knowledge from digital and RF design disciplines. If you’re now starting to work in the RF realm and you need to design an all-analog or mixed-signal system, RF PCB layout will need to become a new specialty. If you’re a digital designer and you’re now jumping into high-frequency analog design, keep reading to learn more about RF PCB layout and routing.

If you take a look at any guidelines for controlled impedance traces, you’ll clearly see that the trace width is calculated without any ground pour near the trace. However, most designers will state that unused areas on each PCB layer should be filled in with grounded copper pour. If you bring some ground pour near a microstrip, you’ve now formed a coplanar waveguide arrangement. So now the question becomes, how much microstrip to ground clearance do you need to ensure you’ve hit your impedance goals?

In this article, I want to briefly focus on how power supplies and regulators are different, although this should already be clear to most designers. For a power supply and for a PCB with an on-board regulator, the switching regulator layout will be a major determinant of overall system performance. Therefore, we’ll largely look at some layout guidelines for switching power supplies in terms of regulator layout.

Altium 365 is giving design teams a new way to share and manage their design data. Most users are probably aware of project-level and component-level PCB sharing features, but sharing actually extends down to the level of individual files thanks to the managed content system within Altium 365. If you’ve ever wanted a single place to store and manage all of your design data, then Altium 365 is here to help you and your team stay organized.

Power supplies are one of those systems we all tend to take for granted. Everyone’s first task in power supply design is usually to ensure the voltage and current output reach the desired level, probably followed by thermal considerations. However, due to safety issues, EMC requirements, the use of higher PWM frequencies, and the need for smaller packaging, power supply EMI should be a major design consideration. With that being said, what are the major sources of power supply EMI, and how can power supply designers keep them in check?

Designing footprints is a job most people hate. It’s tedious, time-consuming, and doesn’t result in much except, well, a footprint. Companies now realize this pain point and offering designers free, well-designed PCB footprints. Why would they spend their time doing this? In this article, we’re going to review some of the free offerings that exist within the PCB design community. Once you’re armed with this information, you will spend most of your time designing and routing boards instead of pulling your hair out creating footprints all day.

The majority of our PCB designs sit as a single PCB under our Altium Designer projects. It sometimes happens that we have a single project that requires multiple PCBs with various stuffing options, but when it happens, a lot of us tend to get stuck. How do you handle the exact change across both projects? How do you guarantee those changes to be identical? This article will review an approach to managing multiple PCB designs within a single project, ensuring your single source of truth.

The next stage in the evolution of mobile telephony is here with the roll-out of 5G. The designer looking to incorporate functionality to handle 5G signals into their circuits will face some challenging issues. So, what’s so special about 5G?

The maximum PCB trace length you can place between two components depends on multiple factors, such as signaling protocol, component specification, losses in PCB laminate, and skew. With all this in mind, let’s look at where losses accumulate along the channel.