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High-Speed PCB Stackup Design
Blog •
The High-Speed PCB Stackup Design Challenge

Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.

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Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's •
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

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Embedded thumbnail for How to efficiently use Blankets?
How-To's •
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

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stitching vias
Blog •
Everything You Need to Know About Stitching Vias

Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.

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Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's •
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

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Embedded thumbnail for Design RF PCB: routing (any angle, arc)
How-To's •
Design RF PCB: routing (any angle, arc)

It is worth taking a responsible approach to the shape and size of the RF signal conductors. In this video we will cover some practical aspects of working with routing such nets in Altium Designer.

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PCB Stackup Basics
Blog •
PCB Stackup Basics

In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.

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Embedded thumbnail for Draftsman Document: Snapping
How-To's •
Draftsman Document: Snapping

Snapping using the grids and snapping tools in Altium Designer’s Draftsman Editor gives you a lot of control over how you create and annotate primitives and components. We’ll show you how easy it is to use snapping in the Drafstman Editor.

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Embedded thumbnail for High Speed: XSignals
How-To's •
High Speed: XSignals

You can create, configure, and utilize xSignals in Altium Designer to make your design process more efficient and effective. We’ll show you how to do it manually, using the more comprehensive Create xSignals command, and using the xSignal wizard.

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Embedded thumbnail for DFM and fab cost/time constraints: What is annular ring and how to configure it
How-To's •
DFM and fab cost/time constraints: What is annular ring and how to configure it

The minimum dimension from the wall of the aperture to the edge of the pad is called an annular ring, and we can configure it with Altium Designer. We’ll show you how to get started and manage the annular ring in your design rules.

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Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
How-To's •
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files.

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Embedded thumbnail for Polygon Pours
Working with Polygons •
Polygon Pours

Polygon pours are used to create copper geometries on your board. You can prioritize polygon pour order, hide them to make it easier to work on your board, and repour them to resolve design rule conflicts.

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Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's •
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

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chip with neon illumination
Blog •
How Does the Package PDN Impact Power Integrity?

Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.

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Embedded thumbnail for Creating Additional Snap Points Using a 3D Model
How to use Snapping •
Creating Additional Snap Points Using a 3D Model

Demonstration of using snap points with 3D models and how they can assist in the placement of said models.

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electrical circuit with microcontroller
Blog •
Designing Custom Hardware with Microcontrollers

In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.

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Embedded thumbnail for Polygon Connect Styles
Working with Polygons •
Polygon Connect Styles

Define how vias and pads connect to polygons with a design rule. Customize the thermal relief width, number, and rotation as well as the air gap width.

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Embedded thumbnail for How to work with Component Classes?
How to Work with Classes •
How to work with Component Classes?

Modern printed circuit boards can contain a large number of components, which makes them difficult to work with. In this video we will show what component classes can be on a PCB, how to create custom component classes and how they can be useful for us. 

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Blog •
Types of Simulation Tools For PCBs

PCB simulation isn’t one-size-fits-all and that’s where it gets interesting! Discover the wide range of tools available, from quick circuit checks to advanced multiphysics simulations, and how they help you design with confidence.

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Blog •
Wiring the Future: The Shift to Unified Electromechanical Design

This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.

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Blog •
Best Tools For PCB DFM Checks

Want to catch manufacturability issues before they turn into expensive delays? Discover the essential DFM tools from real-time checks to post-layout analysis that help you get your PCB right the first time.

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Blog •
Eliminate Your Design Friction with Agile Teams

Design friction from scattered data and disconnected tools slows down PCB development and leads to rework. This webinar shows how Agile Teams streamlines collaboration, aligns domains, and helps teams deliver faster with fewer errors.

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Blog •
What is the Best Cloud PCB Design Software?

Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.

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Blog •
From Rework to Revenue: Digital PCB DFMA

This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.

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Blog •
How to Choose the Right Components for Your BOM

A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.

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Blog •
From Scattered Requirements to Confident Product Development

See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.

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Blog •
What is the Best PCB Design Tool For Students?

Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.

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Blog •
What Is Collaborative Engineering?

Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.

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Blog •
Bend Reliability: How Trace Geometry and Materials Impact Flex Lifespan

Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.

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Blog •
PCB Design Process: The EDA Design Approach

Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.

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Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs •
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's •
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

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Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA •
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA •
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

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Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA •
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA •
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

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Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA •
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA •
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

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Embedded thumbnail for Via Shielding and Stitching
Via Stitching •
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

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Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects •
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects •
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman •
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

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Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects •
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects •
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

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Embedded thumbnail for Working with Design Variants
How to Work with Draftsman •
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

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Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects •
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

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