News & Updates
Now you can assess your library’s health at a glance with the Library Health dashboard, view and share your bill of materials (BOM) and view and download PDF documents, all in your web browser. We improved the existing diff and compare features, and released a new version of MCAD CoDesigner. Register for the webinar to learn more!
This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
Poor ECAD-MCAD coordination often leads to enclosure conflicts, connector misalignment, and costly redesigns. This article shows how integrated collaboration helps teams catch manufacturability issues earlier and keep projects moving smoothly.
Ultra HDI is changing the rules of PCB design and registration tolerance is now part of the design conversation from day one. Discover how smarter spacing, stackup planning, and collaboration with fabricators can dramatically improve manufacturability and reliability.
Because ECAD formats are typically incompatible, teams often struggle with versioning, conversions, and fragmented review processes. This article breaks down how multi-CAD viewers provide a unified, read-only environment that supports structured design reviews, comments, and task assignment across disciplines.
Sharing PCB designs doesn’t have to be complicated. Check out the best online ECAD viewers that let anyone view and collaborate on designs right from a browser.
Rigid-flex PCBs help modern devices get smaller, lighter, and more compact by eliminating connectors and fitting into tight 3D spaces. This article explains how to design them properly to avoid common reliability issues.
This webinar walks through the complete post-release workflow, from generating a managed BOM to sourcing components and assembling the first prototype. It demonstrates how integrated tools streamline data enrichment, supplier selection, and guided assembly to reduce delays and errors.
BOM management is no longer just a checklist. It’s becoming a real-time engine for smarter decisions! Discover how AI, automation, and connected systems are transforming BOMs into powerful tools for navigating supply chain uncertainty.
Working across different ECAD tools can make design reviews messy and inefficient. This article shows how a multi-CAD viewer simplifies collaboration by letting teams view, comment, and manage designs in one place.
This article examines how fragmented ECAD-MCAD workflows create costly misalignments, late-stage conflicts, and inefficiencies in multiboard system design. It shows how unified, collaborative platforms enable real-time synchronization, digital twins, and cross-domain visibility to eliminate rework and streamline development.
Choosing the right PCB tool can define your entire design workflow. Discover how Altium Designer empowers professional product development, while Flux.ai keeps things simple for fast experimentation.
Rigid-flex stackups are more complex than they seem and getting them wrong early can lead to costly failures later. This article shows how smart decisions around materials, transitions, and layer structure help ensure a reliable design.
Understand how structured design reviews within Altium Agile Teams enhance visibility, traceability, and cross-team collaboration. This webinar highlights methods to detect issues early and optimize your development workflow.
Parsing long datasheets manually slows down embedded development and introduces errors. This article shows how to use a local LLM pipeline to convert datasheets into structured data that speeds up driver creation.
PCB simulation isn’t one-size-fits-all and that’s where it gets interesting! Discover the wide range of tools available, from quick circuit checks to advanced multiphysics simulations, and how they help you design with confidence.
This article explores the shift from PCB-centric design to complex, system-level development where wiring and harnesses play a critical role in product performance. It highlights how unified electromechanical workflows and bi-directional ECAD–MCAD integration improve accuracy, reduce delays, and ensure reliable, production-ready designs.
Want to catch manufacturability issues before they turn into expensive delays? Discover the essential DFM tools from real-time checks to post-layout analysis that help you get your PCB right the first time.