News & Updates

By now, designers should be aware of some important behavior involved in power delivery to components in a PCB, particularly for digital components. All digital components produce and manipulate wideband signals, where the frequency content theoretically extends up to infinite frequency. As such, some radiation may propagate through your PCB, leading to resonant behavior that is not observed on the power rail.

Supply shortages have become and continue to be a common problem, especially when it comes to the world of electronics. It's hard to get all the different components for our boards. Heck! It's even tough to get the board themselves too! When electronic components become obsolete or out of stock, design and production can suffer lengthy delays. With current supply chain delays and with an average of 15 end-of-life notices issued every day, obtaining the parts you need is a challenge.

Once your board passes through the standard PCB fabrication process, the bare copper in your PCB will be ready for the application of a surface finish. PCB plating is applied to protect any copper in your PCB that would be exposed through the solder mask, whether it’s a pad, via, or other conductive element. In this article, I’ll run over the different PCB plating material options and their advantages in your PCB.

The PCB supply chain encompasses multiple components, raw materials, and the PCB itself. PCBs and PCB assemblies are often the most technically complex components that are purchased for electronic assemblies and products. The complexity of modern PCBs leads to several challenges for a supply chain management team that may be significantly different when compared with other commodities the team manages. In this brief guide, we'll look in-depth at the PCB supply chain, and specifically what falls within the purview of a procurement and supply chain management team.

On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.

There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.

When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.

Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.

If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.

Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.

High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.

As robotics systems become increasingly miniaturized and intricate, ensuring perfect fit, form, and function across electrical and mechanical domains is critical to avoid design setbacks. Real-time ECAD-MCAD integration with two-way sync empowers teams to streamline workflows, reduce PCB rework, and deliver more reliable designs faster.

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Discover how short-sighted ordering practices fuel volatility in the semiconductor market and why smarter, data-driven approaches are key to building resilience and sustainability.

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

Optimizing multiboard PCB systems demands visibility across logical, physical, and manufacturing domains. This article outlines how Altium’s environment lets engineers establish system‑level schematics, 3D spatial validation, harness documentation, and synchronized outputs to streamline design and production.

If you’ve ever been frustrated by clunky PCB-to-mechanical workflows, you’re not alone. Learn why collaboration between mechanical and electrical engineers is harder than it should be and what’s behind the struggle.

Eliminate costly mismatches and assembly delays. This whitepaper shows you how to apply a unified digital thread across PCB, multi-board, and harness workflows - bridging ECAD/MCAD silos, ensuring connector accuracy, mechanical fit, and real-time collaboration for flawless system design.

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.

Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.

Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.