News & Updates

Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.

There are many quality checks used to ensure a design will be manufacturable at scale and with high quality, but a lot of this can happen in the background without the designer realizing. No matter what level of testing and inspection you need to perform, it’s important to determine the basic test requirements your design must satisfy and communicate these to your manufacturer. If it’s your first time transitioning from prototyping to high-volume production, read our list of PCB testing requirements so that you’ll know what to expect.

Getting started with design rules can sometimes be a difficult task, but it doesn’t have to be. Altium Designer has added a new design rules user interface along with a new way to define rules, while not compromising past methods. Now, rules and constraints have a design-centric view rather than a rules-centric view which allows for easier visualization and is less prone to error. Watch this video to learn how you can best utilize the improved Rules 2.0 design rule interface.

Embedded computers, vision devices, DAQ modules, and much more will all need some memory, whether it’s a Flash chip or a RAM module. Normally, something like a Flash memory chip or a small eMMC module would not be used for temporary storage as the device requires constant rewrites. Instead, if you happen to need a volatile memory solution, you would go for static (SRAM) or dynamic RAM (DRAM). If you need to decide which type of memory to use in your board, keep reading to see some of the basic design guidelines for SDRAM vs. DDR memory modules.

Using a PCB ground plane in a stackup is the first step towards ensuring power and signal integrity, as well as keeping EMI low. However, there are some bad myths about ground planes that seem to persist, and I’ve seen highly experienced designers make some simple mistakes when defining grounds in their PCB layouts. If you’re interested in preventing excess emissions and ensuring signal integrity in your layout, follow these simple guidelines for implementing a PCB ground plane in your next board.

As much as we’d like, the power we supply to electronics isn’t always stable. Real power sources contain noise, they might exhibit power instability, or they dropout unexpectedly. Thankfully, we have power regulators to help prevent some of these problems. For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs.

Post-layout simulators for your PCB are very valuable tools. If you’re working through a complex design, it’s a good idea to put it through some level of simulation and analysis to evaluate the design before manufacturing. This is all easy with the cloud collaboration tools in Altium 365 and Ansys field solvers thanks to the EDB Exporter utility in Altium Designer. These existing tools in Altium Designer and any of the Ansys field solver utilities give you a simplified way to share design data, EDB files, and simulation results with anyone on your design team.

Working between the Electronic and Mechanical design domains brings unique challenges. ECAD and MCAD tools have different design objectives and have evolved down different paths, and so has the way they store and manage their design and project data. Watch this video to learn about seamless ECAD/MCAD Collaboration on the project, how to comments for other design teams and how to review, Approve or Reject design changes from your mechanical engineer.

Experienced fabricators will tell you: any design could have some hidden DFM problem that will interfere with manufacturability, quality, or yield. Making use of your design rules is just the start of preventing DFM problems, you’ll want to collaborate with your manufacturer throughout the design process if you want to spot and correct DFM problems. Within Altium Designer, there are multiple reports you can generate for your projects that will help you summarize important information on your board for a client or a manufacturer.

With modern systems running at higher frequencies, incorporating multiple wireless protocols, and interfacing with many analog sensors, advanced designs require knowledge from digital and RF design disciplines. If you’re now starting to work in the RF realm and you need to design an all-analog or mixed-signal system, RF PCB layout will need to become a new specialty. If you’re a digital designer and you’re now jumping into high-frequency analog design, keep reading to learn more about RF PCB layout and routing.

If you take a look at any guidelines for controlled impedance traces, you’ll clearly see that the trace width is calculated without any ground pour near the trace. However, most designers will state that unused areas on each PCB layer should be filled in with grounded copper pour. If you bring some ground pour near a microstrip, you’ve now formed a coplanar waveguide arrangement. So now the question becomes, how much microstrip to ground clearance do you need to ensure you’ve hit your impedance goals?

In this article, I want to briefly focus on how power supplies and regulators are different, although this should already be clear to most designers. For a power supply and for a PCB with an on-board regulator, the switching regulator layout will be a major determinant of overall system performance. Therefore, we’ll largely look at some layout guidelines for switching power supplies in terms of regulator layout.

Altium 365 is giving design teams a new way to share and manage their design data. Most users are probably aware of project-level and component-level PCB sharing features, but sharing actually extends down to the level of individual files thanks to the managed content system within Altium 365. If you’ve ever wanted a single place to store and manage all of your design data, then Altium 365 is here to help you and your team stay organized.

Power supplies are one of those systems we all tend to take for granted. Everyone’s first task in power supply design is usually to ensure the voltage and current output reach the desired level, probably followed by thermal considerations. However, due to safety issues, EMC requirements, the use of higher PWM frequencies, and the need for smaller packaging, power supply EMI should be a major design consideration. With that being said, what are the major sources of power supply EMI, and how can power supply designers keep them in check?

Designing footprints is a job most people hate. It’s tedious, time-consuming, and doesn’t result in much except, well, a footprint. Companies now realize this pain point and offering designers free, well-designed PCB footprints. Why would they spend their time doing this? In this article, we’re going to review some of the free offerings that exist within the PCB design community. Once you’re armed with this information, you will spend most of your time designing and routing boards instead of pulling your hair out creating footprints all day.

The majority of our PCB designs sit as a single PCB under our Altium Designer projects. It sometimes happens that we have a single project that requires multiple PCBs with various stuffing options, but when it happens, a lot of us tend to get stuck. How do you handle the exact change across both projects? How do you guarantee those changes to be identical? This article will review an approach to managing multiple PCB designs within a single project, ensuring your single source of truth.

The next stage in the evolution of mobile telephony is here with the roll-out of 5G. The designer looking to incorporate functionality to handle 5G signals into their circuits will face some challenging issues. So, what’s so special about 5G?

The maximum PCB trace length you can place between two components depends on multiple factors, such as signaling protocol, component specification, losses in PCB laminate, and skew. With all this in mind, let’s look at where losses accumulate along the channel.

If you’re an antenna designer, then you’re likely familiar with all aspects of near-field vs. far-field radiation. Given the litany of radiated EMI problems that cause noise within and outside of an electronic device, one might suddenly realize their new product is acting like a strong antenna. To understand how EMI affects your circuits, it helps to understand exactly how near-field vs. far-field radiation from your PCB affects your ability to pass EMC checks and affects your circuits.

How often have you started down the PCB development process and been bogged down by time-consuming administrative tasks? Once you get ready for production, working through a design review and correcting any DFM problems takes its own share of time. With hastening product development timelines and shorter product life cycles comes the pressure to increase PCB prototype iteration speed without sacrificing cost or quality. So how can PCB design teams keep their development schedules on track without sacrificing quality or risking a failed prototyping run?

A journey of a thousand miles begins with a single step, or so the aphorism goes. I think it’s worth noting that the first step is the most difficult to take. Analysis Paralysis is especially true when dealing with a new software package, including the recent release of Concord Pro. The recent version has brought with it a deluge of interest and enthusiasm in such a phenomenal tool. But I must say, Altium hit this one out of the park.

When you need to pass EMC certification and your new product is being crippled by a mysterious source of EMI, you’ll probably start considering a complete product redesign. Your stackup, trace geometry, and component arrangement are good places to start, but there might be more you can do to suppress specific sources of EMI. There are many different types of EMI filters that you can easily place in your design, and that will help suppress EMI in a variety of frequency ranges.

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants.

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

The first update of Altium Designer 20.2 and Altium NEXUS Client 3.2 is now available. You can update through the Altium Designer update system ("Extensions and Updates") or download fresh builds from the Downloads section of the Altium website. Click on "Read More" to see a list of all changes in this update.

The history of engineering, both electrical and mechanical, is littered with approximations that have fallen by the wayside. These approximations worked well for a time and helped advance technology significantly over the decades. However, any model has limits on its applicability, and the typical RLCG transmission line model and frequency-independent impedance equations are no different. Copper foil roughness modeling and related transmission line impedance simulations are just one of many areas in which standard models cannot correctly treat signal behavior.

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design.