News & Updates

Eliminate costly mismatches and assembly delays. This whitepaper shows you how to apply a unified digital thread across PCB, multi-board, and harness workflows - bridging ECAD/MCAD silos, ensuring connector accuracy, mechanical fit, and real-time collaboration for flawless system design.

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.

Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.

Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.

Dive into the power of Renesas’ RA8D1 MCU using the EK‑RA8D1 evaluation kit. Learn how to train, test, and deploy image‑based detection models seamlessly with Edge Impulse, and kickstart your embedded vision AI projects in minutes.

Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.

Troubleshooting power supply current handling issues is crucial to achieving optimal performance of your electronic devices. In this article, we will explore the common reasons why a power supply fails to handle the defined output current and provide practical solutions to solving these issues.

Next step in our open-source laptop project is to explain how to design cooling and airflow. In this article, we can show you the first part of this process, such as airflow concept, fan measurement and clearance.

Many modern electronics have multiple boards, and connecting those different boards and systems together are harnesses. Learn more about how Altium Designer can help you create harnesses for your own multi-board designs here.

We invite you to explore the causes of output voltage fluctuation. In this article we provide you insights on how to solve and prevent these issues.

In this article we will show you how to create step by step a digital laser range finder for your own. Everything is based on Raspberry Pi board.

Learn how easy it is to create multi-board projects. This practical project article covers the reasons for breaking larger boards into sub-assemblies and explores the various connection options available between sub-assembly boards.

In this article you can learn about light sensors while building an analog solar panel tracking system. This open-source project covers multi-channel design, window comparators, driving motors, and photosensors.

We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.

In this blog we will show you the strategies to minimize the risk of damage to circuit boards during the initial power-up process.

Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.

If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.

Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?









