News & Updates
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Improving Supply Chain Success with BOM Management
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
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What is the Impedance of Length-Tuning Structures?
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
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Creating Continuous Integration Pipelines for FPGAs
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
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What is a Multi-CAD Environment? Advantages and Best Practices
Different CAD tools shouldn't mean disconnected teams. Learn how Multi-CAD workflows help engineers review designs, collaborate across disciplines, and catch mechanical or sourcing issues before they become costly redesigns.
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Deliver Production-Ready Multiboard PCBs Faster with Manufacturing-Driven Design
This article explores how manufacturing-driven design can help teams validate multiboard products before they reach the factory. It highlights how early checks of interconnects, harnesses, mechanical fit, sourcing, and manufacturing data can reduce late-stage changes and accelerate production readiness.
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Stop Chasing Signatures: How Automated Design Sign-offs Accelerate Release Cycles
Automated design sign-offs can eliminate much of the administrative friction surrounding hardware approvals. This article explores how in-context reviews, structured workflows, and automated traceability help teams accelerate release cycles while maintaining control.
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Flexible Circuits in Assembly: What PCB Designers Don’t See Until It’s Too Late
Flexible circuits introduce unique assembly challenges that aren't always visible during PCB design, from panel instability and component movement to thermal distortion during reflow. This article explains how design decisions around stiffeners, placement, panelization, and materials can improve assembly yield and reduce costly rework.
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Requirements Management Lessons Learned: The S-80 Submarine Program
Fixing one design problem can sometimes create another you didn't see coming. This article uses the S-80 submarine program to show how better requirements traceability can help teams spot hidden impacts before they turn into expensive rework.
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Trust Your BOM: Ensuring Design Data Integrity in Fast-Paced Hardware Projects
A BOM is only valuable if everyone can trust the data it contains. This article shows how connected BOM management helps teams eliminate errors, improve collaboration, and keep fast-moving hardware projects on schedule.
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The Best PCB Design Rules System Keeps Your Board Error Free
PCB design rules are the foundation of every successful layout. This article explores how defining and managing constraints helps engineers improve design accuracy, simplify verification, and deliver manufacturing-ready PCBs with confidence.
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Why Modern Electronics Teams Are Moving to a Cloud ECAD Platform
Great products are built by connected teams, not disconnected tools. This article shows how cloud ECAD platforms enable real-time co-design, structured design reviews, and seamless collaboration across engineering, manufacturing, and supply chain teams.
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10 Questions to Ask Your Fabricator Before Submitting a Rigid-Flex Design
A five-minute conversation with your fabricator could save weeks of redesign. Discover the ten questions that can improve manufacturability, boost yield, and help your rigid-flex project succeed on the first build.
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Who Needs Integrated Electronic Component Search
Finding the right component shouldn't mean searching through dozens of websites and datasheets. This article shows how integrated component search helps engineers select parts faster while reducing sourcing risks and design delays.
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How BOM Portal Supports R&D and Procurement with DFM & DFC Analysis Throughout the Entire Product Lifecycle
The best sourcing decisions happen when procurement is involved early. This webinar demonstrates how BOM Portal gives both engineering and procurement access to live lifecycle, pricing, compliance, and availability data to drive smarter decisions from prototype through production.
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How to Design a PCB: From Schematic Capture to Manufacturing
This article walks through the complete PCB design workflow, from schematic capture and component selection to layout, design reviews, and manufacturing documentation. It highlights the key decisions at each stage that help engineering teams produce reliable, manufacturable products.
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5 Power Integrity Myths: AC Edition
The biggest threat to your power integrity might be outdated design advice. This article challenges five common AC power integrity myths and shows what really matters when designing today's high-speed PCBs.
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Your Design Data Has Zero Defense
Your design data may be more exposed than you think. This webinar shows how to identify common security gaps and secure engineering workflows with centralized access control and governance.
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Flex Circuit Coverlay: Design with Lamination Processes In Mind
Your flex PCB may look perfect in CAD but coverlay doesn't stay perfectly still during manufacturing. This article reveals why designing for lamination behavior is one of the most important steps in building reliable flex circuits.
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Integrated PCB Design vs. Legacy Point Tools: What’s the Real Cost?
As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.
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