News & Updates

Our new video tackles common questions about capacitor placement on a PCB. Expert Zach Peterson explains why placement is often less critical on multilayer boards with well-designed power and ground planes and shares the key insights most application notes leave out.

Watch the video where you can find how Proper Voltage centralized communication, synchronized ECAD–MCAD development, and gained early insight into supply chain risks using Altium’s connected design platform.

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

We have expanded mechanical integration by adding support for SOLIDWORKS 2024 and SOLIDWORKS 2025 part models when importing 3D bodies into the design environment. This enhancement allows designers to work with the latest mechanical models created in SOLIDWORKS without the need for additional conversions or workarounds.

In this video, we tackle a real viewer question about DDR3 routing across multiple PCB layers and show how via delay can silently eat into your skew margin before you’ve even finished routing, using Altium’s default 10-layer stackup as a reference.

Support has been improved so that jumper wires connecting two cavities within the same connector are now properly shown in Layout Drawings, making the connector wiring easier to understand during documentation and review.

Watch our brand-new video where we tackle the persistent issue of outdated PCB design guidelines still found in datasheets and application notes from major semiconductor manufacturers. Drawing on viewer comments, real-world datasheet examples, and insights from industry experts, we examine why recommendations such as splitting analog and digital ground planes (an approach rooted in the 1980s) continue to circulate despite their potential to cause EMC failures, signal integrity problems, and costly redesigns.

The "Update From Libraries" feature has been enhanced to provide broader support for harness-related objects across both Wiring Diagrams and Layout Drawings. With this expansion, a wider range of harness components such as connectors, wires, splices, and associated attributes can now be synchronized directly with their corresponding library definitions.

Discover how to set up flex and rigid-flex PCB materials in Altium with the Layer Stack Manager. In this tutorial, you’ll follow the key steps for defining polyimide cores, adhesive layers, coverlay, and stiffeners helping you build accurate, production-ready rigid-flex PCB designs.

Discover our latest customer success story and see how Benchmark streamlined hardware development using the Altium Platform. By leveraging a unified environment with real-time data, synchronized ECAD-MCAD workflows, and built-in collaboration tools, their engineering teams eliminated manual handoffs, improved cross-domain visibility, and accelerated project delivery while staying perfectly aligned.

Explore our detailed design review of a custom ESP32-S3 PCB. This four-layer board is built around the ESP32-S3 microcontroller chip (not the standard module) and includes an integrated LiPo charging circuit, USB-C with data line protection, NCP voltage regulators, and a ceramic chip antenna with a properly tuned impedance matching network.