Welcome, Guest

Sign in to learn, create, and do more with the product you love.

News & Updates

Filters:
Tag
Article preview
Blog
How Do Capacitor Mounting Structures And Footprints Impact Total Inductance?

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

Article preview
Blog
How to Perform Differential Pair Tuning in Altium Designer 20

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

Blog
Driving Haptic Vibration and Feedback in Wearables

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

Article preview
Blog
Back Drilling Example in Altium Designer: One of the Easiest Ways to Improve Signal Integrity

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

Article preview
On-Demand Webinar
Editing Your PCB Geometry with MCAD Tools

You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically.

This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.

Article preview
Blog
Is it Simultaneous Switching Noise or Crosstalk?

Going deeper into crosstalk, there is always the issue of verifying EMI/EMC compliance through test and measurement. With the multitude of signal integrity problems that can arise in real PCBs, how can the astute designer distinguish them all? Some problems are clearer than others, with specific signal integrity measurements being developed for testing and measuring particular aspects of signal behavior. The fact is, multiple signal integrity problems could be present on a single interconnect simultaneously.

Article preview
Blog
Sharing PCB Data with Manufacturers in the Cloud

Once you’ve finished your new project and you’re ready to push it to your manufacturer, you’ll normally be stuck in an endless email chain with an engineer, or you’ll have to share cloud links with each other. The cloud sharing and design release tools in Altium Designer and Altium Concord Pro are a huge help in this area. In this post, I’m going to take an existing project I’ve worked with in a number of recent blogs, create some fabrication and assembly documentation, and finally push this data to a manufacturer using Altium Concord Pro.

Article preview
Blog
The Great PCB Layout "Rules of Thumb" Debate Rages On

To this day, I still see many PCB layout “rules of thumb” that first became common nearly 20 years ago. Do these rules still universally apply? The answer is a firm “maybe.” The discussion around PCB layout rules of thumb is not that these rules are correct or incorrect. The problem is that the discussion around these rules often lacks context, leading to the always/never type of discussion seen in some popular forums. My goal in this article is to communicate the context behind the common PCB design rules.

Article preview
Blog
How to Design Your PCB Test Coupon and What You Can Test

As the operating speed of components has increased, controlled impedance is becoming more common in digital, analog, and mixed-signal systems. If the controlled impedance value for an interconnect is incorrect, it can be very difficult to identify this problem during an in-circuit test. However, testing is normally performed on a PCB test coupon, which is manufactured on the same panel as the PCB. If you want to get through board spins quickly and aid future designs, you might consider designing a test coupon and keeping it handy for future designs.

Embedded thumbnail for Creating Differential Pairs in the PCB
How to Work with Differential Pairs
Creating Differential Pairs in the PCB

Learn how to create differential pairs in the PCB.

Article preview
Blog
Altium DbLibs and Electronic Components in the Cloud with Altium Designer 20.1

Altium’s DbLib support is one of the oldest and most loved features of Altium Designer for managing electronic components and their data. They’ve been present in the software world since before I could fathom the existence of Ohm’s law. Altium 20.1’s new Component Sync feature allows you to synchronize virtually any database or database Library with Altium 365, taking advantage of both approaches strengths.

Embedded thumbnail for From The Beatles to the PCB - VOX Story
Success Stories
From The Beatles to the PCB - VOX Story

Dave Clarke, R&D manager for VOX, walks us through his story of designing VOX amplifiers for electronic instruments as well as his love for music and electronics design. Be sure to subscribe to the Altium Stories channel to stay updated on new videos. Altium LLC is accelerating the pace of innovation through electronics. From individual inventors to multinational corporations, more PCB designers and engineers choose Altium software to design and realize their ideas. 

Article preview
Blog
What is a Schematic Netlist for Your PCB?

If you’ve created your next great schematic, there is a lot going on behind the scenes in your design software. A schematic netlist is one of the central pieces of information that will be used in multiple features in your design software to create a real PCB. Your schematic netlist provides both electrical connectivity information, and reflects the functional structure of your design data in a single set of data.

Article preview
Blog
How to Select an Inductor for a Buck Converter

An SMPS is one of those quiet (yet electrically noisy) devices that makes your favorite electronics run smoothly. Among the numerous DC-DC converter topologies, a buck converter finds plenty of uses for stepping down the input voltage to a lower level while providing high efficiency power conversion. A common question around component selection for these power converters is how to select an inductor for a buck converter. The goal in working with an inductor and other components in a buck converter is to limit power loss to heat and while minimizing current ripple.

Article preview
Blog
US Department of Transportation Seeking Alternatives to GPS

GPS-capable devices range from your phone to your smartwatch; simply type in your destination and follow the directions. Simple, right? According to the Washington Post, we should all stop using GPS as it’s ruining the navigation centers of our brains. Despite the neurological effects on perception and judgment, the U.S. Department of Transportation (DOT) aims to find alternatives to GPS to provide redundancy.

Article preview
Blog
Bluetooth 5.1 SoC vs. Module: Which is Best for Your Design?

The list of features available in Bluetooth just got a little longer since the release of Bluetooth 5.1. If you want to incorporate a Bluetooth 5.1 SoC into your new product, you have two primary options for bringing this component into your board. The first is as an SoC that mounts to your board just like any other component. The other option is to bring a module into your new board—directly onto the surface layer. Here’s what you need to know about a Bluetooth 5.1 SoC or module in your next IoT product.

Article preview
Blog
USB Power Delivery for Your Next Project

Since its introduction in the late 90s, the USB standard has never ceased to grow in popularity. There has been a growing trend toward USB being a power delivery interface with data, rather than a data interface that can supply power, as the 1.0 specification originally intended. To supply the increasing thirst for power over USB, the USB 3.0 Spec with Type-C began implementing the Power Delivery standard, which you should consider using for your next electronics project.

Article preview
Blog
Circuit Board Design for In-Circuit Testing

There are many types of circuit board tests available in electronics manufacturing today, each having unique goals and characteristics. This article presents guidelines at the design level (schematic and layout) to enable the use of in-circuit testing (ICT) fixtures to verify proper component assembly. These simple test fixtures allow your board to be tested as its assembled, which helps identify and remove failed boards from your production run.

Embedded thumbnail for Creating PCB Mounting Holes
Creating PCB Mounting Holes

Our PCB must somehow be assembled into the final drone assembly. This will be achieved by attaching our PCB to the motherboard connector and by special mounting racks, which requires precise positioning of the two mounting holes on the PCB.

Tag
Top 5 Questions Regarding Stack Up
Blog
SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up

This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.

Three ways to manage your BOM costs
Blog
Improving Supply Chain Success with BOM Management

It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.

Length Tuning Impedance
Blog
What is the Impedance of Length-Tuning Structures?

Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?

Designing the Next-Generation Electronics
Blog
A-SAP™ – What do you need to know?

The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.

Pin-package and Via Delay Values
Blog
Pin-Package Delay and Via Delay in High Speed Length Tuning

Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.

6-Layer PCB Design
Blog
6-Layer PCB Design Guidelines

Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.

Altium Designer Interface
Blog
Altium Designer 22.5 Update

We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Are Hybrid PCB Stackups Reliable?
Blog
How Reliable is Your Hybrid PCB Stackup?

PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.

Monte Carlo vs Sensitivity Analysis
Blog
Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?

In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.

Simulation, Build and Test
Blog
Creating Continuous Integration Pipelines for FPGAs

Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.

Collaborators Visualization
Blog
Soft Locks [Conflict Prevention] in Altium 365

Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully

Guide to Monte Carlo in SPICE
Blog
The Basics of Monte Carlo in SPICE: Theory and Demo

Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?

BGA Land Patterns and Footprints
Blog
What's In Your BGA Land Pattern and Footprint

If you look in datasheets for most components, you’ll often find a recommended land pattern, usually alongside some mechanical package information and assembly information. This is not always the case with BGA components, especially components with high ball count. There are a few reasons for this that we can speculate: those ball counts might just be too big to put into a single page, or the manufacturer just expects you to know how to create that land pattern.

Molded Interconnect Devices
Blog
MIDs Make a Comeback as Vertical SMD Modules for Your PCB

Molded interconnect devices are essentially plastic molded substrates with traces running along any surface, including at right angles and running vertically. Altium users can use the new 3D Routing extension to design their own component carriers, which can be mounted vertically in a standard assembly process. If you’ve always wanted to vertically mount components or entire circuits, but without the expense of adding a flex section to your design, the new 3D Routing extension with HARTING’s component carrier designs provides a unique solution.

MCAD CoDesign Process
Blog
MCAD CoDesigner 2.9.0 is Out

Altium has released version 2.9.0 of the MCAD CoDesigner. This version has the option to exclude small components when transferring from ECAD to MCAD. The arc behavior was improved, and the support for splines in board shape and cutouts was added. With this release, you can now select a specific SOLIDWORKS configuration of a part to use on the board and view the improvements made for Siemens NX.

Tag
Embedded thumbnail for Creating BGA Footprints with the Footprint Wizard
How to create a PCB Footprint
Creating BGA Footprints with the Footprint Wizard

Altium Designer makes it easy to create a BGA footprint using our IPC compliant footprint wizard. We'll show you how easily you can create and modify a BGA footprint using the footprint wizard.

Embedded thumbnail for How to Remove Unused Pad Shapes
How-To's
How to Remove Unused Pad Shapes

Unused pad shapes can cause distortion among other problems so it is best to exclude them from your designs. This video shows how to remove unused pad shapes.

Embedded thumbnail for Stackup Presets and Templates
How to work with Layer Stack Manager
Stackup Presets and Templates

In this video, we will learn how to apply predefined layer stacks to the board, as well as how to save the layer stack file as a template.

Embedded thumbnail for Creating a PCB Footprint Assembly Drawing
How to create a PCB Footprint
Creating a PCB Footprint Assembly Drawing

If you need to create an assembly drawing of your PCB Footprint for your outjob files we can show you how in Altium Designer. We’ll walk through all the different options for your assembly drawing in your Draftsman document, how to create your assembly drawing and assign it designators.

Embedded thumbnail for Using the ActiveBOM
How-To's
Using the ActiveBOM

Using the ActiveBOM: The Bill of Materials (BOM) contains a list of all the components with their designators, part numbers, values, and other parameters. An ActiveBOM manages the mapping from the design component (part) to the part that is purchased. This video describes how to use the ActiveBOM document to create an up-to-date list of components needed for your project.

Embedded thumbnail for Using Back Drills in your Stackup
How to work with Layer Stack Manager
Using Back Drills in your Stackup

In this video, we will learn about Back Drilling technology, how to set up back drilling using the layer stack manager, and how to set up the Stub Length sizes for back drilling by specifying applicable nets using the Design Rules Editor.

Embedded thumbnail for How to Customize The Properties Panel
How-To's
How to Customize The Properties Panel

How to Customize The Properties Panel: This video will go over how to customize the look and feel of the properties panel in Altium Designer. By being able to personalize your workspace you can greatly improve your efficiency

Embedded thumbnail for How to Create and Use Impedance Profiles
How to work with Layer Stack Manager
How to Create and Use Impedance Profiles

Using the Altium Designer Layer Stack Manager, we will show how to create impedance profiles for transmission lines and how to apply them to the circuit board using the PCB Rules and Constraints Editor.

Embedded thumbnail for Creating a PCB Footprint Courtyard
How to create a PCB Footprint
Creating a PCB Footprint Courtyard

The courtyard is an essential piece when you want to create a PCB Footprint in Altium Designer. We’ll talk about what a courtyard is, how to create a courtyard, and how to format a courtyard correctly for your PCB footprint.

Embedded thumbnail for How to Edit Existing Tracks in Altium Designer
How-To's
How to Edit Existing Tracks in Altium Designer

This new design rule flags a violation when the creepage distance across non-conductive surface and edge regions of the board, between the targeted signals, is equal to or less than the specified Creepage distance.

Embedded thumbnail for Creating a PCB Footprint Silkscreen Overlay
How to create a PCB Footprint
Creating a PCB Footprint Silkscreen Overlay

When creating a PCB footprint in Altium Designer creating a silkscreen overlay is an important requirement. We’ll go over the standards for creating a silkscreen overlay for a footprint and the steps to creating one, such as constructing lines and measuring distance of objects and primitives.

Tuning
What's New in 22.7
Ability to Change Tuning Object Layer Properties

Design of high-speed PCBs becomes easier with this latest release. Now, when you need to quickly move tuning elements to a different layer, you can do so from the Properties panel with a single click.

Tuning
What's New in 22.7
更改调节对象层属性功能

本次发布后,即可更加轻松地进行高速PCB设计。现在,当您需要将调节元件快速移动到其他层时,仅需单击一次即可从Properties面板中执行此操作。

Simulation models
What's New in 22.7
Auto-assign Simulation Models for Components without Models

This latest version of Altium Designer makes schematic simulation even easier. System intelligence automatically recognizes SPICE models and assigns them to components from available sources.

Simulation models
What's New in 22.7
自动分配不含模型的元件仿真模型

最新版Altium Designer将确保您能够更加轻松地进行原理图仿真。系统智能自动识别 SPICE 模型并将其分配给可用来源的元件。

Paste
What's New in 22.7
Control of Paste Mask Output for Variants

Output data needs to be as accurate as possible. For multi-variant designs you can now ensure that the paste mask is only displayed where it is really needed.

Tag
Your search returns no results.