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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Blog
Signal Mistakes Are Expensive

See how the Signal Analyzer by Keysight in Altium Designer lets you run signal integrity checks directly within your design environment. Read our article to learn how to effectively manage impedance, return paths, stackups, and more.

Blog
Twice the Insight. One Seamless Simulation Bundle

Ensure power and signal integrity with the Keysight Bundle in Altium Designer. Catch issues early, reduce rework, and optimize your PCBs - all within one integrated environment featuring Signal & Power Analyzer.

Blog
Preparing for Prototype: Final Component Validation

Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.

Blog
Getting Started with Harness Design in Altium Designer 25

Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.

Blog
The Future of PCB Design Starts Here

Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.

Blog
Simplify Harness-to-System Connections for Better PCB Design Outcomes

Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.

Blog
Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design

This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications. 

Blog
New Routing Possibilities with Ultra HDI

Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.

Blog
3D-MID in Focus: Principles, Processes, and Practical Use

This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.

Blog
Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs

Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.

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22.5-2_Custom_Diff_Pair_Suffixes
What's New in 22.5
Custom Diff Pair Suffixes

Even more possibilities for creating differential pairs. Now you can use any postfixes to designate positive and negative net of a differential pair.

22.5-2_Custom_Diff_Pair_Suffixes
What's New in 22.5
自定义差分对后缀

更加有利于进行差分对创建。您现在可以使用任何后缀来指定差分对的正网络和负网络。

22.5-3_PCB_Health_Check_Monitor
What's New in 22.5
PCB Health Check Monitor

The condition of the PCB is under your control. A new intelligent feature that gives you confidence that your PCB is okay and complies with design rules.

22.5-3_PCB_Health_Check_Monitor
What's New in 22.5
PCB健康状况检查显示器

PCB的状况将由您控制。您可以通过此项全新智能化功能,确认PCB正常运行且符合设计规则。

Embedded thumbnail for MCAD CoDesigner Quick Start: Autodesk Fusion 360
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Autodesk Fusion 360

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and Autodesk Fusion 360. 

Embedded thumbnail for Component Placement Control for DFM
DFM and Fabrication Cost/Time Constraints
Component Placement Control for DFM

Component placement is a crucial part of making sure your design is manufacturable, so you need to be able to control placement. We’ll show you how, through rules and courtyard layers to maintain accessibility and manufacturability in your entire design through component placement control.

Embedded thumbnail for MCAD CoDesigner Quick Start: PTC Creo
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: PTC Creo

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and PTC Creo

Embedded thumbnail for Variants in Multi-Channel Designs
How to work with Variants
Variants in Multi-Channel Designs

Multi-channel designs can utilize variations in the channels to reduce design time and sheet count. We’ll show you how to take advantage of this by configuring several types of components.

Embedded thumbnail for Stackup Considerations
DFM and Fabrication Cost/Time Constraints
Stackup Considerations

There is a lot to consider about the Layer Stackup when it comes to designing a manufacturable board. We’ll walk you through enabling symmetry, finding correct balance of your layers, materials, creating and loading templates, and adding a layer stack table for better communication between you and your manufacturer.

Embedded thumbnail for What Are Design Variants For?
How to work with Variants
What Are Design Variants For?

Variants in Altium Designer allow you to create several variations of the same design all from one source project. Variants can be managed in the project and through Altium Designer you can control variants in the PCB, Schematic, Draftsman, and Outjob files to make your designs easily editable without redundancy.

Embedded thumbnail for MCAD CoDesigner Quick Start: Solidworks
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Solidworks

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and SolidWorks. 

Embedded thumbnail for Panelization
DFM and Fabrication Cost/Time Constraints
Panelization

When you go to manufacture your design you can get a board manufactured by itself or with multiple in a panel. We’ll show you the how and the why to create panelization with the Embedded Board Array/Panelize tool, as well as how to create break away points for your individual boards.

Embedded thumbnail for Display Variants in Draftsman Document
How to work with Variants
Display Variants in Draftsman Document

You can use the draftsman document to display your board variants. We’ll show you how to create a draftsman document and add variants to it properly displayed and editable through the properties panel.

Embedded thumbnail for How to print PCB?
How-To's
How to print PCB?

Do you want to know how to use the updated document output feature? This video tells about the changes to the document output and shows how to quickly form a PDF or print a PCB in Altium Designer 21.

Embedded thumbnail for Avoid Solder Wicking
DFM and Fabrication Cost/Time Constraints
Avoid Solder Wicking

If solder gets sucked into via holes in can cause an unreliable connection in your otherwise manufacturable design. We’ll show you a few easy ways to avoid this solder wicking using rules.

Display of Alternate Component Parameters
What's New in 22.4
Display of Alternate Component Parameters

Many schematic solutions are created as multivariant. With the new release, the schematic of multivariant project have become even more detailed and informative.

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