News & Updates
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.
Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.
One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.
High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.
Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.
We are happy to announce that the Altium Designer 22.7 update is now available. Altium Designer 22.7 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Design to cost is a lofty idea that is only perfectly executed when supply and demand for components are in perfect harmony. Unfortunately, the current landscape for component sourcing makes design to cost more of a balancing act rather than an exercise in price reduction. To help designers in their efforts to balance cost, capabilities, and procurement, we created this ebook to help users understand how modern supply chain tools can help in these complex design problems.
Stubs are an important topic in high-speed PCB design, and there is a longstanding guideline that stubs should always be removed from all vias on high-speed digital interconnects. While stubs are bad for high-speed lines, they do not always need to be removed. What is more important is to predict the loss profile and frequencies, and to floorplan appropriately to try and prevent such losses.
Your flex PCB may look perfect in CAD but coverlay doesn't stay perfectly still during manufacturing. This article reveals why designing for lamination behavior is one of the most important steps in building reliable flex circuits.
As hardware development grows more collaborative, disconnected point tools can introduce data inconsistencies, traceability gaps, and costly coordination challenges. This article examines how integrated PCB design environments connect design, mechanical, supply chain, and review workflows to improve efficiency throughout the product lifecycle.
Signal integrity and power integrity are closely connected, with problems in one often affecting the other as designs become faster and more complex. This webinar explains how integrated analysis workflows help engineers evaluate PDN performance, identify potential issues early, and improve overall design quality.
Every manual handoff adds time and risk to the product development process. This article shows how modern design workflows automate routine tasks, improve data visibility, and help engineering teams focus on innovation instead of administration.
Your signal may be perfect on the PCB and fail the moment it crosses a connector. This article explores the hidden SI challenges in multi-board systems and how engineers can eliminate them before they become costly debugging sessions.
Still building BOMs the hard way? Discover how modern workflows can help you create a prototype-ready BOM faster while improving visibility into pricing, availability, and risk.
This article examines the challenges of maintaining power integrity and controlling EMI in complex multiboard systems. It provides practical strategies for managing return paths, connector transitions, and power distribution across interconnected assemblies.
Learn how Agile Teams evolves beyond traditional PCB design workflows to support connected product development. This webinar explores how centralized data, collaboration tools, and governance capabilities help teams accelerate delivery while maintaining control.
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.
Starting with a simple board today doesn't mean your next project will stay simple. Learn how Altium Designer and KiCAD compare when designs become more complex, teams get larger, and products move toward manufacturing.
Learn how Agile Teams and Duro connect design and production workflows through a unified system of record. This webinar shows how structured change management and automated data synchronization help teams reduce errors and accelerate product releases.
Agile hardware development isn’t just about working faster, it’s about working together in real time. This article explores how shared environments for ECAD, MCAD, sourcing, and requirements management eliminate handoff delays and improve decision-making across teams.
Verification becomes much easier when requirements and system performance data stay connected automatically. This article explains how reusable parameters and V&V rules help teams detect violations earlier and validate designs with greater confidence.
This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.