News & Updates
Watch our webinar to learn how our centralized electronics design data platform can quickly integrate with your IT access, tracking, and compliance tools, while also making it easier to work in teams.
Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.
Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.
High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.
Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.
Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.
We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.
Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.
Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.
High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.
This article walks through the complete PCB design workflow, from schematic capture and component selection to layout, design reviews, and manufacturing documentation. It highlights the key decisions at each stage that help engineering teams produce reliable, manufacturable products.
The biggest threat to your power integrity might be outdated design advice. This article challenges five common AC power integrity myths and shows what really matters when designing today's high-speed PCBs.
Your design data may be more exposed than you think. This webinar shows how to identify common security gaps and secure engineering workflows with centralized access control and governance.
Your flex PCB may look perfect in CAD but coverlay doesn't stay perfectly still during manufacturing. This article reveals why designing for lamination behavior is one of the most important steps in building reliable flex circuits.
As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.
Signal integrity and power integrity are closely connected, with problems in one often affecting the other as designs become faster and more complex. This webinar explains how integrated analysis workflows help engineers evaluate PDN performance, identify potential issues early, and improve overall design quality.
Every manual handoff adds time and risk to the product development process. This article shows how modern design workflows automate routine tasks, improve data visibility, and help engineering teams focus on innovation instead of administration.
Your signal may be perfect on the PCB and fail the moment it crosses a connector. This article explores the hidden SI challenges in multi-board systems and how engineers can eliminate them before they become costly debugging sessions.
Still building BOMs the hard way? Discover how modern workflows can help you create a prototype-ready BOM faster while improving visibility into pricing, availability, and risk.
This article examines the challenges of maintaining power integrity and controlling EMI in complex multiboard systems. It provides practical strategies for managing return paths, connector transitions, and power distribution across interconnected assemblies.
Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.
Starting with a simple board today doesn't mean your next project will stay simple. Learn how Altium Designer and KiCAD compare when designs become more complex, teams get larger, and products move toward manufacturing.
Learn how Agile Teams and Duro connect design and production workflows through a unified system of record. This webinar shows how structured change management and automated data synchronization help teams reduce errors and accelerate product releases.