News & Updates
On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.
There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.
If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.
In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.
The primary goal of your traces is to carry signals throughout your board without losses. To do this properly, you must familiarize yourself with the requirements for signals on the printed circuit board and how to optimize the topology of the board in terms of signal integrity. We will analyze the most popular routing cases applicable for using the Gloss and Retrace tools in Altium Designer to optimize your signal integrity.
High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.
There are some guidelines I see many designers implement as a standard practice, often without thinking about it. Some of these practices are misunderstood or implemented without best practices. Others are implemented without thinking about the potential problems. One of these is the use of tented vias, which is sometimes implemented in a PCB layout by default. Is this always the right practice?
Engineering and sourcing teams work best when BOM decisions happen with live market data in view. This article explains how integrated cost and availability insights help teams collaborate earlier and avoid redesigns driven by supply chain issues.
Poor ECAD-MCAD coordination often leads to enclosure conflicts, connector misalignment, and costly redesigns. This article shows how integrated collaboration helps teams catch manufacturability issues earlier and keep projects moving smoothly.
Ultra HDI is changing the rules of PCB design and registration tolerance is now part of the design conversation from day one. Discover how smarter spacing, stackup planning, and collaboration with fabricators can dramatically improve manufacturability and reliability.
Because ECAD formats are typically incompatible, teams often struggle with versioning, conversions, and fragmented review processes. This article breaks down how multi-CAD viewers provide a unified, read-only environment that supports structured design reviews, comments, and task assignment across disciplines.
Sharing PCB designs doesn’t have to be complicated. Check out the best online ECAD viewers that let anyone view and collaborate on designs right from a browser.
Rigid-flex PCBs help modern devices get smaller, lighter, and more compact by eliminating connectors and fitting into tight 3D spaces. This article explains how to design them properly to avoid common reliability issues.
This webinar walks through the complete post-release workflow, from generating a managed BOM to sourcing components and assembling the first prototype. It demonstrates how integrated tools streamline data enrichment, supplier selection, and guided assembly to reduce delays and errors.
BOM management is no longer just a checklist. It’s becoming a real-time engine for smarter decisions! Discover how AI, automation, and connected systems are transforming BOMs into powerful tools for navigating supply chain uncertainty.
Working across different ECAD tools can make design reviews messy and inefficient. This article shows how a multi-CAD viewer simplifies collaboration by letting teams view, comment, and manage designs in one place.
This article examines how fragmented ECAD-MCAD workflows create costly misalignments, late-stage conflicts, and inefficiencies in multiboard system design. It shows how unified, collaborative platforms enable real-time synchronization, digital twins, and cross-domain visibility to eliminate rework and streamline development.
Choosing the right PCB tool can define your entire design workflow. Discover how Altium Designer empowers professional product development, while Flux.ai keeps things simple for fast experimentation.
Rigid-flex stackups are more complex than they seem and getting them wrong early can lead to costly failures later. This article shows how smart decisions around materials, transitions, and layer structure help ensure a reliable design.
Understand how structured design reviews within Altium Agile Teams enhance visibility, traceability, and cross-team collaboration. This webinar highlights methods to detect issues early and optimize your development workflow.
Parsing long datasheets manually slows down embedded development and introduces errors. This article shows how to use a local LLM pipeline to convert datasheets into structured data that speeds up driver creation.
PCB simulation isn’t one-size-fits-all and that’s where it gets interesting! Discover the wide range of tools available, from quick circuit checks to advanced multiphysics simulations, and how they help you design with confidence.
This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.