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Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

Embedded thumbnail for Tools for Easily Selecting Objects in the PCB
How to work with Selection
Tools for Easily Selecting Objects in the PCB

Explore more than basic mouse movements by taking a look at the tools that Altium Designer has to offer for making selecting and moving objects in the PCB an easy task. This will increase your productivity and allow you to spend more time designing

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

Embedded thumbnail for How to Work with The Polygon Manager
Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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The Skin Effect and EM Fields
Blog
The Skin Effect, Current Density, and the Electromagnetic Field

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

Packaging for your PCBAs
Blog
What You Need for PCB Packaging and Shipping

When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.

PCB Output files
Blog
How to Make PCB Gerber Files in Altium Designer Step-by-Step

Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.

Teardrops on Differential Pairs?
Blog
Should You Place Teardrops on Differential Pairs?

One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.

Broken PCB
Blog
The High-Reliability PCBA Design and Test Challenge

High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.

Where to place AC Caps on PCIe Lanes
Blog
AC Coupling Capacitors in PCIe Routing

Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.

Tuning dialog
Blog
Altium Designer 22.7 Update

We are happy to announce that the Altium Designer 22.7 update is now available. Altium Designer 22.7 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

The Positive Impact of Supply Chain Visibility on Design to Cost
Blog
The Positive Impact of Supply Chain Visibility on Design to Cost

Design to cost is a lofty idea that is only perfectly executed when supply and demand for components are in perfect harmony. Unfortunately, the current landscape for component sourcing makes design to cost more of a balancing act rather than an exercise in price reduction. To help designers in their efforts to balance cost, capabilities, and procurement, we created this ebook to help users understand how modern supply chain tools can help in these complex design problems.

Evaluating Stubs on PCIe Lanes
Blog
A Brief Study of Stubs on a PCIe Connector

Stubs are an important topic in high-speed PCB design, and there is a longstanding guideline that stubs should always be removed from all vias on high-speed digital interconnects. While stubs are bad for high-speed lines, they do not always need to be removed. What is more important is to predict the loss profile and frequencies, and to floorplan appropriately to try and prevent such losses.

Surface Layer DFM and Cleanup
Blog
PCB Layout Cleanup Before Manufacturing

Once you finish your placement and routing in your PCB layout, it can be tempting to wrap up the layout and send everything in directly to manufacturing. The reality is that the board may still need some work before it is considered finished. The cleanup you perform at the final stage of PCB layout will help you catch any outstanding errors that can't be programmed into your DRC engine, and it gives you a chance to add any outstanding details to the surface layers.

Low Cost and Professionally Built LED Panel
Blog
Insulated Metal Substrates: Building an LED Panel

In this project we’ll be building a moderate sized LED panel on insulated metal substrate (IMS). This light panel has three different white balance High CRI LED types on it, warm, neutral and cool. By changing the brightness of the different white balances, the light from the panel can be adjusted to match other lighting, making it perfect for film use - but also creating perfect lighting for electronics work. As with all my projects, this LED panel is open source, you can find the Altium project files over on my GitHub released under the permissive MIT License.

DFM For Your Materials
Blog
DFM in PCB Material Selection

Every design should begin with selecting the materials that will appear in the PCB stackup, as well as arranging layers in the stackup to support layout and routing. This section of our PCB manufacturing andc DFM crash course focuses on selecting the right materials for your PCB design. Materials should be selected given the particular design requirements outlined in your specifications.

PCB Layout for an BGA
Blog
How to Start an FPGA PCB Layout For Your Embedded System

FPGAs come in quad or BGA packages that can be difficult to floorplan, especially with the high number of I/Os often implemented in these components. FPGAs offer a lot of advantages in terms of their reconfigurability, but they can require a lot of effort to layout and route without headaches. If you’ve never worked with an FPGA in your PCB layout, we have some guidelines that can help you get started.

2-port VNA on a 3-port Network
Blog
How to Get 3-port S-parameters From a 2-port VNA Measurement

S-parameters are fundamental quantities in signal integrity, and an ability to understand them from measurement or analysis is very important. If you have a 3-port network, like a power divider or circulator, it may appear that you must use a 3-port VNA to measure these S-parameters. It is always acceptable to measure between two ports, but you need to know what exactly it is you are measuring. In this article, we’ll look at the relationship between the true 3-port S-parameters with a 2-port measurement.

Fab and Assembly Crash Course
Blog
A Day in the Life of the PCB Manufacturing Process

Before implementing design for manufacturing, it is important to understand the underlying process behind producing a physical PCB. Regardless of the various technologies present in each facility, a large majority of industry-leading manufacturers follow a specific set of steps to turn your design from a drawing in a CAD application into a physical board. In this article, we'll cover the basics that designers need to know as part of our crash course series on PCB manufacturing.

What Are the Main Skew Sources in a PCB?
Blog
Addressing Skew Sources in High Speed PCBs

If you compile a list of skew sources, you'll see that fiber weave-induced skew is only one entry on a long list of skew sources. We'll look at this list of possible skew sources below, and we'll see how they affect the operation of your PCB. From the list below, we'll see that some of these issues with skew are not simply solved by paying attention to the fiber weave construction in a PCB substrate.

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Embedded thumbnail for EMI Solutions for Six-Layer PCB Stackups: A PCB Designer's Guide
How-To's
EMI Solutions for Six-Layer PCB Stackups: A PCB Designer's Guide

In our brand new video, our host Zach Peterson explores essential EMI solutions for six-layer PCB stackups, ensuring your designs achieve peak performance and reliability. Stay tuned as he delves into common issues, practical tips, and a detailed Altium Designer example to help you optimize your PCB designs.

Embedded thumbnail for Elevate Your Design Skills: Tips & Tricks for Success - Recording Preview
New in Altium Designer 24
Elevate Your Design Skills: Tips & Tricks for Success - Recording Preview

Unlock essential PCB design tips and tricks in our latest webinar recording. Learn how to streamline your workflow, tackle common challenges, and boost your productivity with Altium Designer. Check the recording here: COM August Webinar.

Embedded thumbnail for Finding Alternate Microcontroller Units (MCUs): Alternate Parts Series: Pt. 4
Octopart
Finding Alternate Microcontroller Units (MCUs): Alternate Parts Series: Pt. 4

Join Phil Salmony in the next part of our series dedicated to navigating the complexities of component substitutions. In this chapter, we'll demonstrate how to use Octopart to find suitable alternate microcontroller units (MCUs). Octopart will guide you in narrowing down critical parameters, helping you select the right component for your specific application.

Embedded thumbnail for Kickstart Your Rigid-Flex Journey: Part I - Introduction to Our Walkthrough Project
Kickstart Your Rigid-Flex Journey
Kickstart Your Rigid-Flex Journey: Part I - Introduction to Our Walkthrough Project

Join Piet Callemeyn in our new 4-part series on Rigid-Flex technology! Discover the full design process, from theory to final integration—perfect for all tech enthusiasts! Catch the premiere episode where our host breaks down the theory, use cases, and stackups of Rigid-Flex technology.

Embedded thumbnail for Achieve Perfect Signal Integrity: Introducing SI Analyzer by Keysight
New in Altium Designer 24
Achieve Perfect Signal Integrity: Introducing SI Analyzer by Keysight

The new SI Analyzer by Keysight lets you run signal integrity simulations directly in Altium Designer. Designed for speed and simplicity, it features an intuitive interface and provides helpful tips for a seamless experience. Learn more in our new introduction video about this feature.

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Altium Stories
Altium's Role in Accelerating Muddy Machines' Farming Robots

Is Altium Designer and Altium 365 can help in a food production industry? The answer is YES! Check how our software helps Muddy Machines be more efficient in a farming robots development process.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part III: Stability Analysis
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part III: Stability Analysis

Join us for the third installment of our LDO Regulator Essentials series with Rafał Stępień. In this session, we'll dive into stability analysis using AC sweep simulations and explore how to address instabilities or phase and frequency response.

Embedded thumbnail for Import Component Footprints Faster with Altium Designer. Part III: Supply Chain Intelligence
Import Component Footprints Faster with Altium Designer
Import Component Footprints Faster with Altium Designer. Part III: Supply Chain Intelligence

Discover how to leverage supply chain intelligence in Altium Designer! Piet Callemeyn demonstrates enhancing Manufacturer Part Search with real-time data on component availability and pricing in the last chapter of the series about component creation.

Embedded thumbnail for Robotic Harvest: Securing Our Food Future
Altium Stories
Robotic Harvest: Securing Our Food Future

See how Altium's PCB design software, including Multi-board System Design and Harness Design capabilities, supports Muddy Machines, a company building autonomous robots for use in the agriculture industry. This video demonstrates the vital role of technology in creating resilient and efficient agricultural practices for the future.

Embedded thumbnail for Finding Alternate Field-Effect Transistors: Alternate Parts Series: Pt. 3
Octopart
Finding Alternate Field-Effect Transistors: Alternate Parts Series: Pt. 3

In Part 3 of "Expert Insights on Alternative Parts" series, Phil Salmony will demonstrate how Octopart identifies suitable alternative field-effect transistors (FETs). Octopart assists in narrowing down parameters to select the right component for any application. Learn to navigate Octopart's search and filtering tools to choose the best MOSFETs for your specific application.

Embedded thumbnail for Stay Ahead of the Curve: A Half-Year Review of Altium Designer Improvements -  Recording Preview
New in Altium Designer 24
Stay Ahead of the Curve: A Half-Year Review of Altium Designer Improvements - Recording Preview

In the last six months, we have implemented significant enhancements in Schematic Capture, PCB Design, and Harness Design in Altium Designer 24. Check out our webinar recording to learn how these new capabilities can keep you ahead in the electronics industry. You can find it here: July COM Webinar Recording

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Altium Stories
How Skeleton Technologies Uses Altium Solutions

Explore how Skeleton Technologies is transforming industries with their innovative supercapacitors made from “Curved Graphene” materials. These advancements are not only powering AI data centers and stabilizing electrical grids but are also unlocking new energy opportunities and driving progress towards a net-zero future.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part II: Voltage Drop and Regulation
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part II: Voltage Drop and Regulation

We are returning to our LDO Regulator Essentials series. In this installment, we will focus on understanding the required dropout voltage, detecting when the regulator is out of regulation, and analyzing the performance of the LDO under higher current conditions.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part I: Basics
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part I: Basics

We invite you to join us for a new video series on LDO (Low Dropout) Regulators. In this series, we will cover everything you need to know about LDO regulators, from fundamental theory to practical implementation. In the first video, we will begin with an in-depth chapter on the theory behind these devices and their implementation in Altium Designer.

Embedded thumbnail for Wearable Design Project - Part VII: PCB Layout part III
Wearable Design Project
Wearable Design Project - Part VII: PCB Layout part III

Check out the final installment of the video series on the Wearable Design Project. In this video, you will learn how to set the rigid and flex parts of the design, modify the board for the project, and complete the PCB routing. For a deeper dive into this project, you can find it on our Altium Community Workspace.

Embedded thumbnail for Optimize Connections and PCB Design with Wire Bonding
New in Altium Designer 24
Optimize Connections and PCB Design with Wire Bonding

Experience our new wire bonding feature, designed to enhance connection integrity and improve PCB design efficiency. One of the main capabilities includes support for chip-up wire bonding configurations and easy validation of bond wiring in 3D view. Don’t miss this opportunity—participate in our Beta Program and be among the first engineers to explore this impressive feature.

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