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Embedded thumbnail for  Detect Z-Axis Clearance Issues Earlier
New in Altium's Software
Detect Z-Axis Clearance Issues Earlier

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

NEW
Blog
Wiring the Future: The Shift to Unified Electromechanical Design

This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.

NEW
Embedded thumbnail for Fix Inconsistent Part Parameters in Your PCB Schematic
How-To's
Fix Inconsistent Part Parameters in Your PCB Schematic

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

NEW
Blog
Best Tools For PCB DFM Checks

Want to catch manufacturability issues before they turn into expensive delays? Discover the essential DFM tools from real-time checks to post-layout analysis that help you get your PCB right the first time.

Embedded thumbnail for Create IPC-Aligned Footprints with Less Effort
New in Altium's Software
Create IPC-Aligned Footprints with Less Effort

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

Blog
Eliminate Your Design Friction with Agile Teams

Design friction from scattered data and disconnected tools slows down PCB development and leads to rework. This webinar shows how Agile Teams streamlines collaboration, aligns domains, and helps teams deliver faster with fewer errors.

Embedded thumbnail for Via Dispersion: Why Propagation Delay Changes with Frequency
How-To's
Via Dispersion: Why Propagation Delay Changes with Frequency

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

Embedded thumbnail for Make Via Rule Configuration More Intuitive
New in Altium's Software
Make Via Rule Configuration More Intuitive

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

Blog
What is the Best Cloud PCB Design Software?

Not all cloud PCB tools are created equal, especially when design complexity increases. This article breaks down key differences between cloud-native and hybrid solutions, helping engineers choose the right approach for performance and scalability.

Blog
From Rework to Revenue: Digital PCB DFMA

This article explores how traditional, manual DFMA workflows lead to costly rework, delays, and poor collaboration across engineering teams. It shows how a connected, digital approach enables better data integrity, faster design cycles, and improved manufacturing outcomes.

Embedded thumbnail for Coplanar Ground Done Right: PCB Design Best Practices
How-To's
Coplanar Ground Done Right: PCB Design Best Practices

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

Embedded thumbnail for Import and Export with Modern Mechanical Models
New in Altium's Software
Import and Export with Modern Mechanical Models

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

Embedded thumbnail for How to Input Via Delay in Altium for DDR Routing
How-To's
How to Input Via Delay in Altium for DDR Routing

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

Blog
How to Choose the Right Components for Your BOM

A strong BOM can make the difference between smooth production and costly delays. Discover a practical approach to choosing components that stay available, meet compliance requirements, and keep your project on schedule.

Embedded thumbnail for Clearly Show Jumper Wires in Your Harness Designs
New in Altium's Software
Clearly Show Jumper Wires in Your Harness Designs

Support has been improved so that jumper wires connecting two cavities within the same connector are now properly shown in Layout Drawings, making the connector wiring easier to understand during documentation and review.

Blog
From Scattered Requirements to Confident Product Development

See how the Requirements Portal transforms disconnected requirements into a single, live source of truth that engineers can trust at every stage of a project! Real customer stories in the article prove it’s already helping teams cut down on rework and bring products to market faster.

Embedded thumbnail for Why Datasheet PCB Guidelines Are Often Wrong
How-To's
Why Datasheet PCB Guidelines Are Often Wrong

Watch our brand-new video where we tackle the persistent issue of outdated PCB design guidelines still found in datasheets and application notes from major semiconductor manufacturers. Drawing on viewer comments, real-world datasheet examples, and insights from industry experts, we examine why recommendations such as splitting analog and digital ground planes (an approach rooted in the 1980s) continue to circulate despite their potential to cause EMC failures, signal integrity problems, and costly redesigns.

Blog
What is the Best PCB Design Tool For Students?

Students need PCB software that’s intuitive, affordable, and useful for building real skills. This article compares the strengths and weaknesses of leading design tools, from hobbyist platforms to industry-standard software.

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Blog
From Concept to Production: A Modern Approach to Wire Harness Engineering

Discover how modern wire harness engineering is evolving to meet the growing complexity of electrified systems. This whitepaper explores best practices, intelligent automation, and ECAD-MCAD collaboration to improve efficiency and reduce errors. Download now to stay ahead in an increasingly connected world.

Blog
Transforming RF Design with Ultra HDI

Ultra-HDI technology is transforming RF design by enabling finer line widths, improved signal integrity, and more compact, high-performance boards. Our brand-new article explores its advantages over traditional methods and the benefits of integrating flexible circuits.

Blog
Boost Your PCB Testing Efficiency with Testpoint Manager

Testpoints are essential for efficient PCBA testing and debugging. Our latest whitepaper dives into testpoint optimization, fault detection, and automated testing strategies, along with a full tutorial on using Testpoint Manager in Altium Designer. Discover how to streamline your testpoint assignments and improve measurement accuracy!

Blog
Ultra HDI: It’s Not Just Buzzword

Ultra-HDI technology is transforming PCB design, enabling unprecedented miniaturization and performance. In this article, explore what sets Ultra-HDI apart from traditional HDI and how it’s shaping the future of electronics.

Blog
Cloud PCB Design: 5 Cloud Security Myths Debunked

This article addresses common misconceptions about cloud security in PCB design. It explains how modern cloud platforms, such as Altium 365, often provide superior security compared to traditional on-premises solutions. Key features like advanced infrastructure, granular access controls, and compliance with stringent regulations ensure the protection of valuable design data.

Blog
Renesas and Altium Announce Introduction of Renesas 365, Powered by Altium

Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.

Blog
DFM/DFA Requirements in Systems Engineering

Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.

Blog
Best Practices for Electronics Project Management - Part 2

Part 2 of this series covers essential project management techniques for electronics design teams. Rafał Stępień discusses effective data organization, revision control, and collaboration strategies to improve efficiency and minimize errors.

Blog
Rigid-Flex PCBs: Understanding the Pros, Cons, and Fabrication Considerations

Read our new article which discusses the advantages of rigid-flex PCBs, such as space-saving designs and enhanced reliability, while also addressing potential challenges in their fabrication. It provides essential design and manufacturing tips to help engineers effectively implement this technology in various applications.

Blog
The Role of Automation & Robotics in Wire Harness Assembly

Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.

Blog
Wiring for the Final Frontier: A Guide to Space-Grade Harness Design

Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.

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Embedded thumbnail for Unlock New Design Possibilities with Wire Bonding - Recording Preview
New in Altium Designer 25
Unlock New Design Possibilities with Wire Bonding - Recording Preview

Explore how Altium Designer simplifies advanced PCB designs like 3D stacked die in cavity. From routing bond wires to generating complete project documentation, this on-demand webinar has you covered. Full recording is here: Wire Bonding Webinar Recording.

Embedded thumbnail for Industrial Design Meets Electronics Engineering
Altium Stories
Industrial Design Meets Electronics Engineering

Discover how engineering disciplines come together to create remarkable products with Altium’s powerful tools. Electronics, mechanical, and industrial design merge their expertise, as D+I, part of Capgemini, showcases their refined design process. See how diverse skillsets and Altium's solutions drive innovation.

Embedded thumbnail for Simplify Analysis with Power Analyzer by Keysight
How-To's
Simplify Analysis with Power Analyzer by Keysight

The Power Analyzer by Keysight in Altium Designer simplifies power design by enabling detailed analysis of power nets and PDNs. This demo highlights how to identify and resolve issues like voltage drops to ensure reliable power delivery, all within the Altium environment.

Embedded thumbnail for Perfect your high-speed routing with Dynamic Phase Matching!
New in Altium Designer 25
Perfect your high-speed routing with Dynamic Phase Matching!

Struggling with phase matching in your high-speed projects? Learn how Altium Designer 25’s Dynamic Phase Matching feature ensures precise signal integrity and simplifies high-speed design.

Embedded thumbnail for Hardware Design Masterclass Wrocław 2024 - Autumn Edition
HDM Wrocław
Hardware Design Masterclass Wrocław 2024 - Autumn Edition

Altium participated in the Hardware Design Masterclass Wrocław 2024, organized by Rafał Stępień. Representing Altium, Samer Aldhaher delivered a presentation on Wire Bonding in Altium Designer. This slideshow highlights key moments from the event.

Embedded thumbnail for Pi Filter Formulas and Simulation Deep Dive
How-To's
Pi Filter Formulas and Simulation Deep Dive

Learn the essentials of Pi filters, including how to size, design, and simulate them in Altium Designer. Host Zach Peterson explains the design equations for Pi filters, discusses online tools for accurate component selection, and demonstrates real-time simulations in Altium Designer to visualize the effects of impedance mismatches.

Embedded thumbnail for True Donut Pad Shapes
New in Altium Designer 25
True Donut Pad Shapes

Check out our brand-new short video showcasing an exciting improvement in the PCB design process. Altium Designer 25 now supports true donut pad shapes, enhancing both your routing and performance.

Embedded thumbnail for Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview
New in Altium Designer 25
Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview

Discover the new features in Altium Designer 25! This webinar recording highlights the Signal Analyzer by Keysight, advanced Wire Bonding capabilities, multi-board design enhancements, and more, showcasing how these tools can transform your PCB design process.

Embedded thumbnail for Dynamic Phase Matching and Tuning for Differential Pairs
New in Altium Designer 25
Dynamic Phase Matching and Tuning for Differential Pairs

Explore how dynamic phase matching for differential pairs works with the improved match length rule in Altium Designer. Learn key techniques in this quick tutorial!

Embedded thumbnail for Obey Rules and Auto-Shrinking Features
New in Altium Designer 25
Obey Rules and Auto-Shrinking Features

Discover how Altium Designer 25's Obey Rules and Auto-Shrinking features streamline routing, ensuring speed and precision while maintaining adherence to all design constraints.

Embedded thumbnail for Quickstart Guide: Single Layer PCB Design with Altium Designer 25
New in Altium Designer 25
Quickstart Guide: Single Layer PCB Design with Altium Designer 25

Transform your designs with the new Single Layer PCB Design feature in Altium Designer 25! Whether you're working on Rigid-Flex projects or creating simple, space-saving boards, this tool makes the process faster, smarter, and more efficient. Watch our guide now and unlock your next big innovation.

Embedded thumbnail for How to Design Bending Regions in Flex PCBs
How-To's
How to Design Bending Regions in Flex PCBs

Watch our latest video on bending regions in flex PCBs! This step-by-step guide will show you how to configure stack-ups, distinguish between flex and rigid regions, and troubleshoot common issues in 3D views.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection

The final part of the LDO Regulator Essentials series focuses on voltage ripple rejection in Low Dropout Regulators (LDOs). Our host Rafał Stępień explains how LDOs clean up DC supply waves, ensuring stable performance in power systems. This episode provides practical insights for optimizing sensitive designs.

Embedded thumbnail for Explore Routing Improvements in Altium Designer 25
New in Altium Designer 25
Explore Routing Improvements in Altium Designer 25

Discover Routing Improvements in Altium Designer 25. Learn about Dynamic Phase Matching, True Donut Pad Shape, and more in our latest video showcasing the powerful enhancements in our newest release.

Embedded thumbnail for Wire Bonding Shorts: Die Footprints
New in Altium Designer 25
Wire Bonding Shorts: Die Footprints

Check our new short video where Samer Aldhaher demonstrates the Wire Bonding feature in Altium Designer 25, including die-to-die and die-to-copper connections, multiple wire bonds, and pad rotation techniques.

Embedded thumbnail for Altium Designer 25: Collaboration at its Finest
New in Altium Designer 25
Altium Designer 25: Collaboration at its Finest

Altium Designer 25 focuses on enhancing collaboration for engineering teams with new tools like the SI Analyzer by Keysight, updated PCB CoDesign, MCAD and Ansys CoDesigners, and improved Simulation modules. This release also introduces Wire Bonding, Single Layer PCB, and performance upgrades for optimized PCB design workflows. Check our overview video about all the improvements in this release.

Tag
Integrating Requirements June 2025 Webinar
On-Demand Webinar Mag 28, 2025
Integrating Requirements into Your PCB Design Workflow
Join our webinar where you will learn about integrated requirements tools who can help you eliminate late-stage design changes, AI support through system requirements and integration of design requirements directly in PCB Design. Don't miss it, register now!
Streamlining Team Collaboration
On-Demand Webinar Apr 17, 2025
Streamlining Team Collaboration in Industrial PCB Projects
Join us for our upcoming webinar to discover how Altium Designer and Altium 365 can transform your team’s collaboration and take your PCB design projects to the next level. Attend for a chance to win free access to the Altium 365 Training Bundle.
PCB CoDesign Webinar
On-Demand Webinar Gen 24, 2024
Discover How Altium Designer 24 Revolutionizes Team Dynamics in PCB Design
Expand your collaboration skills and stay ahead of the curve with PCB CoDesign. Design teams often grapple with prolonged design cycles and coordination issues, leading to delays and inefficiencies. In the current landscape, design processes are hindered by fragmented collaboration, resulting in increased layout times and difficulties in synchronizing design updates.