News & Updates

On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.

There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.

When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.

Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.

If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.

In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.

The primary goal of your traces is to carry signals throughout your board without losses. To do this properly, you must familiarize yourself with the requirements for signals on the printed circuit board and how to optimize the topology of the board in terms of signal integrity. We will analyze the most popular routing cases applicable for using the Gloss and Retrace tools in Altium Designer to optimize your signal integrity.

High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.

There are some guidelines I see many designers implement as a standard practice, often without thinking about it. Some of these practices are misunderstood or implemented without best practices. Others are implemented without thinking about the potential problems. One of these is the use of tented vias, which is sometimes implemented in a PCB layout by default. Is this always the right practice?

When we deal with “abstract” aspects of electromagnetic fields and how they function, it can be easy to get lost in the weeds regarding them. The first part of this article will address an important aspect of transmission line fundamentals, namely how electromagnetic fields and waves propagate on a transmission line. This article’s end goal is to create a core understanding of these concepts so that when it comes time to design a PDS, the proper design methodologies are followed and a properly working PDS is achieved appropriately, the first time and every time.

Via stubs are sometimes viewed as an annoyance, especially when you only need to make a transition between adjacent layers. For low speed, less-dense boards with low layer count, via stubs are an afterthought, or they may not receive consideration at all. For faster edge rates/higher frequencies, the conventional wisdom is to remove all via stubs. The question is: what exactly counts as “high frequency,” and how do you figure out the relevant length?

Unlike the clumsy human finger, a thermal camera can detect minute temperature differences across its view. This allows you to rapidly identify any components that are consuming current. Any parts or areas of your board that draw current will also generate heat that can easily be picked up by a thermal camera.

I want to share a little secret with you in this article: Assembling SMT prototypes boards is not only easy, but it requires very little equipment. Using just a stencil, I can easily hand prototype down to 0.3 mm pitch ICs, and 0201 (imperial) sized passive components. If you’re currently hand assembling boards with a soldering station, you need to stop this immediately and start using a stencil instead!

With the challenges of 2020 behind us, what challenges and opportunities lie ahead for hardware designers in 2021? In this article Vince Mazur, Technical Product Marketing Engineer at Altium, looks ahead to three emerging trends and share steps to address each one successfully in the year ahead.

When we talk about S-parameters, impedance matching, transmission lines, and other fundamental concepts in RF/high-speed PCB design, the concept of 50 Ohm impedance comes up over and over. Look through signaling standards, component datasheets, application notes, and design guidelines on the internet; this is one impedance value that comes up repeatedly. So where did the 50 Ohm impedance standard come from and why is it important?

For the home hobbyist, protecting their electrical devices usually means keeping the coffee cup or soda can away from anything that carries a large voltage. Good practice indicates that electrical devices should be housed in an enclosure to protect expensive components and reduce the risk of electric shocks from exposed circuitry. However, what do you do if the fantastic new device you’ve designed needs to work in a humid, damp, or dripping wet environment?

Have you ever opened up an old design and wondered how much of it was still usable? Maybe you were contacted by an old client, and they want you to provide some updates on an old design. No matter what the situation is, there are times where updating old PCB designs with new parts makes sense. If done correctly and when armed with all the right information up front, you can cut down the total design time while preserving the best parts of your design in a new iteration. Here’s what you can do to update your old designs successfully and how your PCB design features can help.

The more complex the product gets, the more involved your customer will need to be to ensure you’re designing to their requirements. When you’re using a data sharing system that integrates with your PCB design tools, it’s easy to give your customers visibility into the product development process. Altium 365 is the only system that integrates with Altium Designer® and gives you the ability to give anyone access to your PCB projects, including your customers and manufacturer.

Anytime you’re looking for a fabricator to produce your new design, you should ensure they have a robust quality control program. Where can quality defects arise and how can manufacturers quickly get this information back to a design team? Sometimes emails can leave too much ambiguity and it is difficult to track progress on specific design changes in the PCB layout. If you’re planning to put a new design into high volume production, there are some basic points that should be checked during fabrication and assembly as part of a PCB manufacturing quality control program.

Controlling crosstalk is one of the key goals in any PCB design. In most instances, when we talk about crosstalk, it’s in reference to the unwanted interaction of the electromagnetic field traveling on one transmission line with a neighboring transmission line. But crosstalk can also occur in the connector pin out. This article will describe this type of crosstalk, the types of disruptions it causes, wherein the design cycle it needs to be factored in and how it can be successfully controlled.

When you’re working through a new PCB design project, and you need to keep track of your project revisions, Altium 365™ creates the ideal environment for collaborative PCB design and revision tracking. Once you upload your projects onto the cloud through the Altium 365 platform, Altium 365 creates a Git repository for your project. It allows you to make it available to collaborators through Altium Designer®. This includes a complete project history, which can be easily accessed by collaborators working on a complex project.

The moment you push your Gerbers to a manufacturer for a DFM inspection, it can be a nerve-wracking experience waiting for a response. Before you receive your working boards, there will likely be some back-and-forth communication before your board hits the fabrication line. When manufacturers and designers need to resolve problems in Gerber files before fabrication, it helps to have a Gerber compare utility. The newest version of Altium Designer now offers this feature through the Altium 365 platform, giving everyone visibility into changes to Gerbers before fabrication.

No matter how you might feel about renewable energy and associated environmental issues, electric vehicles are becoming more mainstream and will become the primary mode of transportation in the future. For the engineering community, what’s much more interesting is how our power distribution and management infrastructure can support this shift to massive increases in the use of electricity on the grid. So what’s the rub for PCB designers?

When you’re working through a complex PCB layout, it always helps to know the shortcuts you can use to stay productive. Altium Designer® keyboard shortcuts, and keyboard + mouse shortcuts, can help you easily walk through your PCB layout during design and as part of final checks during a design review. Here are some of my favorite keyboard shortcuts and viewing options that help me stay productive, and I hope they can do the same for you.

High speed PCB interconnects have continued to remain an active challenge in modeling and simulation, particularly when dealing with broadband signals. The IEEE P370 standard is a step towards addressing the challenges faced by many designers in determining broadband S-parameters for high speed structures up to 50 GHz. Although this standard has been in the works since 2015, it finally passed board approval and appears as an active draft standard.