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Embedded thumbnail for Create and Snap to a Circular Grid (Polar Grid)
How to use Snapping
Create and Snap to a Circular Grid (Polar Grid)

Instructional on how to create polar grids, how to snap to them, and why you might want to use them.

Embedded thumbnail for How to Connect Polygons to Nets
Working with Polygons
How to Connect Polygons to Nets

This video covers how to easily connect a polygon to a net using just two clicks. With the Properties panel open and a polygon selected, click the "Assign net" button in the Properties panel.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
Getting Started with A365
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files. 

Embedded thumbnail for Altium 365 Getting Started: Schematic Compare
Getting Started with A365
Altium 365 Getting Started: Schematic Compare

The schematic sheets in a project are subject to change over time, and sometimes it may be necessary to compare several different versions and detect differences between them. In Altium Designer you can easily perform an automatic comparison of any revisions of schematic documents. 

Embedded thumbnail for Altium 365 Getting Started: Migrate to Altium 365 from other VCS
Getting Started with A365
Altium 365 Getting Started: Migrate to Altium 365 from other VCS

The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. Traditionally, one way to manage data is to use a version control system such as Git or SVN. Unlike other VCSs, Altium 365 is the system designed specifically for managing project data.

Everything You Need to Know About Stitching Vias
Blog
Everything You Need to Know About Stitching Vias

This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.

Embedded thumbnail for How to get a BOM for a Multi-board Design
How-To's
How to get a BOM for a Multi-board Design

When designing a multi-board project, an up-to-date and accurate BOM for the entire device is a necessity. Watch this video to learn how to properly create a BOM for your multi-board project.

Embedded thumbnail for Remove Unused Pad Shapes
Working with Polygons
Remove Unused Pad Shapes

Unused pad shapes create holes in your copper geometries. You can quickly examine all pads in the design to remove unused pad shapes and restore previously removed pads. 

Embedded thumbnail for Effective use of "Objects for snapping" when creating a Footprint
How to use Snapping
Effective use of "Objects for snapping" when creating a Footprint

Learn how to effectively use snaps that allow you to create a component footprint quickly and conveniently

All About Box Build Assemblies
Blog
All About Box Build Assemblies

When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly. 

The Best Way to Review Your PCB Designs
On-Demand Webinar
The Best Way to Review Your PCB Designs

It is essential to ask questions and review the design approaches used with your team. Design reviews are essential in the design process, but they can be inconvenient for team members and lack traceability or history. To create the best designs, you need review methods that are as cutting edge as the boards you're making.

Ultra-HDI Technology is Not New
Blog
Ultra-HDI Technology is Not New

Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today. 

Embedded thumbnail for How to Control Routing in Altium Designer
How-To's
How to Control Routing in Altium Designer

The routing functionality in Altium Designer is constantly evolving. Check out this video to learn the basics of routing in Altium Designer. 

Embedded thumbnail for Polygon Creation
Working with Polygons
Polygon Creation

Learn how to create polygon pours to ensure proper copper distribution on your board.

Today's PCB Designers Are Driving Electronics Product Design
Blog
Today's PCB Designers Are Driving Electronics Product Design

What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.

Embedded thumbnail for Creating Guide Lines and Snap Points
How to use Snapping
Creating Guide Lines and Snap Points

Explanation of guides and snap points and how to create and use them.

Phased Array Antenna Design for 5G Applications
Blog
Phased Array Antenna Design for 5G Applications

As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.

Embedded thumbnail for Polygon Types and Parameters
Working with Polygons
Polygon Types and Parameters

Each board requires different copper geometries. Polygon types make sure you can create the perfect copper geometry for every need.

Embedded thumbnail for How to Define Different Clearance for Internal and External Layers
How-To's
How to Define Different Clearance for Internal and External Layers

If you need to define difference clearance values for your external and internal layers, the answer is with design rules. We’ll walk you through it in this short video. 

Tag
Pad and via sizing
Blog
PCB Via Size and Pad Size Guidelines

There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.

Differential Microstrip Impedance
Blog
Differential Microstrip Impedance Calculator

Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.

PCB DFM Check
Blog
Getting Through a PCB DFM Check

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.

Spreading Inductance
Blog
What is Spreading Inductance?

If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.

PCB Design Basics for New Designers
Blog
PCB Design Basics for New Designers

In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.

Selecting Materials for High Voltage PCB Design and Layout
Blog
Selecting Materials for High Voltage PCB Design and Layout

High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.

Via tenting in PCB Layout
Blog
When to Use Tented Vias in Your PCB Layout

There are some guidelines I see many designers implement as a standard practice, often without thinking about it. Some of these practices are misunderstood or implemented without best practices. Others are implemented without thinking about the potential problems. One of these is the use of tented vias, which is sometimes implemented in a PCB layout by default. Is this always the right practice?

Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Tag
Tuning
What's New in 22.7
Ability to Change Tuning Object Layer Properties

Design of high-speed PCBs becomes easier with this latest release. Now, when you need to quickly move tuning elements to a different layer, you can do so from the Properties panel with a single click.

Tuning
What's New in 22.7
更改调节对象层属性功能

本次发布后,即可更加轻松地进行高速PCB设计。现在,当您需要将调节元件快速移动到其他层时,仅需单击一次即可从Properties面板中执行此操作。

Simulation models
What's New in 22.7
Auto-assign Simulation Models for Components without Models

This latest version of Altium Designer makes schematic simulation even easier. System intelligence automatically recognizes SPICE models and assigns them to components from available sources.

Simulation models
What's New in 22.7
自动分配不含模型的元件仿真模型

最新版Altium Designer将确保您能够更加轻松地进行原理图仿真。系统智能自动识别 SPICE 模型并将其分配给可用来源的元件。

Paste
What's New in 22.7
Control of Paste Mask Output for Variants

Output data needs to be as accurate as possible. For multi-variant designs you can now ensure that the paste mask is only displayed where it is really needed.

Paste
What's New in 22.7
变量助焊层输出控件

输出数据需要尽量准确。对于多变量设计,您现在可以确保将助焊层仅显示在真正需要的位置。

Embedded thumbnail for Adding Designators for Assembly Drawings
How-To's
Adding Designators for Assembly Drawings

Designators for assembly drawings are added on the assembly layer. This video shows how to add the designators.

Embedded thumbnail for Stackup Material Library
How to work with Layer Stack Manager
Stackup Material Library

In this video we will learn more about the Altium designers Layer Stack Mangers built-in materials library, and how to add new material and use it in our board stack. We will also look at how we can save the user materials to an xml format.

Embedded thumbnail for Placing Footprint Pads
How to create a PCB Footprint
Placing Footprint Pads

Every footprints needs proper pad placement to ensure trace connectivity. Placing pads is the first step towards footprint creation.

Embedded thumbnail for Setting the Transparency for Layers and Primitives
How-To's
Setting the Transparency for Layers and Primitives

Customize your workspace by setting the transparency of layers and primitives in the PCB.

Embedded thumbnail for Create New Via Types Using the Layer Stack Manager
How to work with Layer Stack Manager
Create New Via Types Using the Layer Stack Manager

In this video, we will learn how to create new via types using the Layer Stack Manager, and how to create new Routing Via design rules using the PCB Rules and Constraints Editor. We will also explore how to use the different types of Via during interactive routing.

Embedded thumbnail for How to Create a Copper Board Report
How-To's
How to Create a Copper Board Report

This video will show how to create a copper board report in your PCB which can be useful for copper balance in DFM process

Embedded thumbnail for Stackup Creation and editing
How to work with Layer Stack Manager
Stackup Creation and editing

This video shows how to view and edit the PCB Layer Stack, select materials and add new layers

Embedded thumbnail for Configuring Your PCB Library
How to create a PCB Footprint
Configuring Your PCB Library

It is important to have accurate footprints to manufacture your PCB. Learn how to configure your PCB library to facilitate footprint creation.

Global parameters
What's New in 22.6
Quick Browsing of Parameters for a Board

Parametric information for your board is now conveniently available from the Properties panel. A single, convenient location with which to browse system, calculated and user-defined parameters, and place as needed in the form of special strings.

Global parameters
What's New in 22.6
电路板参数的快速浏览

您现在可以从Properties面板中轻松获得电路板的参数信息。可以在一个方便的位置,浏览系统、计算和用户定义参数,并根据需要以特殊字符串的形式进行放置。

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