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Embedded thumbnail for Tools for Efficient Selection
How to work with Selection
Tools for Efficient Selection

Efficient selection tools can make a difference in how long and how clean your design can be. Learn how to utilize the Edit Select Menu tools in Altium Designer to take control over your layout.

Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

Embedded thumbnail for Tools for Easily Selecting Objects in the PCB
How to work with Selection
Tools for Easily Selecting Objects in the PCB

Explore more than basic mouse movements by taking a look at the tools that Altium Designer has to offer for making selecting and moving objects in the PCB an easy task. This will increase your productivity and allow you to spend more time designing

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

Embedded thumbnail for How to Work with The Polygon Manager
Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
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Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

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Blog
Say Goodbye to EDA Software Vendor Lock

Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.

Blog
The Ultimate Introduction to High-Speed Signal Integrity for PCB Designers

High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.

Blog
Multi-Board PCB Signal Integrity: A Complete Guide

Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.

Blog
Multi-CAD Support Will Be a Game Changer for Electronics Design Teams

Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.

Blog
Pi.MX8 Project - Board Layout Part 4

We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.

Blog
How Thermoformed Flex PCB’s are Designed and Fabricated

Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.

Blog
Boost Connection Integrity and Design Efficiency with Wire Bonding

Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.

Blog
How High Frequency SMD Passives Work in a PCB Layout

High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.

Blog
Essential DFM Tips for Aerospace Projects

Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.

Altium 365 New Website
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Altium 365 now has its own website!

Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
 

Blog
Altium Designer: Leading the Charge in PCB Design Innovation

In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.

Blog
What Is Solder Mask Expansion and Which Value Should You Use?

Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.

Blog
Pi.MX8 Project - Board Layout Part 3

We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.

Blog
Mastering Blind and Buried Vias

Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.

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NEW
Embedded thumbnail for Coming Soon: Design Rule Sets
New in Altium's Software
Coming Soon: Design Rule Sets

Soon, PCB design rules in Altium will be organized into reusable Rule Sets within the PCB Rules and Constraints Editor. These rule sets can be created, duplicated, enabled or disabled, renamed, deleted, imported, and exported, making it easier to manage rules for specific interfaces, manufacturing requirements, or unique design constraints.

NEW
Embedded thumbnail for Decoupling Capacitor Routing: When to Use Vias vs Traces
How-To's
Decoupling Capacitor Routing: When to Use Vias vs Traces

Check out this video, a follow-up to the decoupling capacitor placement series, exploring the inductance tradeoffs between trace routing and via connections. Using real component examples from an Ethernet switch design in Altium, the video demonstrates how different routing choices can impact overall performance.

Embedded thumbnail for Coming Soon: Interactive Dynamic Phase Tuning
New in Altium's Software
Coming Soon: Interactive Dynamic Phase Tuning

The Interactive Length Tuning tool allows you to manually tune a single net in a differential pair while maintaining equal pair length and phase alignment across the entire route. This enables more efficient differential signal transmission, greater control during manual tuning, and faster pattern creation within defined phase tolerance limits.

Embedded thumbnail for AI PCB Layout vs. Human Design: The Honest Truth
How-To's
AI PCB Layout vs. Human Design: The Honest Truth

The question is: Can AI really route a PCB as well as an experienced human designer? In this video, we set out to find the answer. Our expert, Zach Peterson, puts it to the test in a side-by-side layout review. The challenge is based on a LinkedIn post where viewers had to guess which board was AI-generated and which was designed by a human.

Embedded thumbnail for Improve Your 3D Wire Bonding Workflow
New in Altium's Software
Improve Your 3D Wire Bonding Workflow

Check out the video where we showcase enhanced wire bonding features, including precise bond wire shape definition, improved clearance checking, streamlined import and export workflows, and efficient management of wire bonding objects.

Embedded thumbnail for Customize Your ODB++ Output for Each Partner
New in Altium's Software
Customize Your ODB++ Output for Each Partner

You can now precisely control what design data is included in your ODB++ outputs for different manufacturing recipients. Choose which signal layers to export, decide how the netlist is handled (included, disabled, or neutralized), and control whether component data is removed or shared without properties.

Embedded thumbnail for Proper Voltage Built a Universal Battery Platform with Altium
Altium Stories
Proper Voltage Built a Universal Battery Platform with Altium

Watch our latest customer success story to see how Proper Voltage partnered with Altium to accelerate high-power battery development for next-generation robotics. With our software, they streamlined collaboration, sped up design reviews, improved sourcing visibility, and reduced risk.

Embedded thumbnail for Improve Readability with Custom Pin Spacing
New in Altium's Software
Improve Readability with Custom Pin Spacing

You can now control the vertical spacing of a pin’s designator and name with a custom margin. This setting can be applied globally via Schematic Preferences or adjusted individually in the Pin properties.

Embedded thumbnail for Does Decoupling Capacitor Placement Actually Matter?
How-To's
Does Decoupling Capacitor Placement Actually Matter?

Our new video tackles common questions about capacitor placement on a PCB. Expert Zach Peterson explains why placement is often less critical on multilayer boards with well-designed power and ground planes and shares the key insights most application notes leave out.

Embedded thumbnail for Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium
Altium Stories
Teaching Power to Think - How Proper Voltage Accelerates Innovation with Altium

Watch the video where you can find how Proper Voltage centralized communication, synchronized ECAD–MCAD development, and gained early insight into supply chain risks using Altium’s connected design platform.

Embedded thumbnail for  Detect Z-Axis Clearance Issues Earlier
New in Altium's Software
Detect Z-Axis Clearance Issues Earlier

The Z-axis clearance rule enables accurate verification of minimum interlayer copper spacing. It supports targeted constraints between net classes, differential pairs, and schematic parameter directives for advanced rule definition.

Embedded thumbnail for Fix Inconsistent Part Parameters in Your PCB Schematic
How-To's
Fix Inconsistent Part Parameters in Your PCB Schematic

Watch our latest video to learn what parameterization really means, why getting the manufacturer name and part number right is essential, and how to quickly identify inconsistencies across your schematic components using Altium’s Parameter Manager tool.

Embedded thumbnail for Create IPC-Aligned Footprints with Less Effort
New in Altium's Software
Create IPC-Aligned Footprints with Less Effort

The default value for the Solder Mask Expansion rule has been updated to improve consistency across design environments. In both PCB documents and rule-driven solder mask expansion within PCB library documents, the default setting is now 0 mil, replacing the previous default of 4 mil.

Embedded thumbnail for Via Dispersion: Why Propagation Delay Changes with Frequency
How-To's
Via Dispersion: Why Propagation Delay Changes with Frequency

Explore the concept of via dispersion and how it impacts propagation delay across frequencies. This tutorial walks through the math behind extracting delay from insertion loss and return loss S-parameters and explains why results can vary depending on your operating range.

Embedded thumbnail for Make Via Rule Configuration More Intuitive
New in Altium's Software
Make Via Rule Configuration More Intuitive

Set precise control over your routing via styles with new rule settings in the Physical View. Define minimum, maximum, and preferred values for both diameter and hole size, and easily switch between constraint ranges or template-based definitions for faster, more flexible design.

Embedded thumbnail for Coplanar Ground Done Right: PCB Design Best Practices
How-To's
Coplanar Ground Done Right: PCB Design Best Practices

When is coplanar ground actually useful and when does it provide no benefit at all? If you’ve ever wondered about this, check out our brand-new video where we tackle one of the most common questions in PCB design.

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