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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

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Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

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Blog
Signal Integrity Principles based on Altium Designer 24

Check out this article where Rafał Stępień dives into the essentials of maintaining signal integrity in high-speed digital systems. Discover key techniques like controlling signal reflections, reducing crosstalk, and designing differential pairs in Altium Designer 24 to ensure reliable and efficient PCB performance.

RSP Launch Cover
Blog
Launch of Requirements & Systems Portal in Altium 365

The Requirements & Systems Portal is now live in Altium 365! Engineers can write, manage, and verify requirements within the Altium 365 workspace. You can link your requirements directly to schematics and PCB designs to ensure all engineers are working with the latest data. Request access today!

Blog
Favorite Tools for BOM Review

Check out our article, where Lawrence Romine shares his top tools for conducting efficient Bill of Materials (BOM) reviews in PCB design. It highlights key features in Altium 365, Octopart, and ActiveBOM that help engineers avoid unsourceable components and streamline procurement.

Blog
Simple Strategies to Reach 10% PCB Cost Reduction

Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.

Blog
Say Goodbye to EDA Software Vendor Lock

Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.

Blog
The Ultimate Introduction to High-Speed Signal Integrity for PCB Designers

High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.

Blog
Multi-Board PCB Signal Integrity: A Complete Guide

Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.

Blog
Multi-CAD Support Will Be a Game Changer for Electronics Design Teams

Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.

Blog
Pi.MX8 Project - Board Layout Part 4

We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.

Blog
How Thermoformed Flex PCB’s are Designed and Fabricated

Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.

Blog
Boost Connection Integrity and Design Efficiency with Wire Bonding

Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.

Blog
How High Frequency SMD Passives Work in a PCB Layout

High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.

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Embedded thumbnail for Hardware Design Masterclass Wrocław 2024 - Autumn Edition
HDM Wrocław
Hardware Design Masterclass Wrocław 2024 - Autumn Edition

Altium participated in the Hardware Design Masterclass Wrocław 2024, organized by Rafał Stępień. Representing Altium, Samer Aldhaher delivered a presentation on Wire Bonding in Altium Designer. This slideshow highlights key moments from the event.

Embedded thumbnail for Pi Filter Formulas and Simulation Deep Dive
How-To's
Pi Filter Formulas and Simulation Deep Dive

Learn the essentials of Pi filters, including how to size, design, and simulate them in Altium Designer. Host Zach Peterson explains the design equations for Pi filters, discusses online tools for accurate component selection, and demonstrates real-time simulations in Altium Designer to visualize the effects of impedance mismatches.

Embedded thumbnail for True Donut Pad Shapes
New in Altium Designer 25
True Donut Pad Shapes

Check out our brand-new short video showcasing an exciting improvement in the PCB design process. Altium Designer 25 now supports true donut pad shapes, enhancing both your routing and performance.

Embedded thumbnail for Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview
New in Altium Designer 25
Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview

Discover the new features in Altium Designer 25! This webinar recording highlights the Signal Analyzer by Keysight, advanced Wire Bonding capabilities, multi-board design enhancements, and more, showcasing how these tools can transform your PCB design process.

Embedded thumbnail for Dynamic Phase Matching and Tuning for Differential Pairs
New in Altium Designer 25
Dynamic Phase Matching and Tuning for Differential Pairs

Explore how dynamic phase matching for differential pairs works with the improved match length rule in Altium Designer. Learn key techniques in this quick tutorial!

Embedded thumbnail for Obey Rules and Auto-Shrinking Features
New in Altium Designer 25
Obey Rules and Auto-Shrinking Features

Discover how Altium Designer 25's Obey Rules and Auto-Shrinking features streamline routing, ensuring speed and precision while maintaining adherence to all design constraints.

Embedded thumbnail for Quickstart Guide: Single Layer PCB Design with Altium Designer 25
New in Altium Designer 25
Quickstart Guide: Single Layer PCB Design with Altium Designer 25

Transform your designs with the new Single Layer PCB Design feature in Altium Designer 25! Whether you're working on Rigid-Flex projects or creating simple, space-saving boards, this tool makes the process faster, smarter, and more efficient. Watch our guide now and unlock your next big innovation.

Embedded thumbnail for How to Design Bending Regions in Flex PCBs
How-To's
How to Design Bending Regions in Flex PCBs

Watch our latest video on bending regions in flex PCBs! This step-by-step guide will show you how to configure stack-ups, distinguish between flex and rigid regions, and troubleshoot common issues in 3D views.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection

The final part of the LDO Regulator Essentials series focuses on voltage ripple rejection in Low Dropout Regulators (LDOs). Our host Rafał Stępień explains how LDOs clean up DC supply waves, ensuring stable performance in power systems. This episode provides practical insights for optimizing sensitive designs.

Embedded thumbnail for Explore Routing Improvements in Altium Designer 25
New in Altium Designer 25
Explore Routing Improvements in Altium Designer 25

Discover Routing Improvements in Altium Designer 25. Learn about Dynamic Phase Matching, True Donut Pad Shape, and more in our latest video showcasing the powerful enhancements in our newest release.

Embedded thumbnail for Wire Bonding Shorts: Die Footprints
New in Altium Designer 25
Wire Bonding Shorts: Die Footprints

Check our new short video where Samer Aldhaher demonstrates the Wire Bonding feature in Altium Designer 25, including die-to-die and die-to-copper connections, multiple wire bonds, and pad rotation techniques.

Embedded thumbnail for Altium Designer 25: Collaboration at its Finest
New in Altium Designer 25
Altium Designer 25: Collaboration at its Finest

Altium Designer 25 focuses on enhancing collaboration for engineering teams with new tools like the SI Analyzer by Keysight, updated PCB CoDesign, MCAD and Ansys CoDesigners, and improved Simulation modules. This release also introduces Wire Bonding, Single Layer PCB, and performance upgrades for optimized PCB design workflows. Check our overview video about all the improvements in this release.

Embedded thumbnail for The Fastest Ways to Run a PCB BOM Review
How-To's
The Fastest Ways to Run a PCB BOM Review

Conducting a BOM review is crucial to prevent costly delays, obsolete components, and unforeseen sourcing challenges in your PCB project. Discover powerful tools like DigiKey, Octopart, and Altium 365’s BOM portal to simplify your review process and ensure you're selecting the best parts at optimal prices.

Embedded thumbnail for Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones
Altium Stories
Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones

Quantum Systems creates advanced drones for critical aerial intelligence across industries. With Altium Designer and Altium 365, they streamline electronics engineering and enhance team collaboration. Watch how Altium software helps them innovate faster and build reliable drones for mission-critical moments.

Embedded thumbnail for Wire Bonding Shorts: 3D Stacked Die with Cavity
New in Altium Designer 25
Wire Bonding Shorts: 3D Stacked Die with Cavity

Check our short video by Samer Aldhaher on using Altium Designer’s wire bonding tool for creating 3D stacked die in cavity. Highlights advanced techniques for compact, high-performance PCB designs with 3D integrated circuits.

Embedded thumbnail for Constraint Manager Improvements in Altium Designer 25
New in Altium Designer 25
Constraint Manager Improvements in Altium Designer 25

Discover the latest in Altium Designer 25’s Constraint Manager, with updates like flexible net selection, streamlined rule management, and differential pair handling. Simplify your PCB design workflow with powerful new tools and enhancements.

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