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Embedded thumbnail for HDI PCB Design Review: nRF52840 Via Sizing & Stack-Up Best Practices
How-To's
HDI PCB Design Review: nRF52840 Via Sizing & Stack-Up Best Practices

Explore key HDI design strategies, from calculating aspect ratios and optimizing pad diameters to managing drill tolerances and refining stack-ups for improved signal integrity. This comprehensive review highlights practical solutions to common HDI challenges, including via-in-pad layouts, clearance violations, and layer thickness adjustments for both mechanical and laser drilling processes.

NEW
Embedded thumbnail for 13 Common PCB Problems & How to Fix Them in Altium
How-To's
13 Common PCB Problems & How to Fix Them in Altium

Stop wasting time on manufacturing rework. This guide shows you how to set up Altium’s design rules to prevent the 13 PCB issues that most often derail production ensuring your boards are built right the first time.

NEW
Blog
Building a Model Context Protocol Server for Arduinos

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Embedded thumbnail for What's Inside Your MCU Module?
How-To's
What's Inside Your MCU Module?

Are you curious about what’s inside a microcontroller module? Join us as we take a closer look at the Texas Instruments CC3235 Wi-Fi module under the microscope. In this video, we’ll explore its key components, including the microcontroller, flash memory, and RF circuitry, and explain how they work together to power the module.

Embedded thumbnail for Altium Harness Design Tutorial - From Schematic to 3D Layout
How-To's
Altium Harness Design Tutorial - From Schematic to 3D Layout

Design professional harness systems in Altium with confidence. Follow this comprehensive tutorial to learn multiboard project setup, create wiring diagrams, visualize in 3D, and produce manufacturing-ready documentation complete with ECAD-MCAD integration for precise wire length measurement.

Blog
Getting Started with the GreenPAK Introduction Kit

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Embedded thumbnail for Arduino to Custom PCB: Professional Design Transformation
How-To's
Arduino to Custom PCB: Professional Design Transformation

Discover how to upgrade your Arduino Nano-based PCB design into a professional, custom PCB. This tutorial walks through the process of replacing development boards with individual components to create a production-ready design, using a real drone project as the example.

Blog
Smarter Electronic Part Sourcing for Automotive Purchasing Professionals

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

Embedded thumbnail for PCB Library Management: One Library or Many?
How-To's
PCB Library Management: One Library or Many?

This detailed guide walks you through the pros and cons of each approach and offers proven strategies for managing component data, whether you're an independent designer or overseeing libraries for an entire organization.

Blog
Stack-Up to Success: Avoid the Pitfalls

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.

Embedded thumbnail for Coming Soon: Sawtooth Rounding Support for Length Tuning
New in Altium Designer 25
Coming Soon: Sawtooth Rounding Support for Length Tuning

Sawtooth Rounding for Length Tuning improves signal‑path accuracy by applying controlled corner‑rounding to sawtooth geometries during both Interactive Length Tuning and within‑pair matching in the Auto Tuning engine. Discover this capability and additional innovations on our Coming Soon page.

Embedded thumbnail for Coming Soon: Z-Axis Clearance Rule
New in Altium Designer 25
Coming Soon: Z-Axis Clearance Rule

The Z-Axis Clearance Rule checks the shortest distance between copper features on different layers in a PCB design. It is available in both the Constraint Manager and the legacy PCB Rules Editor. Discover more new features in Altium on our Coming Soon Page.

Embedded thumbnail for Coming Soon: Advanced Polygon Pour Engine
New in Altium Designer 25
Coming Soon: Advanced Polygon Pour Engine

Now supports true arcs instead of approximated curves in copper pours. This enhanced engine marks a major advancement in the polygon pour process in Altium Designer, delivering smoother and more accurate copper shapes. Native arc rendering improves visual quality and helps ensure cleaner, more professional PCB designs.

Embedded thumbnail for How to Design Rigid-Flex PCB Stackups from Scratch
How-To's
How to Design Rigid-Flex PCB Stackups from Scratch

Watch this tutorial to learn the fundamentals of Rigid-Flex design. We cover everything from understanding polyimide materials and adhesive layers to building complex, multi-layer Rigid-Flex constructions that are ready for manufacturing.

Blog
How to Effectively Use Jira for Hardware Development Projects

Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.

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Agile Hardware Development
Blog
5 Ways Hardware Development Is Just… Different

Explore the challenges and strategies of implementing Agile methodology in electronics hardware development. Understand key differences between hardware and software development within the Agile framework.

Blog
Flexible Circuit Assembly: Thinking Through Component Placement

The flexible circuits are ideal for applications where a thin, small, and lightweight PCB is needed. However, in such cases, challenges in assembly and fabrication often arise. This article delves into these challenges, focusing on component selection and placement and how they can significantly impact the performance of the flexible circuit in its intended application.

Blog
Coding Your Own Networked Test Equipment

Have you ever performed manual tests? If your answer is yes, you're likely aware of how laborious and time-consuming the entire process can be. Allow us to introduce you to the realm of test equipment automation. Our new step-by-step guide empowers you to write code that seamlessly configures your networked test equipment, all from the convenience of your computer.

Blog
Pi.MX8 Project – Schematic structure and component placement

We are advancing with our brand new Pi.MX8 Project. In this chapter, we delve deeper into two crucial aspects: the overall schematic and component placement on the PCB board. Don't hesitate to check it out. Additionally, you can follow this project through our workspace; the link is provided within the article.

Blog
Redefine PCB Boundaries with HDI Design

Dive into the world of High-Density Interconnect (HDI) design to enhance your projects. Explore heightened signal integrity, improved reliability, and the seamless integration of advanced technologies - all within compact and lightweight designs. Discover more about HDI on our updated feature page.

Blog
Pi.MX8 Project – Introduction and Overview

Do you have extensive knowledge about the Pi.MX8 module? We're excited to introduce a new series of articles focusing on an innovative approach to utilizing this module. In this inaugural chapter, we provide insights into the preparation for this project and detail the elements that will be used.

Blog
Simple Documentation for Hand PCB Assembly

Creating documentation for hand PCB assembly does not prevent the same documentation from being utilized to assist in automated PCB assembly. Learn more about the optimal format for this data to enhance both your hand PCB assembly and overall assembly processes.

Blog
Constraint Manager: Precision in Every Detail

Explore the powerful features of Altium Designer 24! Experience Constraint Manager and revolutionize your PCB design with reusable constraint sets, schematic-to-board rule transition, easy class and differential pair grouping, and more.

Blog
Explore New Possibilities with True 3D-MID Design

3D-MID technology seamlessly integrates electrical circuits with three-dimensional mechanical parts. This unique fusion of functionality unlocks a myriad of possibilities across various application areas. Explore more about this innovative feature, available in Altium Designer 24, to delve into the fascinating world of the 3D design process.

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Embedded thumbnail for Creating a PCB Footprint Silkscreen Overlay
How to create a PCB Footprint
Creating a PCB Footprint Silkscreen Overlay

When creating a PCB footprint in Altium Designer creating a silkscreen overlay is an important requirement. We’ll go over the standards for creating a silkscreen overlay for a footprint and the steps to creating one, such as constructing lines and measuring distance of objects and primitives.

Tuning
What's New in 22.7
Ability to Change Tuning Object Layer Properties

Design of high-speed PCBs becomes easier with this latest release. Now, when you need to quickly move tuning elements to a different layer, you can do so from the Properties panel with a single click.

Tuning
What's New in 22.7
更改调节对象层属性功能

本次发布后,即可更加轻松地进行高速PCB设计。现在,当您需要将调节元件快速移动到其他层时,仅需单击一次即可从Properties面板中执行此操作。

Simulation models
What's New in 22.7
Auto-assign Simulation Models for Components without Models

This latest version of Altium Designer makes schematic simulation even easier. System intelligence automatically recognizes SPICE models and assigns them to components from available sources.

Simulation models
What's New in 22.7
自动分配不含模型的元件仿真模型

最新版Altium Designer将确保您能够更加轻松地进行原理图仿真。系统智能自动识别 SPICE 模型并将其分配给可用来源的元件。

Paste
What's New in 22.7
Control of Paste Mask Output for Variants

Output data needs to be as accurate as possible. For multi-variant designs you can now ensure that the paste mask is only displayed where it is really needed.

Paste
What's New in 22.7
变量助焊层输出控件

输出数据需要尽量准确。对于多变量设计,您现在可以确保将助焊层仅显示在真正需要的位置。

Embedded thumbnail for Adding Designators for Assembly Drawings
How-To's
Adding Designators for Assembly Drawings

Designators for assembly drawings are added on the assembly layer. This video shows how to add the designators.

Embedded thumbnail for Stackup Material Library
How to work with Layer Stack Manager
Stackup Material Library

In this video we will learn more about the Altium designers Layer Stack Mangers built-in materials library, and how to add new material and use it in our board stack. We will also look at how we can save the user materials to an xml format.

Embedded thumbnail for Placing Footprint Pads
How to create a PCB Footprint
Placing Footprint Pads

Every footprints needs proper pad placement to ensure trace connectivity. Placing pads is the first step towards footprint creation.

Embedded thumbnail for Setting the Transparency for Layers and Primitives
How-To's
Setting the Transparency for Layers and Primitives

Customize your workspace by setting the transparency of layers and primitives in the PCB.

Embedded thumbnail for Create New Via Types Using the Layer Stack Manager
How to work with Layer Stack Manager
Create New Via Types Using the Layer Stack Manager

In this video, we will learn how to create new via types using the Layer Stack Manager, and how to create new Routing Via design rules using the PCB Rules and Constraints Editor. We will also explore how to use the different types of Via during interactive routing.

Embedded thumbnail for How to Create a Copper Board Report
How-To's
How to Create a Copper Board Report

This video will show how to create a copper board report in your PCB which can be useful for copper balance in DFM process

Embedded thumbnail for Stackup Creation and editing
How to work with Layer Stack Manager
Stackup Creation and editing

This video shows how to view and edit the PCB Layer Stack, select materials and add new layers

Embedded thumbnail for Configuring Your PCB Library
How to create a PCB Footprint
Configuring Your PCB Library

It is important to have accurate footprints to manufacture your PCB. Learn how to configure your PCB library to facilitate footprint creation.

Global parameters
What's New in 22.6
Quick Browsing of Parameters for a Board

Parametric information for your board is now conveniently available from the Properties panel. A single, convenient location with which to browse system, calculated and user-defined parameters, and place as needed in the form of special strings.

Tag
Integrating Requirements June 2025 Webinar
On-Demand Webinar May 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar Apr 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar Jan 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.