News & Updates

Ever since I started using Github and Google Docs, I fell in love with revision control. Instead of keeping multiple copies of essential files and time-stamping every revision, revision tracking information gets stored alongside the file. This environment works great for code, spreadsheets, and documents, and Altium brings these same features into PCB design.

With advances in industrial automation, automotive technology, remote sensing, and much more, image processing is taking center stage in many embedded systems. Image processing with older video systems was difficult or impossible due to the low quality of many imaging systems with perpetual uptime. Newer systems provide video with higher frame rates and higher resolution images, but these systems still needed to connect directly to a computer in order to enable any useful image processing applications.

EDA tools have come a long way since the advent of personal computing. Now advanced routing features like auto-routers, interactive routing, length tuning, and pin-swapping are helping designers stay productive, especially as device and trace densities increase. Routing is normally restricted to 45-degree or right-angle turns with typical layout and routing tools, but more advanced PCB design software allows users to route at any angle they like. So which routing style should you use, and what are the advantages of any angle routing?

If you do a search for “Hardware-in-the-Loop” testing, you will frequently find examples of complex, real-time systems. Article from National Instruments, for example, gives a nice explanation and background on what hardware-in-the-loop (HIL) is, and provides an example of testing electronic control units within an automobile. In this article, we will be focusing on a smaller, more bite-sized version of HIL testing concepts.

No one wants to do a board respin because of inaccurate or incomplete manufacturing outputs confusing design intent. This webinar covers the information needed for PCB Manufacturing and Assembly, as well as, a simple way to communicate and collaborate with manufacturing.

If you’re an antenna designer, then you’re likely familiar with all aspects of near-field vs. far-field radiation. Given the litany of radiated EMI problems that cause noise within and outside of an electronic device, one might suddenly realize their new product is acting like a strong antenna. To understand how EMI affects your circuits, it helps to understand exactly how near-field vs. far-field radiation from your PCB affects your ability to pass EMC checks and affects your circuits.

How often have you started down the PCB development process and been bogged down by time-consuming administrative tasks? Once you get ready for production, working through a design review and correcting any DFM problems takes its own share of time. With hastening product development timelines and shorter product life cycles comes the pressure to increase PCB prototype iteration speed without sacrificing cost or quality. So how can PCB design teams keep their development schedules on track without sacrificing quality or risking a failed prototyping run?

A journey of a thousand miles begins with a single step, or so the aphorism goes. I think it’s worth noting that the first step is the most difficult to take. Analysis Paralysis is especially true when dealing with a new software package, including the recent release of Concord Pro. The recent version has brought with it a deluge of interest and enthusiasm in such a phenomenal tool. But I must say, Altium hit this one out of the park.

When you need to pass EMC certification and your new product is being crippled by a mysterious source of EMI, you’ll probably start considering a complete product redesign. Your stackup, trace geometry, and component arrangement are good places to start, but there might be more you can do to suppress specific sources of EMI. There are many different types of EMI filters that you can easily place in your design, and that will help suppress EMI in a variety of frequency ranges.

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants.

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.

Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.

A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.

Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.

The problems you can experience with components and libraries are endless. These problems are the most significant source of design issues and the biggest reason behind respins, costing companies untold amounts of lost profit annually.
If you want to have a better understanding of how to use Altium 365 to maintain a strong and centralized library that is free of problems and headaches, you may want to consider attending this lecture.

As much as we would like to build every high speed PCB perfectly, with ideal SI/PI/EMI characteristics, it isn’t always possible due to many practical constraints. Sometimes a stackup can be “good enough,” even for a high-speed PCB. This always comes from the need to balance engineering constraints, functional requirements, and the need to ensure signal and power integrity in a high-speed design, and finally to ensure compliance with EMC requirements.

Involving the whole team that will bring a product to completion early on in the development cycle is vital to efficient development. Design reviews with all the relevant parties are critical at each step of the design process, starting with high-level component selection, then through the schematic capture and PCB layout stages.

Ergonomics and convenience are important issues when designing a printed circuit board and the device as a whole. A lot of Altium Designer tools are aimed at solving them. These include Countersink and Counterbore holes, which allow the use of various types of screws in the mounting holes of the board.

The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. When filling a project with data, a user creates new files, modifies outdated files that have become irrelevant. Managing project data is a separate task, especially for large developments where several participants with different specializations are involved in the process.

High-speed PCBs often require tuning groups of tracks, both single and differential. Altium Designer includes powerful tools that allow you to solve such tasks quickly and with high quality. Study this document and achieve the desired result even faster.

There is one confusion related to impedance matching that comes up again and again, and it appears to be a fundamental confusion between reflection and power delivery. This leads to an apparent contradiction that arises when we try to generalize power delivery to wave reflection, despite the fact that the two were not meant to be related.

Routing is one of the most time-consuming stages of PCB design. Altium Designer has a large set of tools that allow you to do it as accurately and quickly as possible. This document will help you to learn how to manage your routing effectively and use it to its fullest extent.

RF systems operate with specific impedance values across entire interconnects, including on PCBs. Not all RF components are packaged in integrated circuits with defined impedances, so impedance matching circuits and line sections are needed to ensure signal transmission between different sections of an interconnect. One of these impedance matching techniques is the quarter-wave impedance transformer, which can be implemented as a printed trace with specific impedance.

We are happy to announce that the Altium Designer 22.10 update is now available. Altium Designer 22.10 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

A staff member at a PCB manufacturer once explained to me that they thought we were having an issue with a package warping. Unfortunately, component warping can occur both in a PCB and in components. In this article, we'll give an overview of warpage in a PCB, specifically in the circuit board and in the components.

If you're designing a wireless IoT device, and you know how to calculate the link budget, you can reasonably estimate whether your signal will reach its destination and be read by the receiver. To calculate the link budget, the designer needs to know something about all other sources of gain and loss in the system. Once link budget is determined, the designer can judge whether some modification is needed in their RF signal chain.