News & Updates

Explore how Model-Based Systems Engineering (MBSE) integrates with digital twins to enhance design accuracy, collaboration, and lifecycle management in modern engineering projects. This approach bridges the gap between physical systems and digital models, enabling real-time simulation and optimization.

The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.

Altium Designer 25 introduces groundbreaking features for seamless collaboration and precision in PCB design, from PCB CoDesign to advanced simulation and MCAD tools. Discover how AD25 is transforming electronic product development.

Explore the future of wire bonding, from new applications to cost-saving trends, in this article by Samer Aldhaher. Stay updated on key innovations in this essential connection technology.

Discover how Altium 365’s Jira integration can streamline collaboration and keep projects running smoothly with real-time design updates and task tracking. Perfect for teams seeking efficiency!

Discover how integrating BOM management and CAD systems can streamline your PCB design process in this insightful article. Learn how combining these tools enables smoother collaboration, reduces errors, and improves design efficiency, helping you optimize your workflows from concept to manufacturing.

Resistors are fundamental components in electronic circuits, essential for controlling current and voltage. This article explores their basic principles, types, and key applications, helping you understand their crucial role in electronics.

Efficient PCB design is crucial for avoiding costly delays in product development. This article offers practical tips and best practices for PCB designers to streamline their workflows, minimize errors, and ensure timely project completion.

Signal integrity is the backbone of high-speed digital systems. In this new article by Rafał Stępień, we break down signal reflections and how to optimize your designs with effective impedance matching techniques.

In the second article of the "Mastering EMI Control in PCB Design" series Dario Fresu explores how effective component placement can reduce electromagnetic interference (EMI) in printed circuit boards. He highlights strategies such as board segregation and careful management of high-speed signals and their harmonics to ensure signal integrity and minimize emissions.

Check out this article where Rafał Stępień dives into the essentials of maintaining signal integrity in high-speed digital systems. Discover key techniques like controlling signal reflections, reducing crosstalk, and designing differential pairs in Altium Designer 24 to ensure reliable and efficient PCB performance.

The Requirements & Systems Portal is now live in Altium 365! Engineers can write, manage, and verify requirements within the Altium 365 workspace. You can link your requirements directly to schematics and PCB designs to ensure all engineers are working with the latest data. Request access today!

Looking to enhance signal integrity in your PCB designs? Check out our latest article by David Marrakchi, where he shares key strategies and best practices for achieving reliable high-speed designs.

Check out our article, where Lawrence Romine shares his top tools for conducting efficient Bill of Materials (BOM) reviews in PCB design. It highlights key features in Altium 365, Octopart, and ActiveBOM that help engineers avoid unsourceable components and streamline procurement.

As the first article in the "Mastering EMI Control in PCB Design" series from our new asset Dario Fresu, this piece explores signal propagation in PCBs, highlighting the crucial roles of impedance, dielectric materials, and trace geometry in maintaining signal integrity.

Discover essential strategies for high-speed PCB design, focusing on signal integrity, EMI mitigation, and thermal management. Our latest article provides insights on managing crosstalk, optimizing grounding, and addressing thermal challenges to ensure reliable PCB performance.